CN1254159C - 柔性印刷电路板 - Google Patents
柔性印刷电路板 Download PDFInfo
- Publication number
- CN1254159C CN1254159C CN 02129879 CN02129879A CN1254159C CN 1254159 C CN1254159 C CN 1254159C CN 02129879 CN02129879 CN 02129879 CN 02129879 A CN02129879 A CN 02129879A CN 1254159 C CN1254159 C CN 1254159C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- overlay film
- parts
- film layer
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001251681A JP2003069163A (ja) | 2001-08-22 | 2001-08-22 | フレキシブルプリント基板 |
JP251681/2001 | 2001-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1404352A CN1404352A (zh) | 2003-03-19 |
CN1254159C true CN1254159C (zh) | 2006-04-26 |
Family
ID=19080287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02129879 Expired - Fee Related CN1254159C (zh) | 2001-08-22 | 2002-08-20 | 柔性印刷电路板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2003069163A (ja) |
CN (1) | CN1254159C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106465548A (zh) * | 2014-05-13 | 2017-02-22 | 株式会社村田制作所 | 树脂密封型模块 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4525065B2 (ja) * | 2003-12-11 | 2010-08-18 | セイコーエプソン株式会社 | 電気光学装置及びその製造方法、電子機器 |
JP2006237320A (ja) * | 2005-02-25 | 2006-09-07 | Toshiba Matsushita Display Technology Co Ltd | フレキシブル実装基板 |
JP2009094349A (ja) * | 2007-10-10 | 2009-04-30 | Nok Corp | フレキシブルプリントサーキットへの構成部品の実装方法 |
JP5150761B1 (ja) | 2011-11-10 | 2013-02-27 | 株式会社東芝 | 電子機器 |
CN102625581B (zh) * | 2012-03-14 | 2014-11-05 | 华为终端有限公司 | 柔性电路板及其制造方法 |
JP7427378B2 (ja) * | 2019-06-11 | 2024-02-05 | 三菱電機エンジニアリング株式会社 | プリント基板 |
JP7315523B2 (ja) * | 2020-12-04 | 2023-07-26 | 矢崎総業株式会社 | 端子の固着方法 |
-
2001
- 2001-08-22 JP JP2001251681A patent/JP2003069163A/ja not_active Withdrawn
-
2002
- 2002-08-20 CN CN 02129879 patent/CN1254159C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106465548A (zh) * | 2014-05-13 | 2017-02-22 | 株式会社村田制作所 | 树脂密封型模块 |
CN106465548B (zh) * | 2014-05-13 | 2019-04-02 | 株式会社村田制作所 | 树脂密封型模块 |
Also Published As
Publication number | Publication date |
---|---|
JP2003069163A (ja) | 2003-03-07 |
CN1404352A (zh) | 2003-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060426 Termination date: 20180820 |