CN1281922C - 物体表面的检查方法和检查系统 - Google Patents

物体表面的检查方法和检查系统 Download PDF

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Publication number
CN1281922C
CN1281922C CNB031021697A CN03102169A CN1281922C CN 1281922 C CN1281922 C CN 1281922C CN B031021697 A CNB031021697 A CN B031021697A CN 03102169 A CN03102169 A CN 03102169A CN 1281922 C CN1281922 C CN 1281922C
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CN
China
Prior art keywords
pixel
workpiece
pixels
inspected
compared
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Expired - Fee Related
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CNB031021697A
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English (en)
Chinese (zh)
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CN1435676A (zh
Inventor
氏原尚
猪股宽成
藤田功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
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Dowa Mining Co Ltd
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Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Publication of CN1435676A publication Critical patent/CN1435676A/zh
Application granted granted Critical
Publication of CN1281922C publication Critical patent/CN1281922C/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G01N21/8903—Optical details; Scanning details using a multiple detector array

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
CNB031021697A 2002-01-31 2003-01-30 物体表面的检查方法和检查系统 Expired - Fee Related CN1281922C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23729/2002 2002-01-31
JP2002023729A JP3930333B2 (ja) 2002-01-31 2002-01-31 物品表面の検査システム
JP23729/02 2002-01-31

Publications (2)

Publication Number Publication Date
CN1435676A CN1435676A (zh) 2003-08-13
CN1281922C true CN1281922C (zh) 2006-10-25

Family

ID=27606412

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031021697A Expired - Fee Related CN1281922C (zh) 2002-01-31 2003-01-30 物体表面的检查方法和检查系统

Country Status (3)

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US (1) US7012679B2 (enExample)
JP (1) JP3930333B2 (enExample)
CN (1) CN1281922C (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8346497B2 (en) * 2003-03-26 2013-01-01 Semiconductor Energy Laboratory Co., Ltd. Method for testing semiconductor film, semiconductor device and manufacturing method thereof
US8184923B2 (en) 2004-04-19 2012-05-22 Semiconductor Energy Laboratory Co., Ltd. Image analysis method, image analysis program, pixel evaluation system having the image analysis method, and pixel evaluation system having the image analysis program
JP2006041352A (ja) * 2004-07-29 2006-02-09 Dainippon Screen Mfg Co Ltd 皮膜検査装置、検査システム、プログラム、皮膜検査方法およびプリント基板検査方法
JP4331097B2 (ja) * 2004-12-10 2009-09-16 株式会社東芝 表面粗さの計測方法および装置およびタービンの劣化診断方法
WO2007122715A1 (ja) 2006-04-20 2007-11-01 Ibiden Co., Ltd. ハニカム焼成体の検査方法、及び、ハニカム構造体の製造方法
IL188825A0 (en) * 2008-01-16 2008-11-03 Orbotech Ltd Inspection of a substrate using multiple cameras
JP5498659B2 (ja) 2008-02-07 2014-05-21 株式会社半導体エネルギー研究所 レーザ照射位置安定性評価方法及びレーザ照射装置
CN102935430B (zh) * 2011-08-15 2014-05-07 东莞市锐祥智能卡科技有限公司 智能卡自动分检设备
TW201417928A (zh) * 2012-07-30 2014-05-16 Raydiance Inc 具訂製邊形及粗糙度之脆性材料切割
US20140172144A1 (en) * 2012-12-17 2014-06-19 Mitsubishi Electric Research Laboratories, Inc. System and Method for Determining Surface Defects
CN103743749A (zh) * 2014-01-03 2014-04-23 苏州吉视电子科技有限公司 片状零件表面质量检测装置和方法
JP6512035B2 (ja) * 2015-08-28 2019-05-15 日立金属株式会社 自動検査方法および自動検査装置
WO2019168250A1 (ko) * 2018-02-28 2019-09-06 주식회사 코미코 3차원 형상 영상 취득 시스템
CN111562272A (zh) * 2020-06-03 2020-08-21 深圳联钜自控科技有限公司 金属管视觉检测装置
JP7740677B2 (ja) * 2020-10-27 2025-09-17 株式会社寺岡精工 検査装置及び検査システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467350A (en) * 1980-11-07 1984-08-21 Owens-Illinois, Inc. Method and apparatus for rapidly extracting significant data from a sparse object
US4487322A (en) * 1982-09-27 1984-12-11 Owens-Illinois, Inc. Method for inspecting glass containers
US5754678A (en) * 1996-01-17 1998-05-19 Photon Dynamics, Inc. Substrate inspection apparatus and method
US6021380A (en) * 1996-07-09 2000-02-01 Scanis, Inc. Automatic semiconductor wafer sorter/prober with extended optical inspection
CN1059032C (zh) 1997-05-30 2000-11-29 清华大学 利用光反射测量表面形貌的方法
CA2277855A1 (fr) 1999-07-14 2001-01-14 Solvision Methode et systeme de mesure de la hauteur des billes de soudure d'un circuit imprime

Also Published As

Publication number Publication date
US7012679B2 (en) 2006-03-14
CN1435676A (zh) 2003-08-13
US20030142298A1 (en) 2003-07-31
JP3930333B2 (ja) 2007-06-13
JP2003222595A (ja) 2003-08-08

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Granted publication date: 20061025

Termination date: 20140130