GB2389811B - Ultraviolet laser ablative patterning of microstructures in semiconductors - Google Patents
Ultraviolet laser ablative patterning of microstructures in semiconductorsInfo
- Publication number
- GB2389811B GB2389811B GB0317853A GB0317853A GB2389811B GB 2389811 B GB2389811 B GB 2389811B GB 0317853 A GB0317853 A GB 0317853A GB 0317853 A GB0317853 A GB 0317853A GB 2389811 B GB2389811 B GB 2389811B
- Authority
- GB
- United Kingdom
- Prior art keywords
- microstructures
- semiconductors
- ultraviolet laser
- laser ablative
- ablative patterning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26555601P | 2001-01-31 | 2001-01-31 | |
US09/803,382 US20020033558A1 (en) | 2000-09-20 | 2001-03-09 | UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
PCT/US2002/000867 WO2002060636A1 (en) | 2001-01-31 | 2002-01-10 | Ultraviolet laser ablative patterning of microstructures in semiconductors |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0317853D0 GB0317853D0 (en) | 2003-09-03 |
GB2389811A GB2389811A (en) | 2003-12-24 |
GB2389811B true GB2389811B (en) | 2004-10-27 |
Family
ID=26951292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0317853A Expired - Fee Related GB2389811B (en) | 2001-01-31 | 2002-01-10 | Ultraviolet laser ablative patterning of microstructures in semiconductors |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1365880A4 (en) |
JP (1) | JP4634692B2 (en) |
CN (1) | CN1301178C (en) |
CA (1) | CA2436736A1 (en) |
GB (1) | GB2389811B (en) |
TW (1) | TW525240B (en) |
WO (1) | WO2002060636A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US6949449B2 (en) | 2003-07-11 | 2005-09-27 | Electro Scientific Industries, Inc. | Method of forming a scribe line on a ceramic substrate |
US7985942B2 (en) * | 2004-05-28 | 2011-07-26 | Electro Scientific Industries, Inc. | Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
US20060108327A1 (en) * | 2004-11-23 | 2006-05-25 | Chng Kiong C | Method of manufacturing a microstructure |
DE102005042072A1 (en) * | 2005-06-01 | 2006-12-14 | Forschungsverbund Berlin E.V. | Vertical electrical contact connections e.g. micro-vias, producing method for silicon carbide-wafer, involves laser boring of passage holes through wafer and active layers and applying antiwetting layer in area of openings of holes |
JP2007067082A (en) * | 2005-08-30 | 2007-03-15 | Disco Abrasive Syst Ltd | Perforation method of wafer |
DE102005042074A1 (en) | 2005-08-31 | 2007-03-08 | Forschungsverbund Berlin E.V. | Method for producing plated-through holes in semiconductor wafers |
US7767595B2 (en) * | 2006-10-26 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
CN101041415B (en) * | 2006-11-07 | 2010-08-11 | 东南大学 | Method for making nano hole on silicon chip |
JP2008155274A (en) * | 2006-12-26 | 2008-07-10 | Disco Abrasive Syst Ltd | Method of machining wafer |
KR101041140B1 (en) * | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | Method for cutting substrate using the same |
CN101850981A (en) * | 2010-06-23 | 2010-10-06 | 东北林业大学 | Method ablating and preparing silicon dioxide nanometer foam with laser |
JP5860219B2 (en) * | 2011-03-10 | 2016-02-16 | 株式会社ディスコ | Laser processing equipment |
TW201716167A (en) * | 2011-08-18 | 2017-05-16 | 奧寶科技有限公司 | Inspection/repair/reinspection system for electrical circuits and laser writing system |
CN102956239A (en) * | 2011-08-29 | 2013-03-06 | 新科实业有限公司 | Magnetic head, magnetic head fold-fin combination and disk drive unit |
CN103567642B (en) * | 2012-08-08 | 2017-07-11 | 赛恩倍吉科技顾问(深圳)有限公司 | Sapphire cutter sweep |
CN103962727B (en) * | 2013-01-28 | 2018-03-02 | 深圳市裕展精密科技有限公司 | Sapphire cutter device |
US10118250B1 (en) | 2017-09-15 | 2018-11-06 | International Business Machines Corporation | In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method |
CN108326435B (en) * | 2017-12-29 | 2022-08-30 | 大族激光科技产业集团股份有限公司 | Laser marking method for die steel |
CN108637472B (en) * | 2018-06-05 | 2023-12-08 | 昆山宝锦激光拼焊有限公司 | Skylight laser welding line platform |
CN108637473B (en) * | 2018-06-05 | 2023-12-08 | 昆山宝锦激光拼焊有限公司 | One-time positioning welding forming device for skylight plate |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4534804A (en) * | 1984-06-14 | 1985-08-13 | International Business Machines Corporation | Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
US5963364A (en) * | 1994-02-18 | 1999-10-05 | New Wave Research | Multi-wavelength variable attenuator and half wave plate |
US6032997A (en) * | 1998-04-16 | 2000-03-07 | Excimer Laser Systems | Vacuum chuck |
US6057180A (en) * | 1998-06-05 | 2000-05-02 | Electro Scientific Industries, Inc. | Method of severing electrically conductive links with ultraviolet laser output |
US6063695A (en) * | 1998-11-16 | 2000-05-16 | Taiwan Semiconductor Manufacturing Company | Simplified process for the fabrication of deep clear laser marks using a photoresist mask |
US6255621B1 (en) * | 2000-01-31 | 2001-07-03 | International Business Machines Corporation | Laser cutting method for forming magnetic recording head sliders |
US6536337B2 (en) * | 2000-05-25 | 2003-03-25 | Deere & Company | Bale wrapping supply roll handling arrangement |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4473737A (en) * | 1981-09-28 | 1984-09-25 | General Electric Company | Reverse laser drilling |
JP2621599B2 (en) * | 1990-07-05 | 1997-06-18 | 日本電気株式会社 | Contact hole forming apparatus and method |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
JPH09107168A (en) * | 1995-08-07 | 1997-04-22 | Mitsubishi Electric Corp | Laser processing method of wiring board, laser processing device of wiring board and carbon dioxide gas laser oscillator for wiring board processing |
JPH11773A (en) * | 1997-06-11 | 1999-01-06 | Nec Corp | Laser beam machine and its method |
JP3532100B2 (en) * | 1997-12-03 | 2004-05-31 | 日本碍子株式会社 | Laser cleaving method |
JP3395141B2 (en) * | 1998-03-02 | 2003-04-07 | 住友重機械工業株式会社 | Laser processing equipment |
JP2000164535A (en) * | 1998-11-24 | 2000-06-16 | Mitsubishi Electric Corp | Laser working device |
TW482705B (en) * | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
US6472295B1 (en) * | 1999-08-27 | 2002-10-29 | Jmar Research, Inc. | Method and apparatus for laser ablation of a target material |
US6356337B1 (en) * | 2000-03-08 | 2002-03-12 | Anvik Corporation | Two-sided substrate imaging using single-approach projection optics |
-
2002
- 2002-01-10 CN CNB028044045A patent/CN1301178C/en not_active Expired - Fee Related
- 2002-01-10 EP EP02707453A patent/EP1365880A4/en not_active Withdrawn
- 2002-01-10 JP JP2002560818A patent/JP4634692B2/en not_active Expired - Fee Related
- 2002-01-10 WO PCT/US2002/000867 patent/WO2002060636A1/en active Application Filing
- 2002-01-10 TW TW091100223A patent/TW525240B/en not_active IP Right Cessation
- 2002-01-10 CA CA002436736A patent/CA2436736A1/en not_active Abandoned
- 2002-01-10 GB GB0317853A patent/GB2389811B/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4534804A (en) * | 1984-06-14 | 1985-08-13 | International Business Machines Corporation | Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer |
US5963364A (en) * | 1994-02-18 | 1999-10-05 | New Wave Research | Multi-wavelength variable attenuator and half wave plate |
US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
US6032997A (en) * | 1998-04-16 | 2000-03-07 | Excimer Laser Systems | Vacuum chuck |
US6057180A (en) * | 1998-06-05 | 2000-05-02 | Electro Scientific Industries, Inc. | Method of severing electrically conductive links with ultraviolet laser output |
US6063695A (en) * | 1998-11-16 | 2000-05-16 | Taiwan Semiconductor Manufacturing Company | Simplified process for the fabrication of deep clear laser marks using a photoresist mask |
US6255621B1 (en) * | 2000-01-31 | 2001-07-03 | International Business Machines Corporation | Laser cutting method for forming magnetic recording head sliders |
US6536337B2 (en) * | 2000-05-25 | 2003-03-25 | Deere & Company | Bale wrapping supply roll handling arrangement |
Also Published As
Publication number | Publication date |
---|---|
TW525240B (en) | 2003-03-21 |
EP1365880A4 (en) | 2008-04-16 |
GB2389811A (en) | 2003-12-24 |
JP4634692B2 (en) | 2011-02-16 |
WO2002060636A1 (en) | 2002-08-08 |
GB0317853D0 (en) | 2003-09-03 |
JP2004526575A (en) | 2004-09-02 |
CN1301178C (en) | 2007-02-21 |
CN1527754A (en) | 2004-09-08 |
EP1365880A1 (en) | 2003-12-03 |
CA2436736A1 (en) | 2002-08-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100110 |