CN1301178C - 半导体中微结构的紫外线激光烧蚀的图案化 - Google Patents

半导体中微结构的紫外线激光烧蚀的图案化 Download PDF

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Publication number
CN1301178C
CN1301178C CNB028044045A CN02804404A CN1301178C CN 1301178 C CN1301178 C CN 1301178C CN B028044045 A CNB028044045 A CN B028044045A CN 02804404 A CN02804404 A CN 02804404A CN 1301178 C CN1301178 C CN 1301178C
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CN
China
Prior art keywords
laser system
laser
output
substrate material
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028044045A
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English (en)
Chinese (zh)
Other versions
CN1527754A (zh
Inventor
B·W·贝尔德
M·J·沃尔夫
R·S·哈里斯
K·P·法蒂
L－C·邹
T·R·麦克尼尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/803,382 external-priority patent/US20020033558A1/en
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of CN1527754A publication Critical patent/CN1527754A/zh
Application granted granted Critical
Publication of CN1301178C publication Critical patent/CN1301178C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
CNB028044045A 2001-01-31 2002-01-10 半导体中微结构的紫外线激光烧蚀的图案化 Expired - Fee Related CN1301178C (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US60/256,556 2000-12-18
US26555601P 2001-01-31 2001-01-31
US60/265,556 2001-01-31
US09/803,382 2001-03-09
US09/803,382 US20020033558A1 (en) 2000-09-20 2001-03-09 UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses

Publications (2)

Publication Number Publication Date
CN1527754A CN1527754A (zh) 2004-09-08
CN1301178C true CN1301178C (zh) 2007-02-21

Family

ID=26951292

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028044045A Expired - Fee Related CN1301178C (zh) 2001-01-31 2002-01-10 半导体中微结构的紫外线激光烧蚀的图案化

Country Status (7)

Country Link
EP (1) EP1365880A4 (enExample)
JP (1) JP4634692B2 (enExample)
CN (1) CN1301178C (enExample)
CA (1) CA2436736A1 (enExample)
GB (1) GB2389811B (enExample)
TW (1) TW525240B (enExample)
WO (1) WO2002060636A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102672347A (zh) * 2011-03-10 2012-09-19 株式会社迪思科 激光加工装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6949449B2 (en) * 2003-07-11 2005-09-27 Electro Scientific Industries, Inc. Method of forming a scribe line on a ceramic substrate
US7985942B2 (en) 2004-05-28 2011-07-26 Electro Scientific Industries, Inc. Method of providing consistent quality of target material removal by lasers having different output performance characteristics
CN100591458C (zh) * 2004-09-29 2010-02-24 三菱麻铁里亚尔株式会社 激光加工方法以及激光加工装置
US20060108327A1 (en) * 2004-11-23 2006-05-25 Chng Kiong C Method of manufacturing a microstructure
DE102005042072A1 (de) * 2005-06-01 2006-12-14 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von vertikalen elektrischen Kontaktverbindungen in Halbleiterwafern
JP2007067082A (ja) * 2005-08-30 2007-03-15 Disco Abrasive Syst Ltd ウエーハの穿孔方法
DE102005042074A1 (de) 2005-08-31 2007-03-08 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von Durchkontaktierungen in Halbleiterwafern
US7767595B2 (en) * 2006-10-26 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN101041415B (zh) * 2006-11-07 2010-08-11 东南大学 硅片上制作纳米孔的方法
JP2008155274A (ja) * 2006-12-26 2008-07-10 Disco Abrasive Syst Ltd ウエーハの加工方法
KR101041140B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 방법
CN101850981A (zh) * 2010-06-23 2010-10-06 东北林业大学 一种激光烧蚀制备氧化硅纳米泡沫的方法
TW201716167A (zh) * 2011-08-18 2017-05-16 奧寶科技有限公司 用於電路之檢測/維修/再檢測系統及雷射寫入系統
CN102956239A (zh) * 2011-08-29 2013-03-06 新科实业有限公司 磁头、磁头折片组合以及磁盘驱动单元
CN103567642B (zh) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问（深圳）有限公司 蓝宝石切割装置
CN103962727B (zh) * 2013-01-28 2018-03-02 深圳市裕展精密科技有限公司 蓝宝石切割装置
US10118250B1 (en) 2017-09-15 2018-11-06 International Business Machines Corporation In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method
CN108326435B (zh) * 2017-12-29 2022-08-30 大族激光科技产业集团股份有限公司 一种模具钢的激光打标方法
CN108637472B (zh) * 2018-06-05 2023-12-08 昆山宝锦激光拼焊有限公司 一种天窗激光焊接线平台
CN108637473B (zh) * 2018-06-05 2023-12-08 昆山宝锦激光拼焊有限公司 一种天窗板一次定位焊接成型的装置
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
JP7754656B2 (ja) * 2021-08-16 2025-10-15 株式会社ディスコ ウエーハの加工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4534804A (en) * 1984-06-14 1985-08-13 International Business Machines Corporation Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer
CN1142743A (zh) * 1995-08-07 1997-02-12 三菱电机株式会社 电路底板激光加工法及其加工装置和二氧化碳激光振荡器
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
JPH11245071A (ja) * 1998-03-02 1999-09-14 Sumitomo Heavy Ind Ltd レーザ加工装置
US6032997A (en) * 1998-04-16 2000-03-07 Excimer Laser Systems Vacuum chuck
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
JP2621599B2 (ja) * 1990-07-05 1997-06-18 日本電気株式会社 コンタクトホール形成装置及び方法
US5611946A (en) * 1994-02-18 1997-03-18 New Wave Research Multi-wavelength laser system, probe station and laser cutter system using the same
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
JPH11773A (ja) * 1997-06-11 1999-01-06 Nec Corp レーザ加工装置およびその方法
JP3532100B2 (ja) * 1997-12-03 2004-05-31 日本碍子株式会社 レーザ割断方法
US6063695A (en) * 1998-11-16 2000-05-16 Taiwan Semiconductor Manufacturing Company Simplified process for the fabrication of deep clear laser marks using a photoresist mask
JP2000164535A (ja) * 1998-11-24 2000-06-16 Mitsubishi Electric Corp レーザ加工装置
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6472295B1 (en) * 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
US6255621B1 (en) * 2000-01-31 2001-07-03 International Business Machines Corporation Laser cutting method for forming magnetic recording head sliders
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
DE10026066A1 (de) * 2000-05-25 2001-11-29 Deere & Co Vorrichtung zum Umhüllen eines Rundballens

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4534804A (en) * 1984-06-14 1985-08-13 International Business Machines Corporation Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
CN1142743A (zh) * 1995-08-07 1997-02-12 三菱电机株式会社 电路底板激光加工法及其加工装置和二氧化碳激光振荡器
JPH11245071A (ja) * 1998-03-02 1999-09-14 Sumitomo Heavy Ind Ltd レーザ加工装置
US6032997A (en) * 1998-04-16 2000-03-07 Excimer Laser Systems Vacuum chuck
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102672347A (zh) * 2011-03-10 2012-09-19 株式会社迪思科 激光加工装置
CN102672347B (zh) * 2011-03-10 2015-09-23 株式会社迪思科 激光加工装置

Also Published As

Publication number Publication date
GB2389811B (en) 2004-10-27
GB2389811A (en) 2003-12-24
GB0317853D0 (en) 2003-09-03
TW525240B (en) 2003-03-21
CN1527754A (zh) 2004-09-08
CA2436736A1 (en) 2002-08-08
JP2004526575A (ja) 2004-09-02
EP1365880A1 (en) 2003-12-03
EP1365880A4 (en) 2008-04-16
JP4634692B2 (ja) 2011-02-16
WO2002060636A1 (en) 2002-08-08

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070221

Termination date: 20180110