CN2697858Y - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN2697858Y
CN2697858Y CNU2004200253717U CN200420025371U CN2697858Y CN 2697858 Y CN2697858 Y CN 2697858Y CN U2004200253717 U CNU2004200253717 U CN U2004200253717U CN 200420025371 U CN200420025371 U CN 200420025371U CN 2697858 Y CN2697858 Y CN 2697858Y
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mentioned
electric connector
installed surface
protective device
insulating body
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程军
叶辉
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNU2004200253717U priority Critical patent/CN2697858Y/zh
Priority to US11/078,164 priority patent/US7217996B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)

Abstract

一种主要用于电性连接晶片模组及电路板的电连接器，其包括绝缘本体、收容于绝缘本体中的若干导电端子。该绝缘本体包括配合面，与配合面相对设置的安装面、贯穿配合面和安装面收容相应导电端子的若干端子孔以及于安装面上相邻端子孔之间延伸设置的保护装置；该导电端子包括主体、于主体一端朝向配合面延伸设置的接触部以及于主体另一端延伸设置的焊接部，该焊接部突出安装面设置。该保护装置远离安装面的一端到安装面的垂直距离大于焊接部至安装面的高度距离，较高的保护装置可以避免焊接部受到外力的影响而破坏其平面度进而影响电连接器与电路板的连接效果。

Description

电连接器
【技术领域】
本实用新型是关于一种电连接器，尤指一种主要用于电性连接晶片模组及电路板的电连接器。
【背景技术】
现有的用于电性连接晶片模组及电路板的电连接器，一般具有绝缘本体、收容于绝缘本体中的导电端子。该导电端子包括与晶片模组的导电体相配合的接触部以及与电路板相组接的焊接部。使用时，通过易熔性焊接元件与导电端子焊接部的配合使电连接器组接于电路板，将晶片模组固定于绝缘本体上使其导电体与导电端子的接触部相配合，从而达到电连接器与晶片模组及电路板之间的电性连接。
如图7至图9所示，一种现有的电连接器3设有绝缘本体31、若干收容于绝缘本体31中用于电性连接晶片模组(未图示)的导电端子32。该绝缘本体31包括与晶片模组相配合的配合面311、与配合面相对设置的与电路板相组接的安装面312以及若干容置于绝缘本体31中收容相应导电端子32的端子孔313。该导电端子32包括主体321、于主体321一端朝向配合面311延伸设置的接触部322、于主体321另一端延伸设置的焊接部323。焊接部323于其末端延伸设有与易熔性焊接元件33相配合的焊接面3231，该焊接面3231突伸于安装面312上相应端子孔313外设置。
使用时，通过易熔性焊接元件33与导电端子32的焊接部323及电路板(未图示)的导电体(未图示)相配合使电连接器3组接于电路板上，将晶片模组固定于绝缘本体31上使晶片模组的导电体与电连接器3的导电端子32产生接触，从而实现电连接器3与晶片模组及电路板的电性连接。
但是，这种电连接器3至少具有以下缺点：由于该电连接器3所设有的导电端子32的焊接面3231突伸于安装面312上相应端子孔313外设置，焊接部323容易受到水平方向上外力的影响而破坏其平面度，进而影响易熔性焊接元件33的平面度导致影响电连接器3与电路板的连接效果；且如果外力过大，则会损坏导电端子32的焊接部323。
【实用新型内容】
本实用新型的目的在于提供一种可以避免导电端子受外力影响而破坏其焊接部平面度的电连接器。
本实用新型提供一种主要用于电性连接晶片模组和电路板的电连接器，其包括绝缘本体、收容于绝缘本体中的若干导电端子。该绝缘本体包括配合面，与配合面相对设置的安装面、贯穿配合面和安装面的收容相应导电端子的若干端子孔以及于安装面上相邻端子孔之间延伸设置的保护装置；该导电端子包括主体、于主体一端朝向配合面延伸设置的接触部以及于主体另一端延伸设置的焊接部，该焊接部突出安装面设置。使用时，通过易熔性焊接元件与导电端子焊接部的配合使电连接器组接于电路板，将晶片模组固定于绝缘本体上使其导电体与导电端子的接触部相配合，从而达到电连接器与晶片模组及电路板间的电性连接。
与现有技术相比，本实用新型的优点为：该保护装置远离安装面的一端到安装面的距离大于焊接部突出安装面的高度距离，较高的保护装置可以避免焊接部受到水平方向上外力的影响而破坏其平面度，进而影响易熔性焊接元件的平面度导致影响电连接器与电路板的连接效果；且如果外力过大，则会损伤导电端子的焊接部。
【附图说明】
图1是本实用新型电连接器的立体组合图。
图2是本实用新型电连接器的局部放大图。
图3是本实用新型电连接器的导电端子收容于绝缘本体后的局部剖视图。
图4是本实用新型电连接器另一实施例的立体组合图。
图5是本实用新型电连接器另一实施例的局部放大图。
图6是本实用新型电连接器另一实施例的导电端子收容于绝缘本体后的局部剖视图。
图7是现有电连接器的立体组合图。
图8是现有电连接器的局部放大图。
图9是现有电连接器的导电端子收容于绝缘本体后的局部剖视图。
【具体实施方式】
本实用新型电连接器1主要用于电性连接晶片模组(未图示)及电路板(未图示)，如图1至图3所示，该电连接器1包括绝缘本体11、收容于绝缘本体11中的若干导电端子12，导电端子12与易熔性焊接元件相配合，在本实施方式中，易熔性焊接元件为锡球13。
绝缘本体11包括与晶片模组相配合的配合面111、与配合面111相对设置的与电路板相组接的安装面112、贯穿配合面111和安装面112用于收容相应导电端子12的端子孔113以及于安装面112上延伸设置的与绝缘本体11一体成型的保护装置114。该保护装置114呈柱状结构分布于安装面112上相邻两端子孔113之间，其包括本体1141、于本体1141远离安装面112的一端延伸设置的底面1142。
导电端子12包括主体121、于主体121一端朝向配合面111延伸设置的与晶片模组导电体相配合的接触部122、于主体121另一端延伸设置的与电路板相组接的焊接部123；该焊接部123于其末端延伸设有突出端子孔113外的焊接面1231。沿与电路板相垂直的方向，保护装置114的底面1142到安装面112的垂直距离大于或者等于导电端子12的焊接面1231到安装面112的垂直距离而小于锡球13与焊接面1231配合后其至安装面112的垂直距离。
使用时，先通过锡球13使导电端子12的焊接部123与电路板导电体相组接使电连接器3组接于电路板，使晶片模组固定于绝缘本体11上使其导电体与导电端子12的接触部122相配合，从而实现电连接器1与晶片模组及电路板之间的电性连接。由于底面1142到安装面112的垂直距离大于或者等于导电端子12的焊接面1231到安装面112的垂直距离，故可以避免水平方向上的外力碰撞导电端子12突伸于端子孔113外的焊接部123导致破坏其平面度而影响电连接器1与电路板的连接效果。
图4所示为本实用新型另一实施例电连接器1’的立体组合图。电连接器1’包括绝缘本体11’、收容于绝缘本体11’中的若干导电端子12。
如图5和图6所示，绝缘本体11’包括与晶片模组相配合的配合面111’、与配合面111’相对设置的与电路板相组接的安装面112’、贯穿配合面111’和安装面112’用于收容相应导电端子12的端子孔113’、于其安装面112’延伸设置的与绝缘本体11’一体成型的保护装置114’。该保护装置114’呈长条状结构分布于安装面112’上横向相邻两排端子孔和纵向两排端子孔之间，其包括本体1141’、于本体1141’远离安装面112’的一端设置的底面1142’。如图4所示，底面1142’到安装面112’的垂直距离大于或者等于导电端子12的焊接部123的焊接面1231到安装面112’的垂直距离，故可以避免外力将导电端子12突伸于端子孔113’外的焊接部123导致破坏其平面度而影响电连接器1’与电路板的连接效果。
以上为本案两种较佳实施方式，于其它实施方式中，保护装置除了可以与绝缘本体一体成型设置于安装面外，还可以通过其它的配合方式设置于绝缘本体的安装面上。

Claims (8)

1.一种电连接器，其包括绝缘本体、收容于绝缘本体中的若干导电端子；该绝缘本体包括配合面、与配合面相对设置的安装面以及贯穿配合面和安装面收容相应导电端子的若干端子孔；该导电端子包括主体、于主体一端朝向配合面延伸设置的接触部以及于主体另一端延伸设置的焊接部，该焊接部于其末端延伸设有焊接面，该焊接面突伸于相应端子孔外且朝向远离上述安装面的方向延伸设置；其特征在于：上述绝缘本体于上述安装面上相邻端子孔之间设有保护装置；该保护装置设有一底面，从底面到上述安装面之间的距离不小于上述焊接面到上述安装面之间的距离。
2.如权利要求1所述的电连接器，其特征在于：上述保护装置呈柱状结构，并于上述每个端子孔四周分布设置。
3.如权利要求1所述的电连接器，其特征在于：上述保护装置呈长条状结构于上述安装面上相邻两排端子孔之间设置。
4.如权利要求3所述的电连接器，其特征在于：上述保护装置于横向相邻两排端子孔之间延伸设置。
5.如权利要求2或4所述的电连接器，其特征在于：上述保护装置与绝缘本体一体成型。
6.如权利要求1或2或3所述的电连接器，其特征在于：上述导电端子的焊接面与易熔性焊接元件相配合，且易熔性焊接元件至安装面的高度大于上述保护装置自安装面向外延伸的垂直高度。
7.如权利要求6所述的电连接器，其特征在于：上述易熔性焊接元件不与上述保护装置相接触。
8.如权利要求7所述的电连接器，其特征在于：上述易熔性焊接元件为锡球。
CNU2004200253717U 2004-03-12 2004-03-12 电连接器 Expired - Lifetime CN2697858Y (zh)

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US11/078,164 US7217996B2 (en) 2004-03-12 2005-03-10 Ball grid array socket having improved housing

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US9689897B2 (en) 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
US9559447B2 (en) 2015-03-18 2017-01-31 Hsio Technologies, Llc Mechanical contact retention within an electrical connector

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW399789U (en) * 1999-02-02 2000-07-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP2001007473A (ja) * 1999-06-17 2001-01-12 Nec Corp 集積回路素子の実装構造および方法
US6438826B2 (en) * 2000-02-10 2002-08-27 Towa Corporation Electronic component, method of sealing electronic component with resin, and apparatus therefor
US6558170B1 (en) * 2000-11-22 2003-05-06 Fci Americas Technology, Inc. Strain relief for BGA connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101136515B (zh) * 2006-09-01 2010-11-17 富士康(昆山)电脑接插件有限公司 电连接器

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