CN1352473A - 多线栅格连接器 - Google Patents

多线栅格连接器 Download PDF

Info

Publication number
CN1352473A
CN1352473A CN01134343A CN01134343A CN1352473A CN 1352473 A CN1352473 A CN 1352473A CN 01134343 A CN01134343 A CN 01134343A CN 01134343 A CN01134343 A CN 01134343A CN 1352473 A CN1352473 A CN 1352473A
Authority
CN
China
Prior art keywords
connector
multiple line
line grid
joint
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN01134343A
Other languages
English (en)
Inventor
尹琮光
金荣洙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GELO TECK CO Ltd
Original Assignee
GELO TECK CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GELO TECK CO Ltd filed Critical GELO TECK CO Ltd
Publication of CN1352473A publication Critical patent/CN1352473A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种用于电气连接两个电子元件的连接器,该连接器包括一个插头式元件和一个容纳该插头式元件的插座。插头式元件具有一个非导电主体,该非导电主体并具有一个顶面、一个底面和一个侧面,该插头式元件包括成型在上述侧面上的若干接头端片和许多设置在顶面上的I/O(输入/输出)接头,接头端片通过I/O(输入/输出)接头与其中一个电子元件相连。上述插座具有若干插针,上述接头端片通过其相应的插针而与其它电子元件相连。

Description

多线栅格连接器
发明领域
本发明涉及一种连接器，尤其涉及一种在印刷电路板(PCBs)之间提供电气连接的连接器。
背景技术
众所周知，电子设备中的印刷电路板(PCBs)上具有各种电子元件，这些印刷电路板通过板与板之间的连接器，例如插针插孔型连接器而相互连接。
传统地，插针插孔型连接器是由一套插入式端子和另一套插口式端子以及两个容纳上述端子的外壳所制成。
上述插入式端子和插口式端子布置成细长形状，仅用来提供印刷电路板之间的电气连接但并不能提供附加的电功能，例如，电容、电感和/或电阻等。相应地，如果为了提高印刷电路板之间的信号接口特性而需要附加的电路元件，例如电容器、电感器和/或电阻器，这些元件需要放置在印刷电路板上，因而给应用印刷电路板的间隔和通路带来额外的负担。
另外，因为为了防止在相邻导电端子之间的焊缝架桥现象而导致短路，在插针插孔型连接器的导电端子之间的最小间距必须保持在大约0.5mm或0.7mm，所以这种传统的板与板之间的连接器不可能用于目前高度集成化和功能化的小型印刷电路板。
发明概述
因此，本发明的一个目的是提供一种用于连接印刷电路板(PCBs)的连接器，该连接器能在每个组件安装区域内提供更多数量的端子，而不会减小其间的间距。
本发明的另一个目的是提供一种用于连接印刷电路板(PCBs)的连接器，该连接器能通过在其内和/或在其上结合用于提高信号接口特性的电路元件，从而防止信号衰减。
根据本发明，提供了一种用于电气连接两个电子元件的连接器，该连接器包括：
一个插头式元件，该元件具有非导电主体，该非导电主体具有一个顶面、一个底面和一个侧面，该插头式元件包括成型在上述侧面上的若干接头端片和许多设置在顶面上的I/O(输入/输出)接头，接头端片通过I/O(输入/输出)接头与其中一个电子元件相连；和
一个容纳上述插头式元件的插座，该插座具有若干插针，上述接头端片通过其相应的插针而与其它电子元件相连。
附图简要说明
结合附图并通过如下描述可以使本发明的以上以及其它目的和特征更清楚。
图1是根据本发明一个实施例的多线栅格连接器的透视图；
图2是使用在图1中多线栅格连接器的多线栅格(MLG)的侧视图；
图3是多线栅格插座的透视图，该多线栅格插座具有若干固定在支承槽中的插针；
图4是连接两块印刷电路板的多线栅格连接器的透视图；
图5是若干层多线栅格的横截面图；
图6是连接两块印刷电路板的多线栅格连接器的横截面图，其中在多线栅格的底面上设有若干电子元件。
图7是连接两块印刷电路板的多线栅格连接器的横截面图，其中若干电子元件嵌入多线栅格中。
最佳实施例的详细描述
如图1所示，其中示出根据本发明一个实施例的多线栅格(multipleline grid，MLG)连接器。该多线栅格连接器100包括一个具有若干接头端片112的多线栅格110和一个具有与接头端片112相应数目的插针126的多线栅格插座120。多线栅格110将与多线栅格插座120连接，以便使接头端片112与相应数目的插针126保持电气连接。
如图2所示，其中示出一个用作多线栅格连接器100的插头元件的多线栅格110。该多线栅格110具有一个由绝缘材料制成并呈立方形形状的栅格主体111。应当知道，多线栅格110的横截面具有任意的多边形形状，而不仅仅是图2中在俯视时的矩形。接头端片112设置在成型于栅格主体111一个侧面的凹进部上。许多I/O(输入/输出)接头116设置在栅格主体111的顶部，并通过其与接头端片112之间的导线114而与该接头端片112相连。最好是以一种使其间间距最大化的方式在多线栅格110的顶面上分布I/O(输入/输出)接头116。
图3示出多线栅格插座120的透视图，该多线栅格插座120具有固定在支承槽124中的若干插针126。该多线栅格插座120基本为除去顶盖和底盖的盒状，并由绝缘或非导电材料制成。在多线栅格插座120内部设有一个开口的容纳空隙122，用于容纳多线栅格110。在多线栅格插座120的内侧表面上形成有支承槽124，用于固定插针126。插针126由导电材料，例如铜或铜合金等制成，具有一个能对多线栅格110的接头端片112施加弹力的结构，以便提供紧密接触。当多线栅格110与多线栅格插座120如图1所示结合在一起时，每个插针126与多线栅格110的接头端片112形成电气连接。当根据本发明最佳实施例的多线栅格连接器100如图4所示用于连接两块印刷电路板610、620时，插针126的下端如图6和图7所示与下部的印刷电路板(PCB)610的相应连接端片630。
多线栅格110的栅格主体111可以是，由一片绝缘材料制成的单层或整体结构，其内没有电子元件。可供替代的是，栅格主体111也可以是如图5所示例子中的多层结构，其中多线栅格110所具有的一个栅格主体111由例如五层201、203、205、207、209和例如一个电阻器R、一个电感器L和/或一个电容器C等电子元件而制成。这五层201到209都是由绝缘材料制成。电子元件R、L、C通过使用例如丝网印刷方法而形成。这些电子元件R、L、C能设置在不同的位置，例如在栅格主体111的顶部、在层与层之间和/或如图5所示在栅格主体111的陷阱内部。很明显，对于现有技术的普通技术人员而言，这种多层栅格主体能很容易地通过使用生产多层陶瓷电容器和电感器的传统技术而制成。
图6是连接两块印刷电路板610、620的多线栅格连接器100的横截面图。多线栅格连接器100的I/O(输入/输出)接头116通过若干焊点118分别与上部印刷电路板620的相应I/O(输入/输出)端片640相连，其中每个I/O(输入/输出)接头116用作I/O(输入/输出)端子。多线栅格插座120与下部的印刷电路板610相连，插针126的下端与下部印刷电路板610的相应连接端片630电连接。每个接头端片112与相应的插针126电连接，同样通过导线114与相应I/O接头116相连。多线栅格110如图6所示能通过使用一个整体栅格主体而实施，并可包括连接在其底面上的电路元件130，例如需要该元件来提供信号接口特性。能设置在栅格主体111上的电路元件130能够但不限于，一个或多个电阻器、电容器、电感器、二极管或晶体管或者是它们的组合。
图7示出具有多层栅格主体111的多线栅格连接器100的横截面图。该多线栅格连接器100如图7所示具有如6所示电路元件130的至少一部分。应当很清楚，图7所示的栅格主体111能够为在其内不设有电路元件的整体类型。
结果，当与包括若干布置成细长形状插入式/插口式端子的插针插孔型连接器相比较时，根据本发明最佳实施例的多线栅格连接器100能在每个组件安装区域内提供更多数量的端子，而不会减小端子间的间距，这是因为若干用作I/O(输入/输出)端子的I/O(输入/输出)接头116设置成区域排列的形状。
另外，应当知道本发明的多线栅格连接器100能用于将具有多I/O端子的电子元件，例如印刷电路板(PCB)、半导体芯片、整装模块或组件电缆，连接到另一电子元件。在此情况下，多线栅格插座120将附着在一个电子元件上，而多线栅格连接器100则将与该电子元件相连。
同样应当知道多线栅格110和多线栅格插座120可以是除了图1所示立方形状外的其它形状。例如，多线栅格110和多线栅格插座120可以是在俯视时具有椭圆或圆形横截面的圆柱体形状。
已经结合最佳实施例对本发明进行了描述，但本领域的技术人员应当能理解到可以在不偏离由如下权利要求所限定的本发明精神和范围的情况下，作出各种变型和改变。

Claims (9)

1.一种用于电气连接两个电子元件的连接器，该连接器包括：
一个插头式元件，该元件具有非导电主体，该非导电主体具有一个顶面、一个底面和一个侧面，该插头式元件包括成型在上述侧面上的若干接头端片和许多设置在顶面上的I/O(输入/输出)接头，接头端片通过I/O(输入/输出)接头与其中一个电子元件相连；和
一个容纳上述插头式元件的插座，该插座具有若干插针，上述接头端片通过其相应的插针而与其它电子元件相连。
2.如权利要求1所述的连接器，其特征在于，上述主体还包括若干形成在其侧面的凹进部，上述接头端片即成型在相应的端片内。
3.如权利要求1所述的连接器，其特征在于，上述主体还包括一个嵌在其内部的电路元件。
4.如权利要求3所述的连接器，其特征在于，上述电路元件是电阻器、电感器和电容器中的一个。
5.如权利要求3所述的连接器，其特征在于，上述主体成型为多个绝缘层。
6.如权利要求1所述的连接器，其特征在于，上述主体还具有一个设置在其底面上的电路元件。
7.如权利要求6所述的连接器，其特征在于，上述电路元件是电阻器、电感器、电容器、二极管和晶体管中的一个。
8.如权利要求1所述的连接器，其特征在于，上述插座还包括一个包容住上述主体侧面的非导电外壳，上述插针设置在该外壳的内表面上。
9.如权利要求8所述的连接器，其特征在于，上述外壳具有若干成型在其内表面上的槽，上述插头由这些槽固定。
CN01134343A 2000-11-03 2001-10-31 多线栅格连接器 Pending CN1352473A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020000065176A KR100355753B1 (ko) 2000-11-03 2000-11-03 보드용 커넥터
KR65176/2000 2000-11-03

Publications (1)

Publication Number Publication Date
CN1352473A true CN1352473A (zh) 2002-06-05

Family

ID=19697107

Family Applications (1)

Application Number Title Priority Date Filing Date
CN01134343A Pending CN1352473A (zh) 2000-11-03 2001-10-31 多线栅格连接器

Country Status (5)

Country Link
US (1) US20020055283A1 (zh)
EP (1) EP1204167A1 (zh)
JP (1) JP2002198108A (zh)
KR (1) KR100355753B1 (zh)
CN (1) CN1352473A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101517835B (zh) * 2006-09-29 2011-04-13 北陆电气工业株式会社 电路基板相互连接用连接器装置
TWI720799B (zh) * 2019-12-06 2021-03-01 唐虞企業股份有限公司 連接器總成

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6561818B1 (en) * 2002-08-15 2003-05-13 Hon Hai Precision Ind. Co., Ltd. Electrical connector with metal retention arms
JP3956920B2 (ja) 2003-08-26 2007-08-08 松下電工株式会社 コネクタ
US7613010B2 (en) * 2004-02-02 2009-11-03 Panasonic Corporation Stereoscopic electronic circuit device, and relay board and relay frame used therein
US20070238324A1 (en) * 2006-04-07 2007-10-11 Lotes Co., Ltd. Electrical connector
US8742570B2 (en) * 2011-09-09 2014-06-03 Qualcomm Mems Technologies, Inc. Backplate interconnect with integrated passives
DE102011086707A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Schaltungsanordnung für elektronische und/oder elektrische Bauteile
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
KR102623633B1 (ko) 2020-12-01 2024-01-10 주식회사 씨트리 성게알젓 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1861066U (de) * 1958-12-29 1962-10-31 Amp Inc Dreidimensional aufgebaute schaltungsanordnung mit blockfoermigen, in ein rahmengestell einschiebbaren schaltungsgruppen.
JPH08250243A (ja) * 1995-03-15 1996-09-27 Matsushita Electric Works Ltd プリント基板接続構造
EP0838100B1 (en) * 1995-07-07 2000-12-20 Minnesota Mining And Manufacturing Company Separable electrical connector assembly having a planar array of conductive protrusions
JPH09266037A (ja) * 1996-03-29 1997-10-07 Sanyo Electric Co Ltd 基板接続用コネクタ
DE29607758U1 (de) * 1996-04-29 1996-07-18 Karl Lumberg GmbH & Co, 58579 Schalksmühle Kontaktleiste für Leiterplatten
KR19980067145U (ko) * 1997-05-23 1998-12-05 조희재 상호 대응형 커넥터
JPH1116647A (ja) * 1997-06-20 1999-01-22 Nec Corp 低背型基板接続用コネクタ
JP3119612B2 (ja) * 1997-11-10 2000-12-25 大宏電機株式会社 プリント基板用コネクタ及びその実装構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101517835B (zh) * 2006-09-29 2011-04-13 北陆电气工业株式会社 电路基板相互连接用连接器装置
CN102082336B (zh) * 2006-09-29 2014-03-05 北陆电气工业株式会社 电路基板相互连接用连接器装置
TWI720799B (zh) * 2019-12-06 2021-03-01 唐虞企業股份有限公司 連接器總成

Also Published As

Publication number Publication date
KR100355753B1 (ko) 2002-10-19
US20020055283A1 (en) 2002-05-09
KR20020034702A (ko) 2002-05-09
JP2002198108A (ja) 2002-07-12
EP1204167A1 (en) 2002-05-08

Similar Documents

Publication Publication Date Title
US5387111A (en) Electrical connector
US6364713B1 (en) Electrical connector adapter assembly
JP3646894B2 (ja) 電気コネクタ用シュラウド及びそれを用いた電気コネクタ組立体
EP2285195B1 (en) Socket, circuit board assembly, and apparatus having the same
CN113491041B (zh) 小形状因数的内插器
US6652292B2 (en) Electrical connector assembly incorporating printed circuit board
JPH08124637A (ja) 表面実装型電気コネクタ
GB2287364A (en) Dual substrate package assembly for being electrically coupled to a conductive member
US7413450B2 (en) Printed circuit board assembly having a BGA connection
CN1299391C (zh) 球栅阵列连接装置
JP3703521B2 (ja) 基板実装用ピンソケットコネクタ
US4868980A (en) Method of designing and manufacturing circuits using universal circuit board
CN1352473A (zh) 多线栅格连接器
US6478586B1 (en) Electrical connector having conductive terminals that are provided with a dielectric coating
KR20010078106A (ko) Ｐｃｂ용 종단 어댑터
US5384433A (en) Printed circuit structure including power, decoupling and signal termination
US4791722A (en) Method of designing and manufacturing circuits using universal circuit board
CN1214492C (zh) 包括至少两个印刷电路板的系统
EP0723710A1 (en) Electrical connection assembly
EP0643448B1 (en) Coaxial connector for connection to a printed circuit board
JP2002198106A (ja) Ｂｇａコネクタ用歪み逃がし装置
US20040077189A1 (en) Adhesive interconnector
CN113224566B (zh) 连接器
GB2092839A (en) Improvements in or relating to electrical connection arrangements
JPH0521266Y2 (zh)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication