CN1230920C - 制造接触的方法,制造太阳能电池方法和太阳能电池 - Google Patents
制造接触的方法,制造太阳能电池方法和太阳能电池 Download PDFInfo
- Publication number
- CN1230920C CN1230920C CNB988058006A CN98805800A CN1230920C CN 1230920 C CN1230920 C CN 1230920C CN B988058006 A CNB988058006 A CN B988058006A CN 98805800 A CN98805800 A CN 98805800A CN 1230920 C CN1230920 C CN 1230920C
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- Prior art keywords
- dopant
- silicon
- metal
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
- H10F10/146—Back-junction photovoltaic cells, e.g. having interdigitated base-emitter regions on the back side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
- H10F77/1223—Active materials comprising only Group IV materials characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4567397P | 1997-05-06 | 1997-05-06 | |
| US60/045,673 | 1997-05-06 | ||
| US09/072,411 | 1998-05-04 | ||
| US09/072,411 US6180869B1 (en) | 1997-05-06 | 1998-05-04 | Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1272226A CN1272226A (zh) | 2000-11-01 |
| CN1230920C true CN1230920C (zh) | 2005-12-07 |
Family
ID=26723069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB988058006A Expired - Fee Related CN1230920C (zh) | 1997-05-06 | 1998-05-05 | 制造接触的方法,制造太阳能电池方法和太阳能电池 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6180869B1 (enExample) |
| EP (3) | EP2149916A2 (enExample) |
| JP (1) | JP2002511190A (enExample) |
| KR (1) | KR20010012327A (enExample) |
| CN (1) | CN1230920C (enExample) |
| AU (1) | AU7288498A (enExample) |
| BR (1) | BR9809237A (enExample) |
| CA (1) | CA2287834C (enExample) |
| TW (1) | TW418543B (enExample) |
| WO (1) | WO1998050944A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762270A (zh) * | 2009-03-11 | 2014-04-30 | Lg电子株式会社 | 太阳能电池及其制造方法 |
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| US6632730B1 (en) * | 1999-11-23 | 2003-10-14 | Ebara Solar, Inc. | Method for self-doping contacts to a semiconductor |
| AUPR174800A0 (en) | 2000-11-29 | 2000-12-21 | Australian National University, The | Semiconductor processing |
| JP4530662B2 (ja) * | 2001-11-29 | 2010-08-25 | トランスフォーム ソーラー ピーティーワイ リミテッド | 半導体テクスチャ化プロセス |
| FR2854497B1 (fr) * | 2003-04-29 | 2005-09-02 | Commissariat Energie Atomique | Procede de realisation d'un dispositif semi-conducteur a metallisations auto-alignees |
| US7170001B2 (en) * | 2003-06-26 | 2007-01-30 | Advent Solar, Inc. | Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias |
| US7649141B2 (en) * | 2003-06-30 | 2010-01-19 | Advent Solar, Inc. | Emitter wrap-through back contact solar cells on thin silicon wafers |
| JP4232597B2 (ja) * | 2003-10-10 | 2009-03-04 | 株式会社日立製作所 | シリコン太陽電池セルとその製造方法 |
| JP2005135942A (ja) * | 2003-10-28 | 2005-05-26 | Canon Inc | 電極配設方法 |
| US7335555B2 (en) * | 2004-02-05 | 2008-02-26 | Advent Solar, Inc. | Buried-contact solar cells with self-doping contacts |
| US20060060238A1 (en) * | 2004-02-05 | 2006-03-23 | Advent Solar, Inc. | Process and fabrication methods for emitter wrap through back contact solar cells |
| US20050172996A1 (en) * | 2004-02-05 | 2005-08-11 | Advent Solar, Inc. | Contact fabrication of emitter wrap-through back contact silicon solar cells |
| US7144751B2 (en) * | 2004-02-05 | 2006-12-05 | Advent Solar, Inc. | Back-contact solar cells and methods for fabrication |
| WO2006031798A2 (en) * | 2004-09-10 | 2006-03-23 | Jx Crystals Inc. | Solar photovoltaic mirror modules |
| DE102004060363B4 (de) * | 2004-12-15 | 2010-12-16 | Austriamicrosystems Ag | Halbleitersubstrat mit pn-Übergang und Verfahren zur Herstellung |
| US7790574B2 (en) | 2004-12-20 | 2010-09-07 | Georgia Tech Research Corporation | Boron diffusion in silicon devices |
| FR2880989B1 (fr) * | 2005-01-20 | 2007-03-09 | Commissariat Energie Atomique | Dispositif semi-conducteur a heterojonctions et a structure inter-digitee |
| JP2006310368A (ja) * | 2005-04-26 | 2006-11-09 | Shin Etsu Handotai Co Ltd | 太陽電池の製造方法及び太陽電池 |
| TWI334649B (en) * | 2005-09-27 | 2010-12-11 | Lg Chemical Ltd | Method for forming buried contact electrode of semiconductor device having pn junction and optoelectronic semiconductor device using the same |
| US20070107773A1 (en) * | 2005-11-17 | 2007-05-17 | Palo Alto Research Center Incorporated | Bifacial cell with extruded gridline metallization |
| US20070169806A1 (en) * | 2006-01-20 | 2007-07-26 | Palo Alto Research Center Incorporated | Solar cell production using non-contact patterning and direct-write metallization |
| JP5126795B2 (ja) * | 2005-12-21 | 2013-01-23 | サンパワー コーポレイション | 裏面電極型太陽電池構造及びその製造プロセス |
| DE102006041424A1 (de) * | 2006-09-04 | 2008-03-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur simultanen Dotierung und Oxidation von Halbleitersubstraten und dessen Verwendung |
| US20080111206A1 (en) * | 2006-11-10 | 2008-05-15 | Evergreen Solar, Inc. | Substrate with Two Sided Doping and Method of Producing the Same |
| CA2568136C (en) * | 2006-11-30 | 2008-07-29 | Tenxc Wireless Inc. | Butler matrix implementation |
| US7928015B2 (en) * | 2006-12-12 | 2011-04-19 | Palo Alto Research Center Incorporated | Solar cell fabrication using extruded dopant-bearing materials |
| WO2008080160A1 (en) * | 2006-12-22 | 2008-07-03 | Advent Solar, Inc. | Interconnect technologies for back contact solar cells and modules |
| CN103077978B (zh) * | 2007-02-16 | 2016-12-28 | 纳克公司 | 太阳能电池结构、光生伏打模块及对应的工艺 |
| US7954449B2 (en) * | 2007-05-08 | 2011-06-07 | Palo Alto Research Center Incorporated | Wiring-free, plumbing-free, cooled, vacuum chuck |
| DE102007032285A1 (de) * | 2007-07-11 | 2009-01-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung von dotierten Halbleiterbauelementen, insbesondere für die Solartechnik |
| US8304062B2 (en) * | 2007-07-20 | 2012-11-06 | Fry's Metals, Inc. | Electrical conductors and methods of making and using them |
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| WO2009082141A2 (en) * | 2007-12-21 | 2009-07-02 | Jusung Engineering Co., Ltd. | Thin film type solar cell and method for manufacturing the same |
| US20090173373A1 (en) * | 2008-01-07 | 2009-07-09 | Wladyslaw Walukiewicz | Group III-Nitride Solar Cell with Graded Compositions |
| DE102008013446A1 (de) | 2008-02-15 | 2009-08-27 | Ersol Solar Energy Ag | Verfahren zur Herstellung monokristalliner n-Silizium-Solarzellen sowie Solarzelle, hergestellt nach einem derartigen Verfahren |
| KR101631711B1 (ko) * | 2008-03-21 | 2016-06-17 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 확산용 인 페이스트 및 그것을 이용한 태양 전지의 제조 방법 |
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| US9728669B2 (en) * | 2013-03-06 | 2017-08-08 | Sino-American Silicon Products Inc. | Solar cell and method of manufacturing the same |
| TWM512217U (zh) | 2013-06-20 | 2015-11-11 | Plant PV | 太陽能電池 |
| US20150096613A1 (en) * | 2013-06-24 | 2015-04-09 | Sino-American Silicon Products Inc. | Photovoltaic device and method of manufacturing the same |
| WO2015095857A2 (en) * | 2013-12-22 | 2015-06-25 | Lehighton Electronics, Inc. | System and method for noncontact sensing maximum open circuit voltage of photovoltaic semiconductors |
| US10550291B2 (en) | 2015-08-25 | 2020-02-04 | Hitachi Chemical Co., Ltd. | Core-shell, oxidation-resistant, electrically conducting particles for low temperature conductive applications |
| WO2017035102A1 (en) | 2015-08-26 | 2017-03-02 | Plant Pv, Inc | Silver-bismuth non-contact metallization pastes for silicon solar cells |
| JP6900370B2 (ja) | 2015-10-25 | 2021-07-07 | ソルアラウンド リミテッド | 両面セルを製造する方法 |
| US10696851B2 (en) | 2015-11-24 | 2020-06-30 | Hitachi Chemical Co., Ltd. | Print-on pastes for modifying material properties of metal particle layers |
| JP6741626B2 (ja) | 2017-06-26 | 2020-08-19 | 信越化学工業株式会社 | 高効率裏面電極型太陽電池及びその製造方法 |
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| US2998334A (en) | 1958-03-07 | 1961-08-29 | Transitron Electronic Corp | Method of making transistors |
| US3112230A (en) | 1959-11-27 | 1963-11-26 | Transitron Electronic Corp | Photoelectric semiconductor device |
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| AU419791B2 (en) * | 1968-06-20 | 1971-12-15 | Matsushita Electric Industrial Co., Ltd | Method of making a switching element |
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1998
- 1998-05-04 US US09/072,411 patent/US6180869B1/en not_active Expired - Lifetime
- 1998-05-05 EP EP09172844A patent/EP2149916A2/en not_active Withdrawn
- 1998-05-05 EP EP09172857A patent/EP2149917A2/en not_active Withdrawn
- 1998-05-05 CN CNB988058006A patent/CN1230920C/zh not_active Expired - Fee Related
- 1998-05-05 WO PCT/US1998/009190 patent/WO1998050944A2/en not_active Ceased
- 1998-05-05 EP EP98920273A patent/EP0980590A2/en not_active Withdrawn
- 1998-05-05 CA CA002287834A patent/CA2287834C/en not_active Expired - Fee Related
- 1998-05-05 AU AU72884/98A patent/AU7288498A/en not_active Abandoned
- 1998-05-05 KR KR1019997010279A patent/KR20010012327A/ko not_active Withdrawn
- 1998-05-05 JP JP54841698A patent/JP2002511190A/ja active Pending
- 1998-05-05 BR BR9809237-5A patent/BR9809237A/pt active Search and Examination
- 1998-06-15 TW TW087106941A patent/TW418543B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762270A (zh) * | 2009-03-11 | 2014-04-30 | Lg电子株式会社 | 太阳能电池及其制造方法 |
| CN103762270B (zh) * | 2009-03-11 | 2016-08-17 | Lg电子株式会社 | 太阳能电池及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010012327A (ko) | 2001-02-15 |
| TW418543B (en) | 2001-01-11 |
| WO1998050944A3 (en) | 1999-05-27 |
| AU7288498A (en) | 1998-11-27 |
| EP0980590A2 (en) | 2000-02-23 |
| BR9809237A (pt) | 2001-02-20 |
| CN1272226A (zh) | 2000-11-01 |
| CA2287834A1 (en) | 1998-11-12 |
| WO1998050944A2 (en) | 1998-11-12 |
| EP2149916A2 (en) | 2010-02-03 |
| JP2002511190A (ja) | 2002-04-09 |
| CA2287834C (en) | 2005-07-05 |
| US6180869B1 (en) | 2001-01-30 |
| EP2149917A2 (en) | 2010-02-03 |
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