CN1288747C - 半导体芯片焊接用台阶状图案 - Google Patents

半导体芯片焊接用台阶状图案 Download PDF

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CN1288747C
CN1288747C CNB02140111XA CN02140111A CN1288747C CN 1288747 C CN1288747 C CN 1288747C CN B02140111X A CNB02140111X A CN B02140111XA CN 02140111 A CN02140111 A CN 02140111A CN 1288747 C CN1288747 C CN 1288747C
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semiconductor chip
substrate
welding
shape pattern
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荒木千博
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Yamaha Motor Electronics Co Ltd
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Menlic K K
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Abstract

一种安装于基板上的半导体芯片，所述的基板具有一焊接用台阶状图案，用于盛装所述传导表面与所述半导体芯片的相对表面间的熔融焊料。所述的焊接用台阶状图案包括分别与所述半导体芯片底面的四个角相间的角和位于各角间的出口，所述的出口从所述半导体芯片底面的各边向外充分伸出，以在将所述的焊料把所述半导体芯片固定于所述焊接用台阶状图案内时，接收从所述传导表面与所述半导体芯片的相对表面间区域中排出的液态焊料，所述的焊料把所述半导体芯片固定于所述焊接用台阶状图案内，从而提高了传导率，且简化了结构。上述的器件也示于一电动机控制系统中。

Description

半导体芯片焊接用台阶状图案
技术领域
本发明涉及一种用于把半导体芯片焊接到基板上的半导体芯片焊接用台阶状图案和一种用于制作电路的焊接方法。
背景技术
在机车和工业设备中所用的各种电动设备的控制电路中，含有裸片的半导体器件安装在例如电路板的基板上所形成的电极和电路模块上。这样通过缩短线路距离而获得了令人满意的半导体器件性能。这样，减小了电阻且提高了生产效率，并使得安装密度较高。把这些裸片焊接到基板的电极和电路模块上之后，用树脂将其封装。
在把例如上述裸片的半导体器件安装到基板上的过程中，首先在基板上形成传导图案，然后在整个基板表面涂覆阻焊剂而覆盖上述传导图案。再在阻焊剂区上开口而形成裸片安装区，该区被称作与用于容接裸片的焊接用台阶状图案。上述的开口台阶状图案通常比要插入其中的裸片稍大。公隙一般约为0.1mm。
但是，当采用传统的半导体芯片台阶状图案，在焊接剂熔化和插入裸片时，液状焊接剂的移动将使裸片卷曲和倾斜。这会使所焊接的芯片在基板表面的水平面上或从该水平面发生位移或倾斜。
通常，利用由炭板制成的定位夹具来阻止这种位移和偏离。这种定位夹具相应于芯片的形状形成与之相近的开口。在焊接时，把半导体芯片插入该夹具开口中且调整好，使其安装到基板上。然后，加压使其定位，并将熔融状的焊料加入。这样，就将半导体芯片固定到了基板上而不会出现位移和倾斜。
但是，当采用这种定位夹具时，夹具本身也需具有高精度。而且，如果安装不同尺寸的半导体器件也将增加夹具的需求量。这也增加了在焊接过程中所需的工时。从而使得成本增加且使装配复杂。
因此，本发明的主要目的在于提供一种焊接半导体芯片的方法和结构，这种的简单结构能够将半导体芯片定位且不需使用定位夹具。
发明内容
本发明的第一个特征体现在把半导体芯片安装到基板上。所述的基板具有一被一绝缘表面包围的传导表面，该绝缘表面形成了一个用于盛装熔融焊料的焊接用台阶状图案，它位于所述传导表面和与之相对的半导体芯片表面之间。焊料固化时就把半导体芯片的相对表面和传导表面连接在一起。所述的焊接用台阶状图案包括：分别与半导体芯片底面的四个角基本匹配的四个角；和四个与半导体芯片底面的四条边相应的出口，所述的出口从半导体芯片的底面各条边外侧充分伸出，以接收从传导表面和与之相对的半导体芯片表面间区域中排出的液体焊料，从而把半导体芯片固定在焊接用台阶状图案中。
本发明的另一个特征体现在对一个旋转电机进行控制上，所述的旋转电机含有一个端部开口的圆柱状壳体，半导体芯片和基板均置于其中。所述的壳体具有从该壳体表面伸出的多个向外突出的平行突起。用树脂将半导体芯片和基板安装于该壳体中。金属基板上安装一个半导体器件和一个机器控制电路，所述的半导体器件为一个功率控制裸片。
本发明的又一个特征体现在制作电路的方法中，所述的电路由半导体芯片和基板构成。该方法包括以下步骤：制作一个具有被绝缘表面包围的传导表面的基板；在所述的绝缘表面形成一个用于容接半导体芯片和基板的焊接用台阶状图案，所述的焊接用台阶状图案具有：四个分别与半导体芯片底面的四个角基本匹配的四个角和四个与半导体芯片底面的四条边相应的出口，所述的出口从半导体芯片底面的四条边外侧充分伸出；接收从传导表面和与之相对的半导体芯片表面间的区域排出的液体焊料；用液体焊料将所述的焊接用台阶状图案至少部分填满；将半导体芯片定位于焊接用台阶状图案内；和至少把液体焊料的一部分排除到出口中。
附图说明
图1是根据本发明的一个实施例构成的焊接用台阶状图案的顶视图；
图2是与图1部分相似的视图，它示意根据本发明在插入芯片时熔融焊料如何移动；
图3是沿焊接用台阶状图案中心剖开的横截面图；
图4是本发明所用铝基板的顶视图；
图5是与图4部分相似的视图，但它示意的是安装在铝基板上的芯片和其他部件；
图6是图5所示结构的侧面立视图；
图7是与本发明结合使用的电动机车的发动机控制单元的顶视图；
图8是发动机控制单元的侧面立视图；
图9是发动机控制单元的端面立视图；
图10与图7部分相似的顶视图，但去除了密封元件且用实线表示其中的构件；
图11是与图8部分部分相似的侧面立视图，但去除了密封元件且用实线表示其中的构件；
图12是与图9部分部分相似的端面立视图，但去除了密封元件且用实线表示其中的构件。
具体实施方式
现在将详细描述附图，首先参见图1-3，如图所示，把印刷电路和固态构件例如半导体芯片及其他构件安装在电路板上，通常用附图标记21表示所述的电路板。在上述实施例中，如图3所示，电路板21包括：一个厚度约2-3mm的铝(Al)基板22；一个由例如环氧树脂制成的、厚度约75-100μm的绝缘层23；和一个位于绝缘层23上的铜(Cu)膜传导图案24。
传导图案24上涂覆阻焊剂25，它被做成开口状以形成台阶状图案26，半导体芯片将安装于此。所述台阶状图案26的形状是本发明的重要特点，通过以下的描述将更清楚。
用焊接剂28(易熔焊料或无铅焊料)把半导体裸片27直接焊接到暴露在台阶状图案26上的传导图案24上。所述的半导体裸片27可以是用于例如能量转换的电功二极管或功率晶体管的功率器件中的一个裸片，有大量的电流流经其间。
在焊接后，用例如环氧树脂的树脂29密封或封装半导体裸片27。此外，可以在半导体裸片27的底面设置一个用于散热的热沉(未示出)。所述的热沉应当具有与半导体裸片27几乎相同的形状。在把裸片安装到本发明的焊接用台阶状图案上之前，把这种热沉连接到裸片底面上。其效果是热沉与裸片为一整体。
如图1和2所示，基板21上的阻焊剂25被开口形成焊接用台阶状图案26。
这种焊接用台阶状图案26包括四个与将被连接的、半导体芯片27底面(图1中的虚线所示)的四个角基本匹配的角26a和四个与所述底面的四条边相应的出口26b。每个角26a与芯片底面的轮廓外侧相匹配或稍差一点(约小于或等于0.1mm)。每个出口26b从芯片底面向外伸出约1mm。假定分别用W和H来表示芯片底面的水平边和垂直边，如图1所示，每个出口26b的长度为：水平边上的开口W’＝0.4×W至0.6×W，垂直边上的开口H’＝0.4×H至0.6×H。每个开口都分别沿每条边的中心对齐，且位于每条边的中心。
参见图2，在焊接区中，熔融焊料28扩散并浸润整个芯片底面，然后自由地流到四边的出口26b中。出口26b的大小应使熔融焊料28流出且停留在每个出口26b的中部而不会流满整个出口26b，因此，该熔融焊料28的张力同样从四条边作用于该芯片底面。芯片被固定在焊接用台阶状图案的中部而没有偏斜。在熔融焊料流向芯片四边的作用下，熔融焊料在每个角26a同样受到拉力，并且芯片27的每个角都被焊料很好地浸润。从而，芯片27的每个角在焊料作用下都可靠地与导体24连接。
而且，对于本发明中的焊接用台阶状图案，由于焊料浸润面积增大，大于芯片27的底面面积，所以减少了熔融焊料的空缺入射。这种现象已被试验所验证。由于上述空缺入射的减少或消除，不仅使连接强度增加而提高了焊接的可靠性，而且也因此获得很好的热传导性能，并改善了从芯片27到基板22的热辐射。此外，减少焊料空隙也减小了焊接表面的电阻，且使大量电流流过而不因产生热而有任何损失。因而可以提高半导体器件的性能。尤其是当将流过大量用于功率转换的电流的例如电功二极管或功率晶体管的功率元件的裸片用于半导体器件时。
本发明中，在焊接半导体芯片时，用于每个芯片的焊料量为整个芯片底面可靠焊接所需焊料的厚度量和熔融焊料能够流到焊接用台阶状图案出口中部的量。从而，可以通过适当选择焊料量而获得本发明的焊接用台阶状图案结构的上述效果。
图4-6示意了这样一个实施例，其中把体现本发明的一种基板用作驱动电动机车的电动机控制单元。在一铝基板31上形成一个铜传导图案(未示出)，并在其上涂覆一层阻焊剂32。通过刻制阻焊剂32，而形成了电动机控制单元的组成区域二极管焊接用台阶状图案33和FET焊接用台阶状图案34。在铝基板31上的三个地方形成所述控制电路的输出端35a，35b和35c，其中每个输出端都分别具有两个输出端孔36。在铝基板31的四个角上设有用于固定壳体的安装孔37，后面将结合附图7-12进行描述。另外，基板上还设有一个构成该驱动电路另一部件的栅电阻38。
二极管39被焊接于各个二极管焊接用台阶状图案33中，FET 41被焊接于各个FET焊接用台阶状图案34中。用树脂42分别将每个二极管39进行封装或密封。沿接线柱44用树脂43密封每个FET 41。可以选择其线性膨胀系数为(15-30)×10-6/℃的市售可得的液态密封材料或树脂来作为封装上述二极管39和FET 41的密封材料。(例如：在市场上很容易获得其线性膨胀系数分别约为15×10-6/℃和22×10-6/℃的分别类似于铜和铝的系数的密封材料。)现在参见图7-12，这些附图示意了根据本发明的另一特征如何构造含有图4-6所示铝基板31的整个电动机控制单元。所述的电动机控制单元通常用附图标记45表示，它包括一个位于壳体46中、由前述图4-6所示的铝基板31构成的驱动控制电路。
所述的壳体46由铝或铝合金金属材料挤压而成。壳体46为两端开口的圆柱形。从它的外围表面伸出形成多个平行排列的突起47。上述的突起47增大了壳体46的表面积，使得热辐射增加，而且增加了壳体46的刚性和强度。
在所述的铝基板31上还安装有构成驱动控制电路的其他元件，例如电介质电容48，所述的驱动控制电路构成驱动控制电路(图10)。而且，端部连接板49a，49b和49c与前述的输出端35a，35b和35c连接。控制电路的每条信号线都经由电缆51和耦合器52与开关和其他机车侧上的驱动或控制部件相连。输出端53穿过前述的输出端孔37，从铝基板31的下表面伸出。上述的铝基板31和置于其上的电学部件都盛装在壳体46内且用树脂54进行封装或密封。
如上所述，本发明的焊接用台阶状图案具有熔融焊料出口，以在焊接时使焊料从半导体芯片底面的每一边向外扩散。熔融焊料流到芯片每一边的外侧，且表面张力从四个方向等同地作用于所述芯片。因而，所述芯片得以定位而不发生偏离，且增加了焊接的可靠性。并且，由于熔融焊料同等地流向四个侧面，所以，芯片与基板表面平行连接而不会倾斜。另外，由于在芯片底面向外形成焊接用台阶状图案，减少了空缺入射。因此，既增加了热辐射又增强了焊接强度，有效改善了其特性。当然，所述的实施例只是本发明的一种优选方式，可以在不偏离本发明精神和由所附权利要求书所限定范围的情况下作各种修改和变化。

Claims (10)

1、一种安装于一基板上的半导体芯片，所述基板具有一由一绝缘表面包围的传导表面，所述传导表面形成一焊接用台阶状图案，所述的焊接用台阶状图案用于容纳所述传导表面与所述半导体芯片的相对表面间的熔融焊料，当所述焊料固化时将所述半导体芯片的所述相对表面与所述传导表面焊接在一起，所述焊接用台阶状图案含有分别与所述半导体芯片底面的四个角基本匹配的四个角和四个与所述半导体芯片底面的四条边相应的出口，所述出口从所述半导体芯片底面的各边向外充分伸出，以在将所述半导体芯片置于所述焊接用台阶状图案内时，接收从所述传导表面与所述半导体芯片的相对表面间排出的液态焊料。
2、一种如权利要求1所述的安装于一基板上的半导体芯片，其中所述的焊接用台阶状图案的出口足够大以在将所述半导体芯片置于所述焊接用台阶状图案内时，使得所有排出的液态焊料从所述传导表面与所述半导体芯片的所述相对表面间流出，而不使所述半导体芯片偏移所述传导表面。
3、一种如权利要求2所述的安装于一基板上的半导体芯片，其中所述的出口位于所述半导体芯片的各条边中部。
4、一种如权利要求2所述的安装于一基板上的半导体芯片，其中所述的每个出口的边都分别平行于所述半导体芯片的各边。
5、一种如权利要求4所述的安装于一基板上的半导体芯片，其中所述的每个出口从所述半导体芯片底面向外伸出1mm。
6、一种如权利要求1所述的安装于一基板上的半导体芯片，其中所述的半导体芯片是一种功率器件裸片。
7、一种如权利要求6所述的安装于一基板上的半导体芯片与一种旋转电机控制单元的组合，其中所述的半导体芯片控制所述的旋转电机的功率。
8、一种如权利要求7所述的组合，其中所述的旋转电机控制单元由一个其间含有所述半导体芯片和基板的端部开口的圆柱状壳体构成，所述壳体具有从所述壳体表面向外伸出的平行突起，用树脂将所述半导体芯片和基板固接于所述壳体内，基板上安装所述半导体芯片和电动机驱动电路。
9、一种制作由半导体芯片和基板构成的电路的方法，包括以下步骤：
制作一个具有一被一绝缘表面包围的传导表面的基板；
在所述传导表面上形成一焊接用台阶状图案，用于盛接所述半导体芯片和基板，所述焊接用台阶状图案包括分别与所述半导体芯片底面的四个角基本匹配的四个角和四个与所述半导体芯片底面的四条边相应的出口所述出口从所述半导体芯片底面的各条边向外充分伸出；
通过所述出口接收从所述传导表面与所述半导体芯片的所述相对面间区域中排出的液态焊料；
用所述的焊料至少部分填满所述焊接用台阶状图案；
把所述半导体芯片置于所述焊接用台阶状图案内；和
至少把所述液态焊料的一部分排入所述出口。
10、一种如权利要求9所述的制作由半导体芯片和基板构成的电路的方法，其中所排出的液态焊料至少接触所述半导体芯片各边的一部分，以在所述液态焊料固化时使所述半导体芯片在所述基板上的位置保持不变。
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Publication number Priority date Publication date Assignee Title
JP3976020B2 (ja) * 2004-02-12 2007-09-12 株式会社豊田自動織機 表面実装用電子部品の表面実装構造
JP4060810B2 (ja) * 2004-02-27 2008-03-12 富士通株式会社 記録ディスク駆動装置並びにフレキシブルプリント基板ユニットおよびフレキシブルプリント基板
US7615873B2 (en) * 2004-04-21 2009-11-10 International Rectifier Corporation Solder flow stops for semiconductor die substrates
WO2006132130A1 (ja) * 2005-06-06 2006-12-14 Rohm Co., Ltd. 半導体装置、基板および半導体装置の製造方法
JP4976673B2 (ja) * 2005-09-13 2012-07-18 ローム株式会社 半導体装置、基板及び半導体装置の製造方法
JP2007294899A (ja) * 2006-03-31 2007-11-08 Dowa Electronics Materials Co Ltd 半田層及びそれを用いた電子デバイス接合用基板並びに電子デバイス接合用サブマウント
DE102007037538A1 (de) 2007-08-09 2009-02-12 Robert Bosch Gmbh Baugruppe sowie Herstellung einer Baugruppe
JP4924411B2 (ja) * 2007-12-27 2012-04-25 三菱電機株式会社 電力半導体装置
JP4966261B2 (ja) * 2008-06-30 2012-07-04 ニチコン株式会社 半導体装置およびその製造方法
US8124449B2 (en) 2008-12-02 2012-02-28 Infineon Technologies Ag Device including a semiconductor chip and metal foils
US8184440B2 (en) * 2009-05-01 2012-05-22 Abl Ip Holding Llc Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board
JP5325917B2 (ja) 2011-03-17 2013-10-23 株式会社東芝 半導体装置及びその製造方法
JP5465288B2 (ja) * 2012-08-08 2014-04-09 Ｎｅｃトーキン株式会社 赤外線センサ
JPWO2015107997A1 (ja) * 2014-01-14 2017-03-23 住友ベークライト株式会社 モジュール基板
JP6007358B2 (ja) * 2014-02-27 2016-10-12 日信工業株式会社 回路基板および車両用ブレーキ液圧制御装置
JP2023076235A (ja) * 2021-11-22 2023-06-01 パナソニックＩｐマネジメント株式会社 はんだ実装ランド
DE102022204294A1 (de) 2022-05-02 2023-11-02 Robert Bosch Gesellschaft mit beschränkter Haftung Verbindungsanordnung mit einem ein Bauelement zentrierenden Schaltungsträger

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JP2565300B2 (ja) * 1994-05-31 1996-12-18 日本電気株式会社 半導体装置
JPH09107173A (ja) * 1995-10-11 1997-04-22 Tokai Rika Co Ltd パッド構造及び配線基板装置
KR100201380B1 (ko) * 1995-11-15 1999-06-15 김규현 Bga 반도체 패키지의 열방출 구조
JP3531133B2 (ja) * 1997-02-24 2004-05-24 同和鉱業株式会社 パワーモジュール用基板及びその製造法
US5889324A (en) * 1998-03-30 1999-03-30 Nec Corporation Package for a semiconductor device
JP2000156570A (ja) * 1998-11-20 2000-06-06 Fuji Electric Co Ltd 電動機用の制動ユニット
JP2002353383A (ja) * 2001-05-30 2002-12-06 Moric Co Ltd 半導体装置

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