CN1230048C - 面安装型电路模块 - Google Patents
面安装型电路模块 Download PDFInfo
- Publication number
- CN1230048C CN1230048C CN 200310115653 CN200310115653A CN1230048C CN 1230048 C CN1230048 C CN 1230048C CN 200310115653 CN200310115653 CN 200310115653 CN 200310115653 A CN200310115653 A CN 200310115653A CN 1230048 C CN1230048 C CN 1230048C
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit module
- insulating thin
- electrode
- installation type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002327433 | 2002-11-11 | ||
JP2002327433A JP3960905B2 (ja) | 2002-11-11 | 2002-11-11 | 面実装型回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1501765A CN1501765A (zh) | 2004-06-02 |
CN1230048C true CN1230048C (zh) | 2005-11-30 |
Family
ID=32806081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200310115653 Expired - Fee Related CN1230048C (zh) | 2002-11-11 | 2003-11-10 | 面安装型电路模块 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3960905B2 (ja) |
CN (1) | CN1230048C (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4882644B2 (ja) | 2006-08-10 | 2012-02-22 | パナソニック電工株式会社 | 光電気変換装置 |
CN101523264A (zh) * | 2006-08-10 | 2009-09-02 | 松下电工株式会社 | 光电变换装置 |
CN114361730A (zh) * | 2021-12-28 | 2022-04-15 | 湖南海博瑞德电智控制技术有限公司 | 电芯模组用汇流排、电芯模组及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05326744A (ja) * | 1992-05-22 | 1993-12-10 | Mitsubishi Electric Corp | リードレスタイプの半導体パッケージおよびその実装方法 |
JPH10270819A (ja) * | 1997-03-28 | 1998-10-09 | Ngk Spark Plug Co Ltd | 表面実装用電子部品とその製造方法 |
JP2000114415A (ja) * | 1998-09-30 | 2000-04-21 | Nec Corp | 電子部品 |
JP2001135904A (ja) * | 1999-11-04 | 2001-05-18 | Ricoh Co Ltd | モジュール基板実装構造およびモジュール基板 |
-
2002
- 2002-11-11 JP JP2002327433A patent/JP3960905B2/ja not_active Expired - Fee Related
-
2003
- 2003-11-10 CN CN 200310115653 patent/CN1230048C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1501765A (zh) | 2004-06-02 |
JP2004165305A (ja) | 2004-06-10 |
JP3960905B2 (ja) | 2007-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |