CN1296984C - 衬底定位的方法和装置 - Google Patents
衬底定位的方法和装置 Download PDFInfo
- Publication number
- CN1296984C CN1296984C CNB2004100460533A CN200410046053A CN1296984C CN 1296984 C CN1296984 C CN 1296984C CN B2004100460533 A CNB2004100460533 A CN B2004100460533A CN 200410046053 A CN200410046053 A CN 200410046053A CN 1296984 C CN1296984 C CN 1296984C
- Authority
- CN
- China
- Prior art keywords
- substrate
- camera
- ball
- head
- pick head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 claims abstract description 63
- 230000004907 flux Effects 0.000 claims description 37
- 230000008569 process Effects 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 12
- 230000000717 retained effect Effects 0.000 claims 2
- 238000003384 imaging method Methods 0.000 abstract description 8
- 241000587161 Gomphocarpus Species 0.000 description 34
- 238000012545 processing Methods 0.000 description 12
- 230000009977 dual effect Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000003909 pattern recognition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/454,258 | 2003-06-03 | ||
| US10/454,258 US6983872B2 (en) | 2003-06-03 | 2003-06-03 | Substrate alignment method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1574273A CN1574273A (zh) | 2005-02-02 |
| CN1296984C true CN1296984C (zh) | 2007-01-24 |
Family
ID=33489697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100460533A Expired - Fee Related CN1296984C (zh) | 2003-06-03 | 2004-06-03 | 衬底定位的方法和装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6983872B2 (zh) |
| KR (1) | KR100609260B1 (zh) |
| CN (1) | CN1296984C (zh) |
| MY (1) | MY131747A (zh) |
| SG (1) | SG116552A1 (zh) |
| TW (1) | TWI261535B (zh) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4258759B2 (ja) * | 2003-06-26 | 2009-04-30 | 澁谷工業株式会社 | 半田ボール搭載方法及び装置 |
| KR100636492B1 (ko) * | 2005-01-05 | 2006-10-18 | 삼성에스디아이 주식회사 | 기판과 마스크의 정렬장치 및 정렬방법 |
| US20080157353A1 (en) * | 2006-12-29 | 2008-07-03 | Texas Instruments Incorporated | Control of Standoff Height Between Packages with a Solder-Embedded Tape |
| KR20090070406A (ko) * | 2007-12-27 | 2009-07-01 | 삼성전자주식회사 | 피씨비 스트립과 그의 어셈블리 장치와 방법 |
| WO2010009295A2 (en) | 2008-07-16 | 2010-01-21 | Applied Materials, Inc. | Hybrid heterojunction solar cell fabrication using a metal layer mask |
| CN102318078B (zh) * | 2008-12-10 | 2013-10-30 | 应用材料公司 | 用于网版印刷图案对准的增强型检视系统 |
| EP2339611B1 (en) * | 2009-12-23 | 2015-11-11 | ISMECA Semiconductor Holding SA | Wafer handler comprising a vision system |
| US9791466B2 (en) | 2011-07-21 | 2017-10-17 | Brooks Automation, Inc. | Method and device for compensation for dimensional variations in low temperature sample group holders |
| JP2014011231A (ja) * | 2012-06-28 | 2014-01-20 | Hitachi Ltd | ハンダボール印刷搭載装置 |
| DE102015106224B4 (de) * | 2015-04-22 | 2022-09-01 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens |
| CN107160023B (zh) * | 2017-06-20 | 2019-08-02 | 新昌县科创自动化设备有限公司 | 一种智能定位高频焊机及其焊接方法 |
| WO2025235384A1 (en) * | 2024-05-10 | 2025-11-13 | Jabil Inc. | Apparatus, system, and method for electrical component assembly on ball grid array larger than field of view |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6070783A (en) * | 1997-04-22 | 2000-06-06 | Matsushita Electric Industrial Co., Ltd. | Conductive ball attaching apparatus and method |
| CN1337739A (zh) * | 2000-08-03 | 2002-02-27 | 三洋电机株式会社 | 半导体器件的制造方法 |
| US6355298B1 (en) * | 1999-08-23 | 2002-03-12 | Asm Assembly Automation Ltd. | Placement system apparatus and method |
| JP2003107756A (ja) * | 2001-09-27 | 2003-04-09 | Nec Toppan Circuit Solutions Toyama Inc | 自動露光機および位置合わせ方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158966B2 (ja) * | 1995-06-19 | 2001-04-23 | 松下電器産業株式会社 | バンプ付電子部品の製造装置および製造方法 |
| JP3932501B2 (ja) * | 1998-12-01 | 2007-06-20 | 澁谷工業株式会社 | ボールマウント装置 |
| KR100598198B1 (ko) * | 1999-06-18 | 2006-07-07 | 시부야 코교 가부시키가이샤 | 피가공물과 헤드의 위치결정장치 및 위치결정방법 |
| JP4143788B2 (ja) * | 1999-08-04 | 2008-09-03 | 澁谷工業株式会社 | ボールマウント装置及びマウント方法 |
| SG97164A1 (en) * | 2000-09-21 | 2003-07-18 | Micron Technology Inc | Individual selective rework of defective bga solder balls |
| SG129992A1 (en) * | 2001-08-13 | 2007-03-20 | Micron Technology Inc | Method and apparatus for detecting topographical features of microelectronic substrates |
-
2003
- 2003-06-03 US US10/454,258 patent/US6983872B2/en not_active Expired - Fee Related
-
2004
- 2004-06-01 SG SG200403101A patent/SG116552A1/en unknown
- 2004-06-01 TW TW093115586A patent/TWI261535B/zh not_active IP Right Cessation
- 2004-06-02 MY MYPI20042127A patent/MY131747A/en unknown
- 2004-06-02 KR KR1020040040038A patent/KR100609260B1/ko not_active Expired - Fee Related
- 2004-06-03 CN CNB2004100460533A patent/CN1296984C/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6070783A (en) * | 1997-04-22 | 2000-06-06 | Matsushita Electric Industrial Co., Ltd. | Conductive ball attaching apparatus and method |
| US6355298B1 (en) * | 1999-08-23 | 2002-03-12 | Asm Assembly Automation Ltd. | Placement system apparatus and method |
| CN1337739A (zh) * | 2000-08-03 | 2002-02-27 | 三洋电机株式会社 | 半导体器件的制造方法 |
| JP2003107756A (ja) * | 2001-09-27 | 2003-04-09 | Nec Toppan Circuit Solutions Toyama Inc | 自動露光機および位置合わせ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6983872B2 (en) | 2006-01-10 |
| US20040245319A1 (en) | 2004-12-09 |
| TWI261535B (en) | 2006-09-11 |
| TW200427542A (en) | 2004-12-16 |
| CN1574273A (zh) | 2005-02-02 |
| SG116552A1 (en) | 2005-11-28 |
| KR20040104418A (ko) | 2004-12-10 |
| KR100609260B1 (ko) | 2006-08-08 |
| MY131747A (en) | 2007-08-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAISALA INTELLECTUAL PROPERTY CORPORATION Free format text: FORMER OWNER: ADVANCED AUTOMATIC APPARATUS AND MATERIAL CO LTD Effective date: 20111103 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: EVEN SENSE CO., LTD. Free format text: FORMER NAME: TAISALA INTELLECTUAL PROPERTY CORPORATION |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Aceart 95134 Park Road in San Jose, California No. 3025 Patentee after: INVENSAS Corp. Address before: Aceart 95134 Park Road in San Jose, California No. 3025 Patentee before: Tesara Intellectual Property |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20111103 Address after: Aceart 95134 Park Road in San Jose, California No. 3025 Patentee after: Tesara Intellectual Property Address before: Hongkong, China, Kwai Chung Industrial Street, Watsons center, building 20 Patentee before: ASM Assembly Automation Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: Aceart 95134 Park Road in San Jose, California No. 2702 Patentee after: INVENSAS Corp. Address before: Aceart 95134 Park Road in San Jose, California No. 3025 Patentee before: INVENSAS Corp. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070124 Termination date: 20170603 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |