CN1282239C - 紧凑磁阻随机访问存储器单元及其制造方法 - Google Patents
紧凑磁阻随机访问存储器单元及其制造方法 Download PDFInfo
- Publication number
- CN1282239C CN1282239C CNB018149324A CN01814932A CN1282239C CN 1282239 C CN1282239 C CN 1282239C CN B018149324 A CNB018149324 A CN B018149324A CN 01814932 A CN01814932 A CN 01814932A CN 1282239 C CN1282239 C CN 1282239C
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- Prior art keywords
- layer
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- random access
- unit
- access memories
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 230000015654 memory Effects 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 239000000696 magnetic material Substances 0.000 claims abstract 5
- 238000000034 method Methods 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims 9
- 238000002955 isolation Methods 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 74
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/649,114 US6365419B1 (en) | 2000-08-28 | 2000-08-28 | High density MRAM cell array |
US09/649,114 | 2000-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1505837A CN1505837A (zh) | 2004-06-16 |
CN1282239C true CN1282239C (zh) | 2006-10-25 |
Family
ID=24603516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018149324A Expired - Fee Related CN1282239C (zh) | 2000-08-28 | 2001-08-09 | 紧凑磁阻随机访问存储器单元及其制造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6365419B1 (zh) |
EP (1) | EP1316106A2 (zh) |
JP (1) | JP2004508707A (zh) |
KR (1) | KR100785261B1 (zh) |
CN (1) | CN1282239C (zh) |
AU (1) | AU2001283233A1 (zh) |
TW (1) | TW529163B (zh) |
WO (1) | WO2002019386A2 (zh) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4149647B2 (ja) | 2000-09-28 | 2008-09-10 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
US6490194B2 (en) | 2001-01-24 | 2002-12-03 | Infineon Technologies Ag | Serial MRAM device |
KR100399436B1 (ko) * | 2001-03-28 | 2003-09-29 | 주식회사 하이닉스반도체 | 마그네틱 램 및 그 형성방법 |
US6869855B1 (en) | 2001-09-02 | 2005-03-22 | Borealis Technical Limited | Method for making electrode pairs |
US6821907B2 (en) | 2002-03-06 | 2004-11-23 | Applied Materials Inc | Etching methods for a magnetic memory cell stack |
US6893893B2 (en) | 2002-03-19 | 2005-05-17 | Applied Materials Inc | Method of preventing short circuits in magnetic film stacks |
US20030181056A1 (en) * | 2002-03-22 | 2003-09-25 | Applied Materials, Inc. | Method of etching a magnetic material film stack using a hard mask |
US6897532B1 (en) * | 2002-04-15 | 2005-05-24 | Cypress Semiconductor Corp. | Magnetic tunneling junction configuration and a method for making the same |
JP2003324187A (ja) * | 2002-05-01 | 2003-11-14 | Sony Corp | 磁気メモリ装置の製造方法および磁気メモリ装置 |
US6984585B2 (en) * | 2002-08-12 | 2006-01-10 | Applied Materials Inc | Method for removal of residue from a magneto-resistive random access memory (MRAM) film stack using a sacrificial mask layer |
US20040026369A1 (en) * | 2002-08-12 | 2004-02-12 | Chentsau Ying | Method of etching magnetic materials |
US6759263B2 (en) | 2002-08-29 | 2004-07-06 | Chentsau Ying | Method of patterning a layer of magnetic material |
US6964928B2 (en) * | 2002-08-29 | 2005-11-15 | Chentsau Ying | Method for removing residue from a magneto-resistive random access memory (MRAM) film stack using a dual mask |
US6985384B2 (en) | 2002-10-01 | 2006-01-10 | International Business Machines Corporation | Spacer integration scheme in MRAM technology |
US6743642B2 (en) * | 2002-11-06 | 2004-06-01 | International Business Machines Corporation | Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology |
US6660568B1 (en) * | 2002-11-07 | 2003-12-09 | International Business Machines Corporation | BiLevel metallization for embedded back end of the line structures |
JP3766380B2 (ja) * | 2002-12-25 | 2006-04-12 | 株式会社東芝 | 磁気ランダムアクセスメモリ及びその磁気ランダムアクセスメモリのデータ読み出し方法 |
US6888743B2 (en) * | 2002-12-27 | 2005-05-03 | Freescale Semiconductor, Inc. | MRAM architecture |
US6909631B2 (en) * | 2003-10-02 | 2005-06-21 | Freescale Semiconductor, Inc. | MRAM and methods for reading the MRAM |
KR100535046B1 (ko) * | 2002-12-30 | 2005-12-07 | 주식회사 하이닉스반도체 | 마그네틱 램의 형성방법 |
US7199055B2 (en) * | 2003-03-03 | 2007-04-03 | Cypress Semiconductor Corp. | Magnetic memory cell junction and method for forming a magnetic memory cell junction |
US6911156B2 (en) * | 2003-04-16 | 2005-06-28 | Freescale Semiconductor, Inc. | Methods for fabricating MRAM device structures |
US6784510B1 (en) * | 2003-04-16 | 2004-08-31 | Freescale Semiconductor, Inc. | Magnetoresistive random access memory device structures |
US6798004B1 (en) * | 2003-04-22 | 2004-09-28 | Freescale Semiconductor, Inc. | Magnetoresistive random access memory devices and methods for fabricating the same |
JP4775616B2 (ja) * | 2003-05-29 | 2011-09-21 | 日本電気株式会社 | Mram及びその製造方法 |
DE60323162D1 (de) * | 2003-06-24 | 2008-10-02 | Ibm | Selbstausgerichtete leitfähige linien für magnetische direktzugriffsspeicherbausteine auf fet-basis und herstellungsverfahren dafür |
US7183130B2 (en) * | 2003-07-29 | 2007-02-27 | International Business Machines Corporation | Magnetic random access memory and method of fabricating thereof |
US6947313B2 (en) * | 2003-08-27 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | Method and apparatus of coupling conductors in magnetic memory |
US7602000B2 (en) * | 2003-11-19 | 2009-10-13 | International Business Machines Corporation | Spin-current switched magnetic memory element suitable for circuit integration and method of fabricating the memory element |
US7071009B2 (en) * | 2004-04-01 | 2006-07-04 | Headway Technologies, Inc. | MRAM arrays with reduced bit line resistance and method to make the same |
US7211446B2 (en) * | 2004-06-11 | 2007-05-01 | International Business Machines Corporation | Method of patterning a magnetic tunnel junction stack for a magneto-resistive random access memory |
US7374952B2 (en) * | 2004-06-17 | 2008-05-20 | Infineon Technologies Ag | Methods of patterning a magnetic stack of a magnetic memory cell and structures thereof |
US7368299B2 (en) * | 2004-07-14 | 2008-05-06 | Infineon Technologies Ag | MTJ patterning using free layer wet etching and lift off techniques |
TWI266413B (en) * | 2004-11-09 | 2006-11-11 | Ind Tech Res Inst | Magnetic random access memory with lower bit line current and manufacture method thereof |
US20060102197A1 (en) * | 2004-11-16 | 2006-05-18 | Kang-Lie Chiang | Post-etch treatment to remove residues |
US7105903B2 (en) | 2004-11-18 | 2006-09-12 | Freescale Semiconductor, Inc. | Methods and structures for electrical communication with an overlying electrode for a semiconductor element |
KR100719345B1 (ko) * | 2005-04-18 | 2007-05-17 | 삼성전자주식회사 | 자기 기억 장치의 형성 방법 |
US7375002B2 (en) * | 2005-06-28 | 2008-05-20 | Freescale Semiconductor, Inc. | MIM capacitor in a semiconductor device and method therefor |
US7257019B2 (en) * | 2005-11-17 | 2007-08-14 | Macronix International Co., Ltd. | Systems and methods for a magnetic memory device that includes a single word line transistor |
US8084835B2 (en) * | 2006-10-20 | 2011-12-27 | Avalanche Technology, Inc. | Non-uniform switching based non-volatile magnetic based memory |
US8363457B2 (en) * | 2006-02-25 | 2013-01-29 | Avalanche Technology, Inc. | Magnetic memory sensing circuit |
US8508984B2 (en) * | 2006-02-25 | 2013-08-13 | Avalanche Technology, Inc. | Low resistance high-TMR magnetic tunnel junction and process for fabrication thereof |
US8063459B2 (en) * | 2007-02-12 | 2011-11-22 | Avalanche Technologies, Inc. | Non-volatile magnetic memory element with graded layer |
US7732881B2 (en) * | 2006-11-01 | 2010-06-08 | Avalanche Technology, Inc. | Current-confined effect of magnetic nano-current-channel (NCC) for magnetic random access memory (MRAM) |
US8058696B2 (en) * | 2006-02-25 | 2011-11-15 | Avalanche Technology, Inc. | High capacity low cost multi-state magnetic memory |
US8535952B2 (en) * | 2006-02-25 | 2013-09-17 | Avalanche Technology, Inc. | Method for manufacturing non-volatile magnetic memory |
US8183652B2 (en) | 2007-02-12 | 2012-05-22 | Avalanche Technology, Inc. | Non-volatile magnetic memory with low switching current and high thermal stability |
US20070253245A1 (en) * | 2006-04-27 | 2007-11-01 | Yadav Technology | High Capacity Low Cost Multi-Stacked Cross-Line Magnetic Memory |
US20080246104A1 (en) * | 2007-02-12 | 2008-10-09 | Yadav Technology | High Capacity Low Cost Multi-State Magnetic Memory |
US8018011B2 (en) * | 2007-02-12 | 2011-09-13 | Avalanche Technology, Inc. | Low cost multi-state magnetic memory |
US7445943B2 (en) * | 2006-10-19 | 2008-11-04 | Everspin Technologies, Inc. | Magnetic tunnel junction memory and method with etch-stop layer |
US8802451B2 (en) | 2008-02-29 | 2014-08-12 | Avalanche Technology Inc. | Method for manufacturing high density non-volatile magnetic memory |
JP5288933B2 (ja) * | 2008-08-08 | 2013-09-11 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
KR101019893B1 (ko) * | 2008-12-23 | 2011-03-04 | 주식회사 하이닉스반도체 | 플로팅 바디 효과를 이용한 자기저항 메모리셀, 이를 포함하는 메모리 소자 및 그 동작 방법 |
US8208290B2 (en) * | 2009-08-26 | 2012-06-26 | Qualcomm Incorporated | System and method to manufacture magnetic random access memory |
CN102403451B (zh) * | 2010-09-17 | 2014-11-26 | 中芯国际集成电路制造(北京)有限公司 | 一种磁性随机存取存储器磁性隧道结层制造方法 |
EP2652791B1 (en) | 2010-12-17 | 2017-03-01 | Everspin Technologies, Inc. | Magnetic random access memory integration having improved scaling |
US8790935B1 (en) * | 2012-10-22 | 2014-07-29 | Everspin Technologies, Inc. | Method of manufacturing a magnetoresistive-based device with via integration |
US20140210021A1 (en) * | 2013-01-25 | 2014-07-31 | Qualcomm Incorporated | Method and apparatus for ameliorating peripheral edge damage in magnetoresistive tunnel junction (mtj) device ferromagnetic layers |
US20160254318A1 (en) * | 2015-02-27 | 2016-09-01 | Qualcomm Incorporated | MAGNETIC RANDOM ACCESS MEMORY (MRAM) BIT CELLS EMPLOYING SOURCE LINES (SLs) AND/OR BIT LINES (BLs) DISPOSED IN MULTIPLE, STACKED METAL LAYERS TO REDUCE MRAM BIT CELL RESISTANCE |
US9842986B2 (en) * | 2015-12-15 | 2017-12-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method of forming the same |
US10290679B1 (en) | 2018-03-09 | 2019-05-14 | Globalfoundries Singapore Pte. Ltd. | High-Density STT-MRAM with 3D arrays of MTJs in multiple levels of interconnects and method for producing the same |
WO2019237308A1 (zh) | 2018-06-14 | 2019-12-19 | 华为技术有限公司 | 存储器 |
US11361987B2 (en) | 2020-05-14 | 2022-06-14 | International Business Machines Corporation | Forming decoupled interconnects |
US11876047B2 (en) | 2021-09-14 | 2024-01-16 | International Business Machines Corporation | Decoupled interconnect structures |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5650958A (en) * | 1996-03-18 | 1997-07-22 | International Business Machines Corporation | Magnetic tunnel junctions with controlled magnetic response |
US5861328A (en) | 1996-10-07 | 1999-01-19 | Motorola, Inc. | Method of fabricating GMR devices |
US5804458A (en) * | 1996-12-16 | 1998-09-08 | Motorola, Inc. | Method of fabricating spaced apart submicron magnetic memory cells |
JP2002520874A (ja) * | 1998-07-15 | 2002-07-09 | インフィネオン テクノロジース アクチエンゲゼルシャフト | メモリ素子の電気抵抗が情報でありかつ磁場により影響を与えることができるメモリセル装置及びその製造方法 |
US6097625A (en) * | 1998-07-16 | 2000-08-01 | International Business Machines Corporation | Magnetic random access memory (MRAM) array with magnetic tunnel junction (MTJ) cells and remote diodes |
US5940319A (en) | 1998-08-31 | 1999-08-17 | Motorola, Inc. | Magnetic random access memory and fabricating method thereof |
DE10020128A1 (de) * | 2000-04-14 | 2001-10-18 | Infineon Technologies Ag | MRAM-Speicher |
JP2002141481A (ja) * | 2000-11-01 | 2002-05-17 | Canon Inc | 強磁性体メモリおよびその動作方法 |
JP2002170374A (ja) * | 2000-11-28 | 2002-06-14 | Canon Inc | 強磁性体不揮発性記憶素子およびその情報再生方法ならびにそれを用いたメモリチップおよび携帯型情報処理装置 |
-
2000
- 2000-08-28 US US09/649,114 patent/US6365419B1/en not_active Expired - Fee Related
-
2001
- 2001-08-09 JP JP2002524191A patent/JP2004508707A/ja active Pending
- 2001-08-09 WO PCT/US2001/025004 patent/WO2002019386A2/en active Application Filing
- 2001-08-09 KR KR1020037003128A patent/KR100785261B1/ko not_active IP Right Cessation
- 2001-08-09 CN CNB018149324A patent/CN1282239C/zh not_active Expired - Fee Related
- 2001-08-09 AU AU2001283233A patent/AU2001283233A1/en not_active Abandoned
- 2001-08-09 EP EP01962015A patent/EP1316106A2/en not_active Withdrawn
- 2001-08-27 TW TW090121070A patent/TW529163B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6365419B1 (en) | 2002-04-02 |
AU2001283233A1 (en) | 2002-03-13 |
KR100785261B1 (ko) | 2007-12-13 |
CN1505837A (zh) | 2004-06-16 |
JP2004508707A (ja) | 2004-03-18 |
EP1316106A2 (en) | 2003-06-04 |
TW529163B (en) | 2003-04-21 |
KR20030064394A (ko) | 2003-07-31 |
WO2002019386A3 (en) | 2003-01-23 |
WO2002019386A2 (en) | 2002-03-07 |
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