CN1256509A - 切割装置 - Google Patents
切割装置 Download PDFInfo
- Publication number
- CN1256509A CN1256509A CN99126720A CN99126720A CN1256509A CN 1256509 A CN1256509 A CN 1256509A CN 99126720 A CN99126720 A CN 99126720A CN 99126720 A CN99126720 A CN 99126720A CN 1256509 A CN1256509 A CN 1256509A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- machine table
- cutter sweep
- cutting
- water discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP350069/1998 | 1998-12-09 | ||
JP35006998A JP3485816B2 (ja) | 1998-12-09 | 1998-12-09 | ダイシング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1256509A true CN1256509A (zh) | 2000-06-14 |
CN1137503C CN1137503C (zh) | 2004-02-04 |
Family
ID=18408024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991267206A Expired - Fee Related CN1137503C (zh) | 1998-12-09 | 1999-12-08 | 切割装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6358115B1 (zh) |
JP (1) | JP3485816B2 (zh) |
KR (1) | KR100626513B1 (zh) |
CN (1) | CN1137503C (zh) |
HK (1) | HK1026769A1 (zh) |
TW (1) | TW418453B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101870142A (zh) * | 2009-04-24 | 2010-10-27 | 株式会社东京精密 | 切割装置、切割装置组件和切割方法 |
CN103377909A (zh) * | 2012-04-17 | 2013-10-30 | 台湾积体电路制造股份有限公司 | 用于分割半导体晶圆的设备和方法 |
CN107262398A (zh) * | 2017-06-28 | 2017-10-20 | 南京律智诚专利技术开发有限公司 | 一种螺纹管切头分拣工装 |
CN108367402A (zh) * | 2015-12-18 | 2018-08-03 | 日本精工株式会社 | 生产线 |
CN108461585A (zh) * | 2018-03-22 | 2018-08-28 | 汪贤女 | 一种新型的半导体发光二极管制作设备 |
CN112536926A (zh) * | 2019-09-20 | 2021-03-23 | 小松Ntc株式会社 | 线锯及线锯的送入送出工件的方法 |
CN116654624A (zh) * | 2023-05-06 | 2023-08-29 | 大可精密齿轮(浙江)有限公司 | 一种曳引驱动减速器和晶圆输送装置 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3956643B2 (ja) * | 2001-04-27 | 2007-08-08 | 株式会社東京精密 | ダイシングマシン |
CA2401306C (en) * | 2001-09-13 | 2009-07-14 | Auto V Grooving Inc. | V grooving machine for natural or engineered stone |
JP2003151920A (ja) * | 2001-11-09 | 2003-05-23 | Disco Abrasive Syst Ltd | 切削機における被加工物位置合わせ方法 |
JP4631293B2 (ja) * | 2004-02-27 | 2011-02-16 | 信越半導体株式会社 | 半導体ウエーハの研磨装置及び研磨方法 |
JP4957078B2 (ja) | 2005-06-30 | 2012-06-20 | 日立工機株式会社 | 集塵カバー及びこれを備えたカッター |
JP4664788B2 (ja) * | 2005-09-26 | 2011-04-06 | 株式会社ディスコ | 切削装置 |
US7611401B1 (en) * | 2005-09-30 | 2009-11-03 | Column & Post, Inc. | Mount for a belt-sanding apparatus |
JP4478732B2 (ja) * | 2008-06-12 | 2010-06-09 | 株式会社東京精密 | ダイシング装置、ダイシング装置ユニット、及びダイシング方法 |
JP5404349B2 (ja) * | 2009-12-02 | 2014-01-29 | 株式会社東京精密 | ダイシング装置 |
DE102010010368A1 (de) * | 2010-03-05 | 2011-11-17 | Automatik Plastics Machinery Gmbh | Schneidvorrichtung für einen Granulator zum Schneiden von Granulat |
JP4761088B1 (ja) * | 2010-03-29 | 2011-08-31 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
CN102205912B (zh) * | 2011-04-19 | 2013-09-04 | 上海微松工业自动化有限公司 | 一种太阳能电池片的搬运装置 |
US8647966B2 (en) * | 2011-06-09 | 2014-02-11 | National Semiconductor Corporation | Method and apparatus for dicing die attach film on a semiconductor wafer |
CN102502254A (zh) * | 2011-10-19 | 2012-06-20 | 四川省绵阳西南自动化研究所 | 一种用于太阳能电池的自动分离上料装置 |
JP6101140B2 (ja) * | 2013-04-18 | 2017-03-22 | 株式会社ディスコ | 切削装置 |
JP2015020237A (ja) | 2013-07-18 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
JP6108999B2 (ja) * | 2013-07-18 | 2017-04-05 | 株式会社ディスコ | 切削装置 |
JP6069122B2 (ja) | 2013-07-22 | 2017-02-01 | 株式会社ディスコ | 切削装置 |
JP6719819B2 (ja) * | 2016-07-07 | 2020-07-08 | 株式会社ディスコ | チャックテーブル機構 |
CN108943458A (zh) * | 2017-05-27 | 2018-12-07 | 浙江集英精密机器有限公司 | 单晶硅棒转运装置及单晶硅棒转运方法 |
JP6740275B2 (ja) * | 2018-04-04 | 2020-08-12 | ファナック株式会社 | 清掃装置 |
CN108581605A (zh) * | 2018-05-18 | 2018-09-28 | 江苏沃元精密机械有限公司 | 一种金属切削床 |
CN109003927B (zh) * | 2018-09-13 | 2024-04-30 | 无锡奥特维科技股份有限公司 | 一种电池片掰片装置和方法以及电池片串焊机 |
JP7355618B2 (ja) * | 2018-12-04 | 2023-10-03 | 株式会社ディスコ | ウエーハ分割装置 |
JP7308621B2 (ja) * | 2019-02-19 | 2023-07-14 | 株式会社ディスコ | 搬送装置 |
JP7334066B2 (ja) * | 2019-05-28 | 2023-08-28 | 株式会社ディスコ | 加工装置 |
JP7203712B2 (ja) * | 2019-11-18 | 2023-01-13 | Towa株式会社 | 切断装置、及び、切断品の製造方法 |
JP7268650B2 (ja) * | 2020-07-01 | 2023-05-08 | 株式会社村田製作所 | 電子部品の製造方法 |
CN114559564A (zh) * | 2022-03-05 | 2022-05-31 | 九江金鹰科技有限公司 | 一种大理石加工用切割台及其切割方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030314A (ja) * | 1983-07-08 | 1985-02-15 | 富士通株式会社 | ダイシング装置 |
JPS60214911A (ja) | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | ダイシング装置 |
EP0532933B1 (en) * | 1991-08-21 | 1995-11-02 | Tokyo Seimitsu Co.,Ltd. | Blade position detection apparatus |
US5445559A (en) * | 1993-06-24 | 1995-08-29 | Texas Instruments Incorporated | Wafer-like processing after sawing DMDs |
JP3438369B2 (ja) * | 1995-01-17 | 2003-08-18 | ソニー株式会社 | 部材の製造方法 |
US5832585A (en) * | 1996-08-13 | 1998-11-10 | National Semiconductor Corporation | Method of separating micro-devices formed on a substrate |
KR100225909B1 (ko) * | 1997-05-29 | 1999-10-15 | 윤종용 | 웨이퍼 소잉 장치 |
SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
US6173750B1 (en) * | 1998-02-18 | 2001-01-16 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
US6165232A (en) * | 1998-03-13 | 2000-12-26 | Towa Corporation | Method and apparatus for securely holding a substrate during dicing |
-
1998
- 1998-12-09 JP JP35006998A patent/JP3485816B2/ja not_active Expired - Fee Related
-
1999
- 1999-11-02 TW TW088119073A patent/TW418453B/zh not_active IP Right Cessation
- 1999-12-06 KR KR1019990055095A patent/KR100626513B1/ko not_active IP Right Cessation
- 1999-12-07 US US09/456,123 patent/US6358115B1/en not_active Expired - Fee Related
- 1999-12-08 CN CNB991267206A patent/CN1137503C/zh not_active Expired - Fee Related
-
2000
- 2000-09-19 HK HK00105874A patent/HK1026769A1/xx not_active IP Right Cessation
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101870142A (zh) * | 2009-04-24 | 2010-10-27 | 株式会社东京精密 | 切割装置、切割装置组件和切割方法 |
CN101870142B (zh) * | 2009-04-24 | 2015-04-01 | 株式会社东京精密 | 切割装置、切割装置组件和切割方法 |
CN103377909A (zh) * | 2012-04-17 | 2013-10-30 | 台湾积体电路制造股份有限公司 | 用于分割半导体晶圆的设备和方法 |
CN103377909B (zh) * | 2012-04-17 | 2016-09-07 | 台湾积体电路制造股份有限公司 | 用于分割半导体晶圆的设备和方法 |
CN108367402A (zh) * | 2015-12-18 | 2018-08-03 | 日本精工株式会社 | 生产线 |
CN107262398A (zh) * | 2017-06-28 | 2017-10-20 | 南京律智诚专利技术开发有限公司 | 一种螺纹管切头分拣工装 |
CN108461585A (zh) * | 2018-03-22 | 2018-08-28 | 汪贤女 | 一种新型的半导体发光二极管制作设备 |
CN108461585B (zh) * | 2018-03-22 | 2019-02-15 | 佛山市安林电子有限公司 | 一种半导体发光二极管制作设备 |
CN112536926A (zh) * | 2019-09-20 | 2021-03-23 | 小松Ntc株式会社 | 线锯及线锯的送入送出工件的方法 |
CN116654624A (zh) * | 2023-05-06 | 2023-08-29 | 大可精密齿轮(浙江)有限公司 | 一种曳引驱动减速器和晶圆输送装置 |
CN116654624B (zh) * | 2023-05-06 | 2023-12-05 | 大可精密齿轮(浙江)有限公司 | 一种包括曳引驱动减速器的晶圆输送装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2000173953A (ja) | 2000-06-23 |
CN1137503C (zh) | 2004-02-04 |
JP3485816B2 (ja) | 2004-01-13 |
HK1026769A1 (en) | 2000-12-22 |
TW418453B (en) | 2001-01-11 |
KR100626513B1 (ko) | 2006-09-20 |
US6358115B1 (en) | 2002-03-19 |
KR20000047932A (ko) | 2000-07-25 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Applicant after: Taiyo Yuden Co., Ltd. Applicant after: Industrial Technology Research Institute Applicant before: Taiyo Yuden Co., Ltd. |
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COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: TAIYO YUDEN KK TO: TAIYO YUDEN KK; INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CI01 | Publication of corrected invention patent application |
Correction item: Inventor Correct: Liao Xinzhi False: Liao Xinzhi Number: 38 Volume: 18 Correction item: Inventor Correct: Liao Xinzhi False: Liao Xinzhi Number: 5 Page: 444 Volume: 20 |
|
CI03 | Correction of invention patent |
Correction item: Inventor Correct: Liao Xinzhi False: Liao Xinzhi Number: 5 Page: The title page Volume: 18 Correction item: Inventor Correct: Liao Xinzhi False: Liao Xinzhi Number: 38 Page: The title page Volume: 18 |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040204 Termination date: 20101208 |