CN1267182A - 能够防止焊接过程中的短路的印刷电路板 - Google Patents
能够防止焊接过程中的短路的印刷电路板 Download PDFInfo
- Publication number
- CN1267182A CN1267182A CN00102917A CN00102917A CN1267182A CN 1267182 A CN1267182 A CN 1267182A CN 00102917 A CN00102917 A CN 00102917A CN 00102917 A CN00102917 A CN 00102917A CN 1267182 A CN1267182 A CN 1267182A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- hole
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 title claims description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 244000287680 Garcinia dulcis Species 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 8
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990008509A KR100319291B1 (ko) | 1999-03-13 | 1999-03-13 | 회로 기판 및 회로 기판의 솔더링 방법 |
KR08509/1999 | 1999-03-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1267182A true CN1267182A (zh) | 2000-09-20 |
CN1164157C CN1164157C (zh) | 2004-08-25 |
Family
ID=19576522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001029177A Expired - Fee Related CN1164157C (zh) | 1999-03-13 | 2000-03-09 | 能够防止焊接过程中的短路的印刷电路板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6407342B1 (zh) |
KR (1) | KR100319291B1 (zh) |
CN (1) | CN1164157C (zh) |
TW (1) | TW488198B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100362640C (zh) * | 2004-06-04 | 2008-01-16 | 英业达股份有限公司 | 防止半导体组件引脚焊接短路的方法 |
CN101541141B (zh) * | 2008-03-17 | 2010-09-22 | 英业达股份有限公司 | 印刷电路板及避免电气短路的方法 |
CN102744488A (zh) * | 2011-04-22 | 2012-10-24 | 鸿富锦精密工业(深圳)有限公司 | 焊接辅助装置 |
CN109047965A (zh) * | 2018-09-20 | 2018-12-21 | 北京机械设备研究所 | 一种多管脚封装器件的焊接工装及其使用方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4222260B2 (ja) * | 2004-06-03 | 2009-02-12 | 三菱電機株式会社 | リード形電子部品実装プリント配線基板及び空気調和機 |
JP5236707B2 (ja) * | 2010-09-22 | 2013-07-17 | 日立オートモティブシステムズ株式会社 | 電子機器制御装置 |
CN103386524A (zh) * | 2012-05-08 | 2013-11-13 | 光宝电子(广州)有限公司 | 焊接方法 |
CN103338034A (zh) * | 2013-06-15 | 2013-10-02 | 刘圣平 | 越底反控时基电路端口布置新方法 |
KR102178791B1 (ko) | 2014-01-02 | 2020-11-13 | 삼성전자주식회사 | 반도체 패키지 기판 및 이를 포함하는 반도체 패키지 |
KR101654997B1 (ko) * | 2014-12-24 | 2016-09-06 | 엘지전자 주식회사 | 인쇄회로기판 및 그 제조방법 |
CN116390341B (zh) * | 2023-05-26 | 2023-09-05 | 苏州浪潮智能科技有限公司 | 波峰焊器件、其制作方法以及印刷线路板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4339784A (en) | 1980-08-11 | 1982-07-13 | Rca Corporation | Solder draw pad |
GB8322473D0 (en) * | 1983-08-20 | 1983-09-21 | Int Computers Ltd | Printed circuit boards |
SE457838B (sv) | 1987-06-11 | 1989-01-30 | Ericsson Telefon Ab L M | Stift vilket aer fastsatt vid ett kretskort genom loedning |
US4835345A (en) | 1987-09-18 | 1989-05-30 | Compaq Computer Corporation | Printed wiring board having robber pads for excess solder |
JPH01300588A (ja) * | 1988-05-28 | 1989-12-05 | Nec Home Electron Ltd | プリント配線板及びそのはんだ付け方法 |
US5092035A (en) | 1990-09-10 | 1992-03-03 | Codex Corporation | Method of making printed circuit board assembly |
US5243143A (en) | 1990-11-13 | 1993-09-07 | Compaq Computer Corporation | Solder snap bar |
JPH04186794A (ja) * | 1990-11-20 | 1992-07-03 | Matsushita Electric Ind Co Ltd | 電子部品のハンダ付けパターンとその実装方法 |
US5227589A (en) | 1991-12-23 | 1993-07-13 | Motorola, Inc. | Plated-through interconnect solder thief |
US5604333A (en) | 1994-11-30 | 1997-02-18 | Intel Corporation | Process and structure for a solder thief on circuit boards |
-
1999
- 1999-03-13 KR KR1019990008509A patent/KR100319291B1/ko not_active IP Right Cessation
-
2000
- 2000-03-02 TW TW089103699A patent/TW488198B/zh active
- 2000-03-09 CN CNB001029177A patent/CN1164157C/zh not_active Expired - Fee Related
- 2000-03-10 US US09/522,844 patent/US6407342B1/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100362640C (zh) * | 2004-06-04 | 2008-01-16 | 英业达股份有限公司 | 防止半导体组件引脚焊接短路的方法 |
CN101541141B (zh) * | 2008-03-17 | 2010-09-22 | 英业达股份有限公司 | 印刷电路板及避免电气短路的方法 |
CN102744488A (zh) * | 2011-04-22 | 2012-10-24 | 鸿富锦精密工业(深圳)有限公司 | 焊接辅助装置 |
CN109047965A (zh) * | 2018-09-20 | 2018-12-21 | 北京机械设备研究所 | 一种多管脚封装器件的焊接工装及其使用方法 |
CN109047965B (zh) * | 2018-09-20 | 2021-02-19 | 北京机械设备研究所 | 一种多管脚封装器件的焊接工装及其使用方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20000060319A (ko) | 2000-10-16 |
KR100319291B1 (ko) | 2002-01-09 |
TW488198B (en) | 2002-05-21 |
CN1164157C (zh) | 2004-08-25 |
US6407342B1 (en) | 2002-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090109 Address after: Delaware Patentee after: Samsung Electronics Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Electronics Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: YUFA SCIENCE CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD Effective date: 20090109 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040825 Termination date: 20130309 |