CN1249826A - 液态光敏组合物 - Google Patents
液态光敏组合物 Download PDFInfo
- Publication number
- CN1249826A CN1249826A CN98803003A CN98803003A CN1249826A CN 1249826 A CN1249826 A CN 1249826A CN 98803003 A CN98803003 A CN 98803003A CN 98803003 A CN98803003 A CN 98803003A CN 1249826 A CN1249826 A CN 1249826A
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- CN
- China
- Prior art keywords
- composition
- weight
- acrylate
- light
- propylene glycol
- Prior art date
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- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 57
- 239000007788 liquid Substances 0.000 title claims abstract description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 54
- -1 acrylate compound Chemical class 0.000 claims abstract description 18
- 239000011230 binding agent Substances 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 17
- 229920003023 plastic Polymers 0.000 claims description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 15
- 150000002148 esters Chemical class 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 claims description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 abstract description 4
- 229920000147 Styrene maleic anhydride Polymers 0.000 abstract description 4
- 229920001577 copolymer Polymers 0.000 abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 239000004258 Ethoxyquin Substances 0.000 description 7
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 description 7
- 229940093500 ethoxyquin Drugs 0.000 description 7
- 235000019285 ethoxyquin Nutrition 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 6
- 235000015511 Liquidambar orientalis Nutrition 0.000 description 5
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 5
- 241000736148 Styrax Species 0.000 description 5
- 239000004870 Styrax Substances 0.000 description 5
- 235000000126 Styrax benzoin Nutrition 0.000 description 5
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- XMRVWZWPAZDNDY-UHFFFAOYSA-N (4,4-diamino-2,3,5,6-tetraethylcyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound CCC1=C(CC)C(N)(N)C(CC)C(CC)=C1C(=O)C1=CC=CC=C1 XMRVWZWPAZDNDY-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000013530 defoamer Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- DMKSVUSAATWOCU-HROMYWEYSA-N loteprednol etabonate Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@@](C(=O)OCCl)(OC(=O)OCC)[C@@]1(C)C[C@@H]2O DMKSVUSAATWOCU-HROMYWEYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000011941 photocatalyst Substances 0.000 description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 description 3
- 229940124530 sulfonamide Drugs 0.000 description 3
- SKDGWNHUETZZCS-UHFFFAOYSA-N 2,3-ditert-butylphenol Chemical compound CC(C)(C)C1=CC=CC(O)=C1C(C)(C)C SKDGWNHUETZZCS-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- OELQSSWXRGADDE-UHFFFAOYSA-N 2-methylprop-2-eneperoxoic acid Chemical compound CC(=C)C(=O)OO OELQSSWXRGADDE-UHFFFAOYSA-N 0.000 description 2
- 241001597008 Nomeidae Species 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- OKLHTLFIYQJNLH-SREVYHEPSA-N (Z)-4-oxo-4-(2-phenylacetyl)oxybut-2-enoic acid Chemical compound C(\C=C/C(=O)O)(=O)OC(CC1=CC=CC=C1)=O OKLHTLFIYQJNLH-SREVYHEPSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- OJRYAOYVYFKEPI-UHFFFAOYSA-N 2,2-dimethylbutane;2-methylprop-2-enoic acid Chemical compound CCC(C)(C)C.CC(=C)C(O)=O OJRYAOYVYFKEPI-UHFFFAOYSA-N 0.000 description 1
- RROZRFLLVCBVQB-UHFFFAOYSA-N 2,4-dihydroxy-2,4-dimethyl-1,5-bis(4-propan-2-ylphenyl)pentan-3-one Chemical compound C1=CC(C(C)C)=CC=C1CC(C)(O)C(=O)C(C)(O)CC1=CC=C(C(C)C)C=C1 RROZRFLLVCBVQB-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XFVADDTYCSRMBF-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CCC(CO)(CO)CO XFVADDTYCSRMBF-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N 4-methylcyclohexan-1-ol Chemical compound CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- YVPZFPKENDZQEJ-UHFFFAOYSA-N 4-propylcyclohexan-1-ol Chemical compound CCCC1CCC(O)CC1 YVPZFPKENDZQEJ-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical class CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000000641 acridinyl group Chemical class C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229940027998 antiseptic and disinfectant acridine derivative Drugs 0.000 description 1
- JVASZXZJOJUKDT-UHFFFAOYSA-N bis(1-aminocyclohexa-2,4-dien-1-yl)methanone Chemical compound C1C=CC=CC1(N)C(=O)C1(N)CC=CC=C1 JVASZXZJOJUKDT-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 229960003511 macrogol Drugs 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229940117969 neopentyl glycol Drugs 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- JLFNLZLINWHATN-UHFFFAOYSA-N pentaethylene glycol Chemical compound OCCOCCOCCOCCOCCO JLFNLZLINWHATN-UHFFFAOYSA-N 0.000 description 1
- WHPGTGCDKMKRNH-UHFFFAOYSA-N phosphanylformaldehyde Chemical compound PC=O WHPGTGCDKMKRNH-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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Abstract
一种光敏组合物,其在室温下为液态并包括a)以苯乙烯-马来酸酐半酯共聚物为基础的18-22重量%的粘合剂聚合物,b)10-15重量%的至少一种光固化丙烯酸酯化合物,c)0.1-10重量%的光引发剂,和d)45-70重量%的丙二醇半酯或丙二醇半醚(halfether),组合物a)至d)的总和为100重量%,适于生产含光致结构的(photostructured)物体,优选地适合生产电话卡。
Description
液态光敏组合物
本发明涉及一种光敏组合物,其在室温下为液态,并包括一种粘合剂聚合物,至少一种光固化丙烯酸酯化合物和一种丙二醇半酯或丙二醇半醚溶剂,并且涉及该组合物在光致结构物体生产中的应用,例如信用卡、身份证或电话卡,优选地用于以含金属核的塑料表面为基础的电话卡。
目前,干抗蚀膜用于生产电话卡。当将固体光致抗蚀剂用于光致结构时,层厚最小可达38-70μm。与液态抗蚀剂相比,这个厚度比不能生成高分辨率电路线的层厚高4-10倍。
到现在为止,光致抗蚀剂层经过应用于含金属核的塑料表面的紫外光曝光和显影之后,液态抗蚀剂残余的部分使核失活并阻碍下一步的无电流金属涂敷。
现在发现,在室温下是液态并包括以苯乙烯-马来酸酐半酯共聚物为基础的粘合剂聚合物,至少一种光固化丙烯酸酯化合物和丙二醇半酯或丙二醇半醚溶剂的光敏组合物的使用不会导致上述的缺点,即存在于塑料表面的金属核活跃得足以进行显影之后的下一步金属镀过程,特别是当使用钯核时。使用新的液态组合物还有一个好处是可能使用相对更薄的层厚,这样光致抗蚀剂在紫外曝光后的显影过程变得更经济和更有利于生态环境。
因此,本发明涉及光敏组合物,其在室温下是液态并包括:
a)18-22重量%的以苯乙烯-马来酸酐半酯共聚物为基础的粘合剂聚合物,
b)10-15重量%的至少一种光固化丙烯酸酯化合物,
c)0.1-10重量%的光引发剂,以及
d)45-70重量%的丙二醇半酯或丙二醇半醚,成分a)至d)的总量为100重量%。
本发明的组合物优选地包括:
a)18-22重量%的以苯乙烯-马来酸酐半酯共聚物为基础的粘合剂聚合物,
b)11.5-14.5重量%的至少一种光固化丙烯酸酯化合物,
c)1-5重量%的光引发剂,以及
d)50-68重量%的丙二醇半酯或丙二醇半醚。
作为粘合剂在新的组合物中使用的苯乙酸-马来酸酐半酯共聚物是已知的并且其中某些有商品供应,例如Monsanto的商标名Scriptset550E。
新的组合物优选地包括作为粘合剂聚合物的苯乙烯-马来酸酐半酯共聚物,如通式1所示,其平均分子量为10000-30000。
本发明的组合物中成分(b)的光固化丙烯酸酯化合物也是已知的并有商品供应,例如以商标SARTOMER和EBECRYL提供。
新组合物中的丙烯酸酯化合物可以是脂肪族、芳香族或脂环族的二(甲基)丙烯酸酯或含至少3个官能团的多(甲基)丙烯酸酯。丙烯酸酯化合物(b)也可以是含2-4个官能团的聚氨酯(甲基)丙烯酸酯(urethane(meth)acrylates)。
合适的丙烯酸酯化合物(b)是,例如,脂肪族或脂环族二醇的二丙烯酸酯和二甲基丙烯酸酯,如1,3-丁二醇,1,4-丁二醇,新戊二醇,1,6-己二醇,二乙二醇,三乙二醇,四乙二醇,聚乙二醇400,聚乙二醇600,二缩三(丙二醇),乙氧基化或丙氧基化新戊二醇,1,4-二羟基甲基环己烷,2,2-双(4-羟基环己基)丙烷或双(4-羟基环己基)甲烷。
可以用在新组合物中的多官能团丙烯酸酯类是,例如:1,1,1-三甲基丙烷三丙烯酸酯或三甲基丙烷甲基丙烯酸酯,乙氧化1,1,1三羟甲基丙烷三丙烯酸酯或1,1,1-三羟甲基丙烷甲基丙烯酸酯,季戊四醇四丙烯酸酯,季戊四醇单羟基三丙烯酸酯或季戊四醇单羟基甲基丙烯酸酯,二季戊四醇单羟基三丙烯酸酯或二季戊四醇单羟基甲基丙烯酸酯。这些化合物可以从下列方式得到,例如,Sartomer公司的产品名SR-295,SR-350,SR-351,SR-367,SR-399,SR-444和SR-454。
用于新组合物的优选芳香族二(甲基)丙烯酸酯类是以双酚A和双酚F为基础的二(甲基)丙烯酸酯或也是烷氧化的二(甲基)丙烯酸酯,优选地是乙氧化或丙氧化的,双酚A或双酚F。这些单体的或齐聚体的二(甲基)丙烯酸酯也是已知的并且某些有商品供应,例如,Sartomer公司以产品名称SR-348供应的乙氧化双酚A二甲基丙烯酸酯和以产品名SR-349提供的乙氧化双酚A二丙烯酸酯。
能在新组合物中使用的聚氨酯(甲基)丙烯酸酯类也被技术人员所知,并可用已知的方法制备,例如,用羟基-封端的聚氨酯和丙烯酸或甲基丙烯酸反应制备相应的聚氨酯-(甲基)丙烯酸酯,或用异氰酸酯封端的预聚物和羟烷基(甲基)丙烯酸酯反应制备相应的聚氨酯-(甲基)丙烯酸酯。这些制备方法特别公开于已公布的EP专利申请No.114982和133908中。
新组合物中的成分b)优选地为一种脂肪族丙烯酸酯,脂环族丙烯酸酯或聚氨酯丙烯酸酯。
新组合物中的成分b)特别优选地为不同的优选丙烯酸酯的混合物。
合适的光引发剂(c)原则上是通常用于光聚合的引发剂,优选地是那些在曝光时生成自由基的引发剂。
已知的常用光引发剂化合物是,例如,安息香类,安息香醚类,如安息香,安息香甲醚,安息香乙醚和安息香异丙醚,安息香苯醚和安息香乙酸酯,苯乙酮类,如苯乙酮,2,2-二甲基苯乙酮,和1,1-二氯苯乙酮,二苯基乙二酮,二苯乙二酮缩醇类,如二苯乙二酮二甲基缩醇和二苯乙二酮二乙基缩醇,这些由Ciba Spezialittenchemie公司以商标Irgacure提供商品,蒽醌类,如2-甲基蒽醌,2-乙基蒽醌,2-叔丁基蒽醌,1-氯蒽醌和2-戊基蒽醌,三苯基膦,氧化苯甲酰膦(Luzirin TPO),二苯甲酮类,如二苯甲酮和4,4’-双(N,N’-二甲基氨基)二苯甲酮,噻吨酮类或呫吨酮类,吖啶衍生物类,吩嗪衍生物类,喹喔啉衍生物类或1-苯基-1,2-丙二酮-2-O-苯甲酰肟,1-氨基苯基酮类或1-羟基苯基酮类,如1-羟基环己基苯基酮,苯基-(1-羟基异丙基)酮和4-异丙基-苯基-(1-羟基异丙基)酮,以及2-苄基-2,2-二甲氨基-1-(4-N-吗啉代苯基)-丁-1-酮,这些均为已知化合物并且其中一些有商品供应。
就光引发剂(c)来说,尤其优选使用以Irgacure商标提供的商品光引发剂,例如二苯乙二酮二甲基缩醇,二苯乙二酮二乙基缩醇和2-苄基-2,2-二甲氨基-1-(4-N-吗啉代苯基)丁-1-酮。
众所周知,光引发剂以有效量加入组合物中,即以组合物总量的0.1-10重量百分数加入。
新组合物也可包括各类不同的光引发剂,这些光引发剂对不同波长的射线具有不同的光敏度。这样就可能,例如,更好的利用发射不同波长光线的紫外/可见光源。
在新组合物中作为成分(d)使用的丙二醇半酯或丙二醇半醚,如1-丙氧基-2-丙醇,也是有商品供应的已知化合物。
新组合物中的成分(d)优选地是丙二醇半醚。
如果希望,常用的添加剂也可被加入到新组合物中,例如稳定剂,如紫外稳定剂,阻聚剂,分离剂,润湿剂,流量控制剂,光敏剂,防沉淀剂,表面活性剂,染料,颜料或填料。
新组合物可被光化学光照射固化,例如用电子射线或X-射线,紫外或可见光的方法,通常使用波长范围280-650nm的光。
因此,本发明也涉及新型液态光敏组合物作为光致抗蚀剂在光致结构物体生产中的应用,如信用卡,身份证或电话卡,尤其用于电话卡的生产。
正如在开头时所提到的那样,新的组合物具有以相对更薄的涂层使用的优点并且已曝光的塑料板在碱性显影液中,已曝光区域能够完全除去以便曝露出来的金属核有活性进行下一步的金属镀。由于其低的层厚度,新的组合物另外也能作为永久性抗蚀剂用于电话卡的生产,通常的剥离过程被省去了以便含有余下的光致抗蚀剂的塑料板和结构金属层能够在金属镀过程之后被立即涂以表面涂层。
本发明的另一个优选目标因此是一种以含金属核的塑料面为基础的电话卡生产方法,尤其是含钯核的塑料面,该法包括将新组合物以5-20μm的层厚涂于含金属核的塑料板上,优选的层厚为大约10μm,将其通过提供希望结构的掩膜对光化学光曝光,在碱水浴中显影已曝光的塑料板,然后,在化学镀金属浴中,将0.2-0.3μm的镍层镀在显影过程中曝露出来的金属核上,然后,在电镀浴中,将5-20μm的Sn/Pb层镀在镍层上以使显影之后余下的新组合物部分和结构塑料板上的Sn/Pb层有相同的层厚,接着将结构塑料板涂以涂层。
由含钯核的塑料表面组成的片或板为已知的并且可以,例如,按照Atotech的操作说明处理塑料板而生产,该操作使用一种例如含有钯的活化剂Neoganth834的特别溶液浴,然后,经过彻底的水洗之后,进一步用如还原剂Neoganth处理以获得下一步金属化所需的金属核。
将含金属核的塑料面以化学方法镀上一层镍,然后也用已知的方法完成了在镍层上镀,例如,Sn/Pb层。理想的镍层是,例如仅仅将含金属核的塑料板放入含有20-30%镍盐溶液的镀金属浴中获得的。
在镍层上制备Sn/Pb层也可用已知的方法进行,由大约60%的锡和40%的铅组成的合金被用电镀浴的方法,例如用22-28℃和1-3伏特下的1-8A/dm2阴极电流密度从锡/铅溶液中分离。
结构塑料板上的涂层用通常的方法制备,例如用可固化的表面涂层,优选地使用喷涂方法。
本发明因此也与上述方法获得的电话卡有关。液态光敏组合物的常用制法说明
在装有Pendraulic搅拌(700-1000转/分)的200升不锈钢锅中,下列成分首先溶解在50-68kg的1-丙氧基-2-丙醇中10分钟以上:
8-9kg丙烯酸酯SartomerSR 454(乙氧化三甲基丙烷三丙烯酸酯,Sartomer公司产),
3-4kg丙烯酸酯Ebecryl220(聚氨酯丙烯酸酯齐聚物,RadcureUCB产),
0.5-1.5kg丙烯酸酯NK OLIGO UA-9 P(包含60-63重量%的聚氨酯丙烯酸酯,12-15重量%的季戊四醇四丙烯酸酯和25重量%的丙二醇单乙醚的混合物,Shin-Nakamura Chemical产),以及,
0.1-0.2kg的消泡剂Airex900(充填了石英粉的聚硅氧烷,Tego产)。
在此溶液中接着加入下列物质搅拌15分钟以上
18-22kg粘合剂共聚物Scripset550 E(苯乙烯-马来酸酐共聚物,Monsanto产),
并使其溶解。
接着在该溶液中加入
0.02-0.04kg 2,6-二叔丁基-对甲苯酚,Shell产,
0.3-0.8kg DEABP(四乙基-4,4-二氨基二苯甲酮,BASF产),
1-1.8 kg光催化剂Irgacure369(2-苄基-2,2-二甲氨基-4’-吗啉代-丙基苯基甲酮,Ciba Spezialittenchemie产),
0.3-0.4kg三芳基甲烷Pergascript蓝S-RB染料(双丙烯酰基咔唑基甲烷化合物,Ciba Spezialittenchemie产),
0.2-0.3kg三嗪A([4-(4-甲氧基苯基)-4,6-双(三氯甲基)-1,3,5-三嗪],PACS产),以及
0.1-0.5kg Orasolblau GU(酞菁异丙基-3-磺酰胺铜,CibaSpezialittenchemie产)。
这样制得的混合物搅拌60分钟使均匀,混合物的温度保持在35℃以下。
实例1
下列物质的用法与通常的制备说明相似:
6.934kg丙烯酸酯SartomerSR 454(乙氧化三甲基丙烷三丙烯酸酯,Sartomer公司产),
6.892kg丙烯酸酯Ebecryl220(聚氨酯丙烯酸酯,Radcure UCB产),
2.100kg丙烯酸酯NK OLIGO UA-9 P(包含60-63重量%的聚氨酯丙烯酸酯,12-15重量%的季戊四醇四丙烯酸酯和25重量%的丙二醇单乙醚的混合物,Shin-Nakamura化学产),以及
0.310kg的消泡剂Airex900(充填了硅酸的聚硅氧烷,Tego产)并在搅拌下溶解于60.743 kg1-丙氧基-2-丙醇中,搅拌10分钟以上。
在该溶液中缓慢加入,搅拌约15分钟以上
17.562kg粘合剂共聚物Scripset550 E(苯乙烯-马来酸酐共聚物,Monsanto产)。接着,加入
0.029kg 2,6-二叔丁基对甲苯酚,
0.740kg四乙基-4,4-二氨基二苯甲酮(DEABP,BASF产),
1.780kg光催化剂Irgacure369(2-苄基-2,2-二甲氨基-4’-吗啉代-丙基苯基酮,Ciba Spezialittenchemie产),
0.400kg三芳基甲烷Pergascript蓝S-RB染料(双丙烯酰基咔唑基甲烷化合物,Ciba Spezialittenchemie产),
0.300kg 4-(4-甲氧基苯基)-4,6-双(三氯甲基)-1,3,5-三嗪],以及
0.400kg酞菁异丙基-3-磺酰胺铜(Orasolblau GN,CibaSpezialit-tenchemie产)。
这样制得的混合物搅拌60分钟使均匀,混合物的温度保持在35℃以下。
25℃下粘度 =0.285Pa·S
曝光量 =120mj/cm2
在1.0%Na2CO3水溶液中30℃下显影30秒,
分辨率 =12μm线对
Stouffer梯级 =7(最大21)实例2
下列物质的用法与通常的制备说明相似:
4.123kg丙烯酸酯SartomerSR 454(乙氧化三甲基丙烷三丙烯酸酯,Sartomer公司产),
8.672kg丙烯酸酯Ebecryl220(聚氨酯丙烯酸酯,Radcure UCB产),
1.100kg丙烯酸酯NK OLIGO UA-9 P(包含60-63重量%的聚氨酯丙烯酸酯,12-15重量%的季戊四醇四丙烯酸酯和25重量%的丙二醇单乙醚的混合物,Shin-Nakamura Chemical产),以及
0.310kg的消泡剂Airex900(充填了硅酸的聚硅氧烷,Tego产),
并在搅拌下溶解于62.553kg1-丙氧基-2-丙醇中,搅拌10分钟以上。
在该溶液中缓慢加入,搅拌约15分钟以上
19.272kg粘合剂共聚物Scripset 550 E(苯乙烯-马来酸酐共聚物,Monsanto产)。接着,加入
0.029kg 2,6-二叔丁基对甲苯酚,
0.740kg四乙基-4,4-二氨基二苯甲酮(DEABP,BASF产),
1.780kg光催化剂Irgacure369(2-苄基-2,2-二甲氨基-4’-吗啉代-丙基苯基甲酮,Ciba Spezialittenchemie产),
0.400kg三芳基甲烷Pergascript蓝S-RB染料(双丙烯酰基咔唑基甲烷化合物,Ciba Spezialittenchemie产),
0.300kg 4-(4-甲氧基苯基)-4,6-双(三氯甲基)-1,3,5-三嗪],以及
0.400kg酞菁异丙基-3-磺酰胺铜(Orasolblau GN,CibaSpezialit-tenchemie产)。
这样制得的混合物搅拌60分钟使均匀,混合物的温度保持在35℃以下。
25℃下粘度 =0.234Pa·S
曝光量 =120mj/cm2
在1.0%的Na2CO3水溶液中30℃下显影30秒
分辨率 =15μm线对
Stouffer梯级 =7(最大21)使用实例:生产电话卡
使用双面滚动涂布机,实例1中制成的已溶解的组合物涂布在含钯核的ABS板上,按照ATOTECH的操作说明生产,使用活化剂Neoganth834和还原剂Neoganth。组合物在80℃的烘箱中干燥4分钟之后,这样制得的膜层厚10μm。
干燥后的膜板接着通过成像掩膜对紫外光曝光,光能量为150-250mj/cm2。曝过光的板接着在0.66-0.86%含20-30%NiCl2溶液中显影,0.2-0.3μm的镍层接着在2分钟内被镀在曝露的钯核上,然后,在ATOTECH的含有锡溶液Sulfolyt和铅溶液Sulfolyt的电镀浴中,在1-8A/dm2的电流密度,1-3伏特和22-28℃下,10μm的Sn/Pb层被镀在镍层上,ABS板含有相等厚度的抗蚀剂和金属层,以便可以省去除去抗蚀剂层的剥离过程。用该法构造的ABS板接着进行表面涂饰,电话卡制作完成。
Claims (11)
1.一种室温下是液态的光敏组合物,其包括
a)18-22重量%的以苯乙烯-马来酸酐半酯共聚物为基础的粘合剂聚合物,
b)10-15重量%的至少一种光固化丙烯酸酯化合物,
c)0.1-10重量%的先引发剂,以及
d)45-70重量%的丙二醇半酯或丙二醇半醚,成分a)至d)的总和为100重量%。
2.根据权利要求1的组合物,其包括
b)11.5-14.5重量%的至少一种光固化丙烯酸酯化合物,
c)1-5重量%的光引发剂,以及
d)50-68重量%的丙二醇半酯或丙二醇半醚。
4.根据权利要求1的组合物,其中成分b)是脂肪族丙烯酸酯,脂环族丙烯酸酯或聚氨酯丙烯酸酯。
5.根据权利要求4的组合物,其中成分b)是不同丙烯酸酯的混合物。
6.根据权利要求1的组合物,其中成分c)是在曝光时生成自由基的光引发剂。
7.根据权利要求1的组合物,其中成分c)是二苯乙二酮二甲基缩醇,二苯乙二酮二乙基缩醇或2-苄基-2,2-二甲氨基-1-(4-N-吗啉代苯基)丁-1-酮。
8.根据权利要求1的组合物在生产光致结构的物体上的应用。
9.根据权利要求1的组合物在生产电话卡上的应用。
10.从含金属核的塑料面生产电话卡的方法,该方法包括将权利要求1中要求的组合物以5-20μm的层厚涂于含金属核的塑料板上,将其通过提供希望结构的掩膜对光化学光曝光,曝过光的塑料板在碱性浴中显影,接着在化学镀金属浴中,将0.2-0.3μm的镍层镀在显影过程中暴露出来的金属核上,接着,在电镀浴中,将5-20μm的Sn/Pb层镀在镍层上,以便这些显影之后余下的新组合物部分和结构塑料板上的Sn/Pb层有相同的层厚,接下来将涂层涂在结构塑料板上。
11.用权利要求10中要求的方法制得的电话卡。
Applications Claiming Priority (2)
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CH130297 | 1997-06-02 | ||
CH1302/1997 | 1997-06-02 |
Publications (2)
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CN1249826A true CN1249826A (zh) | 2000-04-05 |
CN1115595C CN1115595C (zh) | 2003-07-23 |
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CN98803003A Expired - Fee Related CN1115595C (zh) | 1997-06-02 | 1998-05-22 | 液态光敏组合物 |
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US (1) | US6066435A (zh) |
EP (1) | EP0986776B1 (zh) |
JP (1) | JP3940962B2 (zh) |
KR (1) | KR100499835B1 (zh) |
CN (1) | CN1115595C (zh) |
AT (1) | ATE232992T1 (zh) |
CA (1) | CA2276104A1 (zh) |
DE (1) | DE69811491T2 (zh) |
HK (1) | HK1025396A1 (zh) |
TW (1) | TW445279B (zh) |
WO (1) | WO1998055899A1 (zh) |
Cited By (1)
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CN103045014A (zh) * | 2013-01-25 | 2013-04-17 | 深圳市万佳原丝印器材有限公司 | 自干感光抗酸蚀抗电镀油墨及其制备方法 |
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US6643001B1 (en) * | 1998-11-20 | 2003-11-04 | Revco, Inc. | Patterned platelets |
KR100642796B1 (ko) * | 1998-12-07 | 2006-11-10 | 가부시키가이샤 티오테크노 | 유기색소배합 광촉매피막용 코팅액 |
JP2002148802A (ja) * | 2000-11-07 | 2002-05-22 | Tokyo Ohka Kogyo Co Ltd | サンドブラスト用感光性組成物及びそれを用いた感光性フィルム |
US7732118B2 (en) * | 2007-05-10 | 2010-06-08 | Eastman Kodak Company | Negative-working imageable elements and methods of use |
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CA1127340A (en) * | 1977-12-30 | 1982-07-06 | Kohtaro Nagasawa | Photocurable light-sensitive composition and material |
US4269933A (en) * | 1978-06-08 | 1981-05-26 | E. I. Du Pont De Nemours And Company | Methods of developing photopolymerizable compositions containing an 0-nitroaromatic compound as photoinhibitor |
JPS5633640A (en) * | 1979-08-28 | 1981-04-04 | Arai Tokuji | Photopolymerizable photosensitive resin composition and photosensitive sheet structure containing layer of such composition |
US4472019A (en) * | 1982-12-28 | 1984-09-18 | Desoto, Inc. | Topcoats for buffer-coated optical fiber using urethane acrylate and epoxy acrylate and vinyl monomer |
CA1246290A (en) * | 1983-06-30 | 1988-12-06 | Claiborn L. Osborn | Polyol/isocyanate/lactone-acrylate adduct compositions as curable coatings |
US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards |
US4845011A (en) * | 1987-10-23 | 1989-07-04 | Hoechst Celanese Corporation | Visible light photoinitiation compositions |
JPH0820733B2 (ja) * | 1988-08-11 | 1996-03-04 | 富士写真フイルム株式会社 | ドライフイルムレジスト用光重合性組成物 |
JP3220498B2 (ja) * | 1992-03-06 | 2001-10-22 | 岡本化学工業株式会社 | 光重合性組成物 |
US5609991A (en) * | 1995-02-10 | 1997-03-11 | Morton International, Inc. | Photoimageable composition having improved alkaline process resistance and tack-free surface for contact imaging |
EP0740208A1 (en) * | 1995-04-27 | 1996-10-30 | Minnesota Mining And Manufacturing Company | Aqueous developable color proofing elements |
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1998
- 1998-05-11 US US09/075,638 patent/US6066435A/en not_active Expired - Lifetime
- 1998-05-22 CA CA002276104A patent/CA2276104A1/en not_active Abandoned
- 1998-05-22 AT AT98932073T patent/ATE232992T1/de not_active IP Right Cessation
- 1998-05-22 WO PCT/EP1998/003034 patent/WO1998055899A1/en active IP Right Grant
- 1998-05-22 KR KR10-1999-7011210A patent/KR100499835B1/ko not_active IP Right Cessation
- 1998-05-22 JP JP50140699A patent/JP3940962B2/ja not_active Expired - Fee Related
- 1998-05-22 DE DE69811491T patent/DE69811491T2/de not_active Expired - Lifetime
- 1998-05-22 CN CN98803003A patent/CN1115595C/zh not_active Expired - Fee Related
- 1998-05-22 EP EP98932073A patent/EP0986776B1/en not_active Expired - Lifetime
- 1998-06-01 TW TW087108509A patent/TW445279B/zh not_active IP Right Cessation
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Cited By (2)
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CN103045014A (zh) * | 2013-01-25 | 2013-04-17 | 深圳市万佳原丝印器材有限公司 | 自干感光抗酸蚀抗电镀油墨及其制备方法 |
CN103045014B (zh) * | 2013-01-25 | 2015-01-14 | 深圳市万佳原丝印器材有限公司 | 自干感光抗酸蚀抗电镀油墨及其制备方法 |
Also Published As
Publication number | Publication date |
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DE69811491T2 (de) | 2003-07-24 |
HK1025396A1 (en) | 2000-11-10 |
WO1998055899A1 (en) | 1998-12-10 |
CA2276104A1 (en) | 1998-12-10 |
US6066435A (en) | 2000-05-23 |
JP2002502507A (ja) | 2002-01-22 |
JP3940962B2 (ja) | 2007-07-04 |
ATE232992T1 (de) | 2003-03-15 |
DE69811491D1 (de) | 2003-03-27 |
EP0986776B1 (en) | 2003-02-19 |
TW445279B (en) | 2001-07-11 |
KR100499835B1 (ko) | 2005-07-08 |
EP0986776A1 (en) | 2000-03-22 |
KR20010013220A (ko) | 2001-02-26 |
CN1115595C (zh) | 2003-07-23 |
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