CN1232515C - 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物 - Google Patents

包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物 Download PDF

Info

Publication number
CN1232515C
CN1232515C CNB018085059A CN01808505A CN1232515C CN 1232515 C CN1232515 C CN 1232515C CN B018085059 A CNB018085059 A CN B018085059A CN 01808505 A CN01808505 A CN 01808505A CN 1232515 C CN1232515 C CN 1232515C
Authority
CN
China
Prior art keywords
methyl
dimethyl
tetraene
trimethyl
ethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018085059A
Other languages
English (en)
Chinese (zh)
Other versions
CN1427831A (zh
Inventor
E·K·雅格尔
P·T·克莱玛兹科
A·D·麦萨纳
A·特莱斯－菲尔赫
T·多巴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of CN1427831A publication Critical patent/CN1427831A/zh
Application granted granted Critical
Publication of CN1232515C publication Critical patent/CN1232515C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D493/00—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system
    • C07D493/02—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system in which the condensed system contains two hetero rings
    • C07D493/08—Bridged systems
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/06—Polythioethers from cyclic thioethers
    • C08G75/08—Polythioethers from cyclic thioethers from thiiranes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Epoxy Compounds (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNB018085059A 2000-03-31 2001-03-27 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物 Expired - Fee Related CN1232515C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19354200P 2000-03-31 2000-03-31
US60/193,542 2000-03-31

Publications (2)

Publication Number Publication Date
CN1427831A CN1427831A (zh) 2003-07-02
CN1232515C true CN1232515C (zh) 2005-12-21

Family

ID=22714049

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018085059A Expired - Fee Related CN1232515C (zh) 2000-03-31 2001-03-27 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物

Country Status (8)

Country Link
EP (1) EP1268457A4 (ja)
JP (1) JP2003529643A (ja)
KR (1) KR100790081B1 (ja)
CN (1) CN1232515C (ja)
AU (1) AU2001247541A1 (ja)
CA (1) CA2403595A1 (ja)
MX (1) MXPA02009639A (ja)
WO (1) WO2001074798A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
WO2006043608A1 (ja) * 2004-10-20 2006-04-27 Kansai Paint Co., Ltd. ポリエポキシ化合物、その製造方法、それを含有する熱硬化性樹脂組成物、該組成物の硬化物、及び該硬化物の除去方法
JP4890872B2 (ja) * 2006-01-30 2012-03-07 ルネサスエレクトロニクス株式会社 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置
JP4816333B2 (ja) * 2006-08-28 2011-11-16 パナソニック電工株式会社 半導体装置の製造方法
ES2400633T3 (es) 2008-11-24 2013-04-11 Basf Se Composición curable que comprende una base termolatente
JP5767540B2 (ja) * 2011-09-14 2015-08-19 積水化学工業株式会社 エピスルフィド樹脂材料であるｂステージフィルム、多層基板及び積層フィルム
WO2014058523A1 (en) * 2012-10-11 2014-04-17 Prc-Desoto International, Inc. Coating/sealant systems, aqueous resinous dispersions, methods for making aqueous resinous dispersions, and methods of electrocoating
JP2016029152A (ja) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、及び硬化物
JP2020063343A (ja) * 2018-10-16 2020-04-23 日東シンコー株式会社 樹脂組成物
CN113336946B (zh) * 2021-06-21 2022-10-11 湖北固润科技股份有限公司 诺卜醇生物基含硅氧杂环丁烷单体及其制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378522A (en) * 1961-11-29 1968-04-16 Shell Oil Co Epithio compounds, their preparation and polymers
US4379728A (en) * 1982-02-04 1983-04-12 W. R. Grace & Co. Cyanourea compounds or polymers thereof as epoxy resin curing agents
JPS598715A (ja) * 1982-07-07 1984-01-18 Mitsubishi Electric Corp 半導体封止用エポキシ樹脂組成物
JPS5927945A (ja) * 1982-08-05 1984-02-14 Mitsubishi Electric Corp 半導体封止用液状エポキシ樹脂組成物
JPS59197426A (ja) * 1983-04-25 1984-11-09 Takeda Chem Ind Ltd エポキシ基を有するポリエステル樹脂の製造法
US4663190A (en) * 1984-03-08 1987-05-05 Hitachi Chemical Company, Ltd. Process for producing semiconductor element
JPH0621156B2 (ja) * 1986-07-17 1994-03-23 イビデン株式会社 封止用エポキシ樹脂組成物
US4954580A (en) * 1987-12-01 1990-09-04 Ciba-Geigy Corporation Epoxysiloxanes
JPH04202523A (ja) * 1990-11-30 1992-07-23 Nippon Oil & Fats Co Ltd 熱硬化性組成物
EP0561048B1 (en) * 1992-03-16 1999-05-26 Raytheon Company Superior thermal transfer adhesive
US5288820A (en) * 1993-03-01 1994-02-22 Eastman Kodak Company Thermosetting coating compositions
JP3885896B2 (ja) * 1996-04-15 2007-02-28 日立化成工業株式会社 補修可能な電極接続用接着剤組成物および該組成物からなる電極接続用接続部材
US5726391A (en) * 1996-12-16 1998-03-10 Shell Oil Company Thermosetting Encapsulants for electronics packaging
JPH10175979A (ja) * 1996-12-19 1998-06-30 Dainippon Ink & Chem Inc エポキシ化合物及び該化合物を含有する重合性組成物
JP3835715B2 (ja) * 1997-02-18 2006-10-18 住友ベークライト株式会社 液状注入封止アンダーフィル材料
US5948922A (en) * 1997-02-20 1999-09-07 Cornell Research Foundation, Inc. Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets
JP3253919B2 (ja) * 1997-05-19 2002-02-04 横浜ゴム株式会社 接着剤組成物
JPH1112440A (ja) * 1997-06-25 1999-01-19 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH11140161A (ja) * 1997-11-06 1999-05-25 Asahi Chiba Kk 速硬化性エポキシ樹脂組成物
WO1999035187A1 (en) * 1998-01-07 1999-07-15 Georgia Tech Research Corporation Reworkable epoxy underfill encapsulants
JPH11209689A (ja) * 1998-01-29 1999-08-03 Yokohama Rubber Co Ltd:The 塗料およびコーティング剤用樹脂組成物
JPH11302507A (ja) * 1998-02-17 1999-11-02 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用中間基材および繊維強化複合材料
WO2000056799A1 (en) * 1999-03-23 2000-09-28 Loctite Corporation Reworkable thermosetting resin compositions

Also Published As

Publication number Publication date
EP1268457A1 (en) 2003-01-02
AU2001247541A1 (en) 2001-10-15
JP2003529643A (ja) 2003-10-07
EP1268457A4 (en) 2005-07-20
MXPA02009639A (es) 2004-05-14
KR20020087442A (ko) 2002-11-22
KR100790081B1 (ko) 2007-12-31
CA2403595A1 (en) 2001-10-11
WO2001074798A1 (en) 2001-10-11
CN1427831A (zh) 2003-07-02

Similar Documents

Publication Publication Date Title
CN1276490C (zh) 硅晶片应用的助焊和填缝材料,和用其制造的层状电子组件
CN1232515C (zh) 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物
US5948922A (en) Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets
CN1934098A (zh) 高纯度脂环式环氧化合物、其制备方法、可固化环氧树脂组合物、其固化产物及其应用
CN1957012A (zh) 环氧树脂用硬化剂及环氧树脂组合物
CN1178287C (zh) 可再处理的热固性树脂组合物
US8053587B2 (en) Reworkable thermosetting resin composition
CN1375521A (zh) 热固化性树脂组合物及使用其的半导体装置
CN1688561A (zh) 脂环族二环氧化合物的制造方法、固化性环氧树脂组合物、电子部件密封用环氧树脂组合物、电绝缘油用稳定剂及电绝缘铸塑环氧树脂组合物
US6657031B1 (en) Reworkable thermosetting resin compositions
CN1346375A (zh) 用于液晶盒的密封胶、用于液晶盒密封胶的组合物以及液晶显示器件
US7012120B2 (en) Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
KR101616898B1 (ko) 에폭시 수지 조성물
CN101054458A (zh) 用于电子用途的疏水可交联组合物
CN1303176C (zh) 含有机酸的组合物和其使用方法
US6716992B2 (en) Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality
JP2017155009A (ja) シランカップリング剤、カップリング剤組成物、有機無機複合部材
CN1155654C (zh) 环氧树脂组合物及其应用
CN1317350C (zh) B阶小片连接粘合剂
US6627683B1 (en) Reworkable thermosetting resin compositions and compounds useful therein
CN101065415A (zh) 固化性金刚烃化合物
US6590018B2 (en) Vinyl silane compounds containing epoxy functionality
CN1356972A (zh) 低粘度丙烯酸酯单体、含有该单体的配方及其用途
CN1852932A (zh) 脂环式环氧树脂、其制造方法、其组合物、环氧树脂固化物以及脂环式环氧树脂组合物的用途
JP2000143685A (ja) ホスホニウムボレ―ト化合物、その製造方法、エポキシ樹脂組成物用硬化触媒及びエポキシ樹脂組成物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee