AU2001247541A1 - Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent - Google Patents

Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent

Info

Publication number
AU2001247541A1
AU2001247541A1 AU2001247541A AU4754101A AU2001247541A1 AU 2001247541 A1 AU2001247541 A1 AU 2001247541A1 AU 2001247541 A AU2001247541 A AU 2001247541A AU 4754101 A AU4754101 A AU 4754101A AU 2001247541 A1 AU2001247541 A1 AU 2001247541A1
Authority
AU
Australia
Prior art keywords
thiirane
oxirane
curing agent
containing resin
reworkable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247541A
Inventor
Takahisa Doba
Philip T Klemarczyk
Andrew D. Messana
Afranio Torres-Filho
Erin K. Yaeger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Corp
Original Assignee
ERIN K YAEGER
Henkel Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ERIN K YAEGER, Henkel Loctite Corp filed Critical ERIN K YAEGER
Publication of AU2001247541A1 publication Critical patent/AU2001247541A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D493/00—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system
    • C07D493/02—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system in which the condensed system contains two hetero rings
    • C07D493/08—Bridged systems
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/06—Polythioethers from cyclic thioethers
    • C08G75/08—Polythioethers from cyclic thioethers from thiiranes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
AU2001247541A 2000-03-31 2001-03-27 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent Abandoned AU2001247541A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19354200P 2000-03-31 2000-03-31
US60193542 2000-03-31
PCT/US2001/008624 WO2001074798A1 (en) 2000-03-31 2001-03-27 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent

Publications (1)

Publication Number Publication Date
AU2001247541A1 true AU2001247541A1 (en) 2001-10-15

Family

ID=22714049

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247541A Abandoned AU2001247541A1 (en) 2000-03-31 2001-03-27 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent

Country Status (8)

Country Link
EP (1) EP1268457A4 (en)
JP (1) JP2003529643A (en)
KR (1) KR100790081B1 (en)
CN (1) CN1232515C (en)
AU (1) AU2001247541A1 (en)
CA (1) CA2403595A1 (en)
MX (1) MXPA02009639A (en)
WO (1) WO2001074798A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
WO2006043608A1 (en) * 2004-10-20 2006-04-27 Kansai Paint Co., Ltd. Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product
JP4890872B2 (en) * 2006-01-30 2012-03-07 ルネサスエレクトロニクス株式会社 Transparent epoxy resin composition for optical semiconductor encapsulation and optical semiconductor integrated circuit device using the same
JP4816333B2 (en) * 2006-08-28 2011-11-16 パナソニック電工株式会社 Manufacturing method of semiconductor device
PL2367794T3 (en) * 2008-11-24 2013-06-28 Basf Se Curable composition comprising a thermolatent base
JP5767540B2 (en) * 2011-09-14 2015-08-19 積水化学工業株式会社 B-stage film, multilayer substrate and laminated film which are episulfide resin materials
JP5987148B2 (en) * 2012-10-11 2016-09-07 ピーアールシー−デソト インターナショナル，インコーポレイティド Coating / sealant system, aqueous resin dispersion, method for producing aqueous resin dispersion, and electrodeposition coating method
JP2016029152A (en) * 2014-07-24 2016-03-03 日本合成化学工業株式会社 Curing agent for anion curable compound, curable composition, and cured product
JP2020063343A (en) * 2018-10-16 2020-04-23 日東シンコー株式会社 Resin composition
CN113336946B (en) * 2021-06-21 2022-10-11 湖北固润科技股份有限公司 Nopol bio-based silicon-containing oxetane monomer and preparation method thereof

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378522A (en) * 1961-11-29 1968-04-16 Shell Oil Co Epithio compounds, their preparation and polymers
US4379728A (en) * 1982-02-04 1983-04-12 W. R. Grace & Co. Cyanourea compounds or polymers thereof as epoxy resin curing agents
JPS598715A (en) * 1982-07-07 1984-01-18 Mitsubishi Electric Corp Epoxy resin composition for sealing semiconductor
JPS5927945A (en) * 1982-08-05 1984-02-14 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductor
JPS59197426A (en) * 1983-04-25 1984-11-09 Takeda Chem Ind Ltd Production of polyester resin having epoxy group
US4663190A (en) * 1984-03-08 1987-05-05 Hitachi Chemical Company, Ltd. Process for producing semiconductor element
JPH0621156B2 (en) * 1986-07-17 1994-03-23 イビデン株式会社 Epoxy resin composition for encapsulation
US4954580A (en) * 1987-12-01 1990-09-04 Ciba-Geigy Corporation Epoxysiloxanes
JPH04202523A (en) * 1990-11-30 1992-07-23 Nippon Oil & Fats Co Ltd Thermosetting composition
DE69229262T2 (en) * 1992-03-16 2000-01-20 Raytheon Co Heat transfer adhesive
US5288820A (en) * 1993-03-01 1994-02-22 Eastman Kodak Company Thermosetting coating compositions
JP3885896B2 (en) * 1996-04-15 2007-02-28 日立化成工業株式会社 Repairable electrode connecting adhesive composition and electrode connecting connecting member comprising the composition
US5726391A (en) * 1996-12-16 1998-03-10 Shell Oil Company Thermosetting Encapsulants for electronics packaging
JPH10175979A (en) * 1996-12-19 1998-06-30 Dainippon Ink & Chem Inc Epoxy compound and polymerizable composition containing the same
JP3835715B2 (en) * 1997-02-18 2006-10-18 住友ベークライト株式会社 Liquid injection sealed underfill material
US5948922A (en) * 1997-02-20 1999-09-07 Cornell Research Foundation, Inc. Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets
JP3253919B2 (en) * 1997-05-19 2002-02-04 横浜ゴム株式会社 Adhesive composition
JPH1112440A (en) * 1997-06-25 1999-01-19 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor
JPH11140161A (en) * 1997-11-06 1999-05-25 Asahi Chiba Kk Rapidly curable epoxy resin composition
WO1999035187A1 (en) * 1998-01-07 1999-07-15 Georgia Tech Research Corporation Reworkable epoxy underfill encapsulants
JPH11209689A (en) * 1998-01-29 1999-08-03 Yokohama Rubber Co Ltd:The Resin composition for coating and coating agent
JPH11302507A (en) * 1998-02-17 1999-11-02 Toray Ind Inc Epoxy resin composition for fiber-reinforced composite material, intermediate substrate for fiber-reinforced composite material and fiber-reinforced composite material
CN1300301A (en) * 1999-03-23 2001-06-20 洛克泰特公司 Reworkable thermosetting resin composition

Also Published As

Publication number Publication date
JP2003529643A (en) 2003-10-07
WO2001074798A1 (en) 2001-10-11
EP1268457A1 (en) 2003-01-02
KR100790081B1 (en) 2007-12-31
MXPA02009639A (en) 2004-05-14
CA2403595A1 (en) 2001-10-11
CN1232515C (en) 2005-12-21
CN1427831A (en) 2003-07-02
EP1268457A4 (en) 2005-07-20
KR20020087442A (en) 2002-11-22

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