CN1215922A - 压装在印刷电路板孔内从集成电路到散热器传热的导热基片 - Google Patents
压装在印刷电路板孔内从集成电路到散热器传热的导热基片 Download PDFInfo
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Abstract
导热基片(50)被安装在印刷电路板(52)的通孔(60)内。然后,集成电路(42)被安装到导热基片的一侧,而散热器(90)被安装到基片的另一侧而形成热接触。在IC与PC板之间没有直接的热接触。通过给基片的多个部分(71)的法面施加受控的压力,把导热基片安装到PC板内。这种压力减小了被压部分的厚度和使被压部分的面积扩大,从而固定到PC板内。在除了基片的被压区域外的任何部位,基片与PC板之间都有空气隙(75)。这样的被压区域处于沿基片的周边(67)处。
Description
总的说来,本发明涉及用于消散来自集成电路器件的热量的基片,更准确地说,涉及把这样的基片安装到印刷电路板的方法。
当集成电路(“ICs”),特别是,微处理器被设计在越来越高的速度下运行时,这种电路消耗越来越大的功率,并产生越来越多的热量。需要消散这些热量以便把这电路和附近的电路维持在额定的工作温度范围内。通常,通过把IC’s连接到散热器和利用风扇吹风的方法来做到这一点。此外,某些较快的微处理器芯片,例如某些PentiumTM微处理器样品已经把最高温度容限提高到95℃。虽然这种芯片能承受提高了的和相对高的工作温度,但是,邻近的IC’s却不能。邻近的芯片经常限制在大约70℃的一般的最高工作温度。由于微处理器靠近这些耐热性较差的元件,微处理器产生的一部分热量就有流入印刷电路(“PC”)板并流到这类元件的倾向。周围元件的过热是个重要的问题。为了避免损坏在产生热的微处理器周围的耐热性较差的元件,已经知道的做法是,当检测到峰值工作温度时,就减慢微处理器的速度。减慢速度使得微处理器产生较少热量。可是,这也意味着,消费者的生产就不能运行得象预期的那么快。因此,就有进一步发展的必要,以便在不使邻近元件过度受热和不牺牲处理器速度的情况下把热从微处理器传走。
一种传统的传热方法利用在印刷电路板上的衬铜的通孔来把热从微处理器传到散热器。铜是好的热导体。微处理器安装到印刷电路板,从而提供了微处理器与通孔的铜壁之间的热接触。散热器通常安装在印刷电路板的底面。然后,从微处理器来的热从微处理器沿着铜壁传到散热器。这种方法的一个缺点是,沿着通孔的铜壁传导的热不只到达散热器,还进入印刷电路板的几层敷铜层。印刷电路板通常包括多层敷铜层,用于为印刷电路板上的多个IC芯片提供电互连。这种铜层在铜衬(copper lining)处与通孔连接。这样,在微处理器与附近的器件之间形成了不希望的有效导热通道。
传统的传热方法的另一个缺点与微处理器表面安装工艺有关。为了增加微处理器与印刷电路板的通孔之间的热传导,要安装微处理器的区域通常用焊料复盖。在表面安装过程期间,焊料变成液体。然后,当再次凝固时,焊料形成了微处理器到印刷电路板的导热桥。遗憾的是,焊料形成了表面非常不平的区域。在微处理器与印刷电路板之间的非平面的焊料介面减小了导热桥的传热效率。因此,需要有更有效的芯片安装技术和更有效的热接触。
根据本发明,导热基片安装在印刷电路(“PC”)板的通孔内。然后,集成电路安装到导热基片的一侧,而散热器与导热基片的另一侧热接触。特别是,集成电路安装成与PC板不热接触。由于IC与PC板之间没有直接的热接触,就消除了IC与邻近电路之间的一条传热通道。
根据本发明的一个方面,导热基片包括有第一厚度的第一部分,此第一厚度与导热基片要装入的PC板的厚度大致相同。此外,导热基片包括多个第二部分,它们沿着导热基片的周边隔开。每个第二部分都有厚于第一部分的第二厚度。这样,导热基片的周边包括处于第二厚度的部分和处于第一厚度的其他部分。
根据本发明的另一个方面,PC板有通孔,它有与基片的周边大致相同的形状。可是,通孔有比基片面积稍大的面积。最初,把导热基片装入通孔时,基片与印刷电路板不接触。更准确地说,在基片与PC板之间有间隙。
根据本发明的另一个方面,通过对基片的第二部分的法面施加受控的压力,来把基片安装到PC板。这压力使第二部分处的材料移动,实际上减小了厚度和扩展了第二部分的面积。在最佳实施例中,第二部分被压到与基片的第一部分有相同的厚度。这种压缩使第二部分处的材料移动到第二部分与PC板之间的间隙中,并与PC板相接触。事实上,第二部分的面积已越过间隙扩展,把基片固定在PC板内。应当指出的是,基片与PC板之间的接触只存在于基片周边的第二部分处,而不在第一部分处。一旦基片固定到位,在导热基片与PC板的各层之间,除基片的第二部分以外的任何部分都存在空气间隙。
根据本发明的另一个方面,PC板的各导电层与容纳基片第二部分的PC板的通孔部分隔离。在最佳实施例中,PC板的各导电层与整个通孔隔离。通孔的壁是绝热的。
根据本发明的另一个方面,集成电路被安装在基片的一侧。在最佳实施例中,使用粘合剂来安装集成电路,以便提供平滑的共面接触。共面接触提供了从IC到基片的连续的有效的传热桥。根据本发明的另一个方面,散热器与基片的底面热接触。
本发明的一个好处是,减少了在给定的集成电路,例如在高速微处理器与邻近电路之间的热传导。另一个好处是,在给定的集成电路与散热器之间建立有效的传热通道。再另一个好处是,在给定的集成电路封装与基片之间建立有效的热接触。
这种安装方法的一个优点是迅速和容易地安装基片。与慢的焊接安装工艺相比,作为自动安装工艺,第二部分的压缩能快而有效地实现。此外,不采用焊接安装就不再需要原先为焊接安装准备的附加的面积部分,并且把焊接接触的边缘换成第二部分接触周边。这样做的结果是,得到相对小的基片与PC板之间的接触面积和较薄的接近于PC板厚度的基片。较薄的基片减小了从集成电路越过基片到散热器的热传导路径的长度。当结合附图,参考下面详细的描述,就会清楚本发明的这些和其它方面和优点。
图1是配置来在集成电路与散热器之间实现传统的热传导方法的PC板、集成电路和散热器的分解的横截面图;
图2是图1的PC板、集成电路和散热器的横截面图;
图3是图1的PC板的底面的局部视图;
图4是配置来在集成电路与散热器之间实现另一种传统热传导方法的PC板、集成电路和两块散热器的横截面图;
图5是配置来实现根据本发明的实施例的传热方法的PC板、集成电路、导热基片和散热器的分解的横截面图;
图6是安装前图5的导热基片与PC板的一部分的平面图;
图7是安装后图5的导热基片与PC板的一部分的平面图;和
图8是组装后PC板、集成电路、导热基片与散热器的横截面图。
图1和2表示用于把热从高速微处理器集成电路12传导出去的传统的散热结构。微处理器12通常通过热安装带15或者别的表面安装技术安装在多层PC板14上。微处理器包括触点16,它使得能与其它集成电路、器件和信号通道电连接。通常,一种聚酰胺结构18在微处理器12与PC板之间构成接触连接。聚酰胺结构18包括压装到微处理器的触点16的内引线20和焊接到PC板迹线的外引线22。聚酰胺结构18有内部电路通道,这些电路通道被绘制成在给定的内引线20(因而在所希望的微处理器的触点16)与给定的外引线22(因而在所希望的PC板迹线)之间形成所希望的通道连接。通常在邻近聚酰胺结构的微处理器12表面处涂上密封剂19。
PC板由多层24构成,它们用于形成把微处理器12与装在PC板14上的其他集成电路互连的PC信号通道迹线。PC板14包括在微处理器要安装的区域内的多个通孔26(见图3)。为了说明,以夸大的直径表示出通孔26。典型的通孔有大约14密耳(0.014英寸)的直径。虽然只表示了4×4个通孔26的阵列29,但传统上位于微处理器底面的下面有大约100个通孔,在每边伸展0.5英寸。通孔有衬铜的壁28(见图1和2),它起着传热导体的作用。在通孔26区域,散热器30固定在PC板14的底面32。通常,用安装螺丝34把散热器30固定在PC板14。热从微处理器12沿着铜壁28传到散热器30。可是,这种铜壁28也与PC板各层24处在紧密的热接触下。在PC板各层24所形成的导电的信号通道也是由铜或别的有效的热导体形成的。因此,也存在把微处理器的热传导到微处理器周围的其它集成电路的传热通道。这是不希望的,因为这些别的集成电路通常忍受不了象微处理器那样提高了的工作温度,和/或没有散热器来进行近距离的热交换。
图4表示把热从高速微处理器集成电路12传走的另一传统散热结构35。一种有两段31和33的散热器30’把微处理器12夹在中间,把热从微处理器12传走。下段31与微处理器的底面热接触,而上段33与微处理器的上表面热接触。用于微处理器12的PC板14有开孔36,散热器段31的部分37伸入此开孔36中。散热器部分37填在开孔36内。微处理器12通过热安装带安装到散热器的下段31。散热器的上段33有腿38。通过穿过PC板14伸到腿38内的固定螺钉34,把上段33紧固到散热器的下段31。
为了组装结构35,微处理器12通过带引线22的聚酰胺结构安装到PC板14上。其后,贴上热安装带,并插入散热器30’的下段31,使之通过热安装带与微处理器12接触。最后,加上上段33,并把它紧固在下段31上。这种散热结构35和组装方法的缺点是微处理器12安装到散热器上。这样,散热器30’必须与微处理器12同时安装。否则,微处理器12在PC板上的开孔36上失去支持。这样一种状态使得微处理器12很容易由于任何突然的冲击运动而损坏。结果,当安装微处理器12时,要安装散热器30’。可是,散热器30’的庞大使得更难以在PC板上安装其它元件。
散热结构实施例
图5和6表示根据本发明的实施例的把热从集成电路(“IC”)42传走的散热结构40。IC 42是微处理器或其它产生热的IC。图中示出的是具有突出的带自动粘合的(“TAB”)触点44的IC 42。本发明的散热方案也包括有其它引线配置或特殊的封装外壳的IC’s。聚酰胺结构18在微处理器42与PC板迹线之间形成接触连接。聚酰胺结构18包括压装到微处理器的触点44的内引线20和焊接到PC板迹线的外引线22。聚酰胺结构18有内部电路通道,它们被设计成在给定的内引线20(因而在所希望的微处理器的触点44)与给定的外引线22(因而在所希望的PC板迹线)之间形成所希望的通道连接。在邻近聚酰胺结构18的微处理器12表面处涂上密封剂45。
IC42以它的底面82通过热安装带65安装到导热基片50上。在最佳实施例中,基片50由铜或银制成。基片50被安装到多层印刷电路(“PC”)板52上。PC板包括上层54、底层56和一层或多层中间层58。通常每一层54-58都是带有在其上形成的各种导电信号通道的绝缘层。PC板52有穿透整块板的开孔60。
基片50安装到PC板52上时伸进开孔60内。如图5所示,在安装之前,基片50包括有第一厚度的第一部分69和多个有第二厚度的第二部分71。在最佳实施例中,此第一厚度等于或大致等于PC板52的厚度。第二厚度大于第一厚度。多个第二部分71的每一个都处于沿基片50的周边的位置。基片50有第一表面64和第二表面66,还有伸出基片50周边的侧缘67。第一部分69和第二部分71都有基片50的第一表面64和第二表面66。可是,部分71的第一表面64高于部分69的第一表面64。与此相似,部分71的第二表面66突出于部分69的第二表面66。第一表面的面积等于第二表面的面积。此外,第一表面的面积小于通孔60的面积。
图6表示基片50与带通孔60的PC板52的作为范例的实施例。在安装之前,基片50配入并通过PC板52的通孔60。特别是,PC板52的壁73定出了通孔60的范围,通孔60有与基片50的轮廓相同或相似的轮廓。这样,当最初把基片50放在通孔60内时,在基片周边的边缘67与通孔60的壁73之间有空气隙75。沿整个基片周边在整个通孔60的深度上都有这空气隙。虽然根据其它实施例、空气隙的宽度会改变,但是,在一个实施例中,这空气隙的宽度是0.01英寸。在最佳实施例中,无论在基片50安装前还是安装后,基片50的体积都小于通孔60的体积。
在基片50处于通孔60中的情况下,通过对第二部分71的第一表面64和第二表面66加力来安装基片。这力足以使第二部分71变形。具体地说,第二部分被压得减小第二部分71的原来的第二厚度,达到与第一部分69的厚度相同或大致相同的厚度。这压缩使得第二部分71膨胀而进入围绕着第二部分71的各自间隙75的部分。此外,第二部分71膨胀到与邻近第二部分71的通孔60的壁73相接触。这第二部分71的膨胀足以把基片50固定在通孔60内。图7表示固定在PC板52的通孔60内的基片50。应当指出,在基片边缘67与沿基片周边的一部分的通孔壁73之间仍然有空气间隙75存在。这样的周边部分是第一部分69的边缘67。在基片50固定到位的情况下,基片的面积和体积小于通孔60的面积和体积。在另一实施例中,基片50的第一厚度大于PC板的厚度。当固定这种基片时,基片从通孔60突出,并有大于通孔60的体积。可是,通孔的平面面积(这面积就是从图6和7所看到的平面面积)大于在每个实施例中的第一表面64或第二表面66的平面面积。
在一个实施例中,PC板由多层这样的绝缘材料层构成,在这些绝缘材料层中的一层或几层上有导电迹线。根据最佳实施例,导电迹线并不延伸到或沿着通孔壁73走。这种壁由PC板的玻璃纤维基材料或别的热绝缘材料形成。电绝缘壁73的一个优点是,在PC板与基片50之间不会发生短路。热绝缘壁73的一个优点是,接近通孔的PC板元件不会受到从IC42到基片50的热流的明显的冲击。
如图8所示,散热器90安装到基片50上。在一个实施例中,基片50有螺孔92,用于拧入把散热器固定到基片的螺钉96。散热器90伸展到与基片50相同或更大的面积上。散热器90最好与PC板的底面70隔开。在某些实施例中,散热器90固定在PC板52的底面70,同时用绝热垫圈与PC板隔开(未示出)。
基片50起着把热从IC 42传到散热器90的有效传热通道的作用。因为IC42安装在基片上,从IC42到PC板52没有直接的热传导。通过把IC42安装在基片,消除了传统的从IC到PC板的传热通道。通过在基片50与PC板52之间形成空气隙80,避免了层54、58的其它潜在的传热通道。
本发明的一个优点是减小了在给定的集成电路例如高速微处理器与邻近电路之间的热传导。另一个优点是,在给定的集成电路与散热器之间建立了有效的传热通道。另一个优点是,在给定的集成电路与基片之间建立了有效的热接触。
虽然已经说明和描述了本发明的最佳实施例,但可以采用各种变化、改型和等效的方法。因此,上面的描述不应看作是对本发明的范围的限制,本发明的范围只受限于所附的权利要求书所确定的范围。
Claims (10)
1.一种在集成电路(42)与散热器(90)之间形成传热通道的方法,其特征在于包括:
把导热基片(50)压装在PC板(52)的通孔(60)内;
把集成电路固定到基片的第一表面区(64)上而形成热接触,集成电路有底面区(82),基片的第一表面的面积起码与集成电路的底面面积一样大;以及
把散热器安装到基片下而形成热接触,同时,在散热器与PC板之间没有直接的热接触。
2.权利要求1的方法,其特征在于压装的步骤包括下面的步骤:
把基片插入PC板的通孔,在PC板与通孔内的基片之间有间隙(75),并且基片有其厚度为第一厚度的第一部分(69)和其厚度为第二厚度的第二部分(71),第二厚度大于第一厚度;以及
对基片的第二部分施加压力,使第二部分减小厚度,并横过间隙膨胀从而与PC板接触。
3.权利要求2的方法,其特征在于在施加压力的步骤之前,沿着基片的整个周边,在PC板与通孔内的基片之间有间隙。
4.权利要求3的方法,其特征在于在施加压力的步骤之后,沿着基片的小于整个周边的周边,在PC板与通孔内的基片之间有间隙。
5.权利要求1,2,3或4的方法,其特征在于PC板的通孔由壁所确定,并且与基片有物理接触的通孔的壁是绝热的。
6.权利要求1,2,3,4或5的方法,其特征在于在安装步骤之后,基片的的体积小于通孔的体积。
7.权利要求1,2,3,4,5或6的方法,其特征在于在安装步骤之后,基片的面积小于通孔的面积。
8.把热从集成电路(42)传开的装置,所述集成电路有底面区(82),其特征在于这装置包括:
形成具有第一面积和第一体积的通孔(60)的PC板(52);
设置在通孔内的导热基片(50),所述导热基片有面积小于第一面积而又起码与集成电路底面面积一样大的第一表面(64),集成电路被固定成以其底面区与导热基片的第一表面热接触,并且导热基片有处于第一表面的背面的第二表面,其面积小于第一面积,导热基片在基片的周边有多个突起部(71),这些突起部在通孔处与PC板处于物理接触。
9.权利要求8的装置,其特征在于它还包括可拆卸地安装在基片上的散热器(90)。
10.权利要求8或9的装置,其特征在于基片有小于第一体积的体积,通孔由PC板的壁所限定,并且离开所述突起部的基片的周边部分与通孔的壁有间隙(75)。
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-
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- 1997-10-28 US US08/958,954 patent/US5960535A/en not_active Expired - Fee Related
-
1998
- 1998-06-06 SG SG1998001253A patent/SG71795A1/en unknown
- 1998-07-16 TW TW087111604A patent/TW430961B/zh not_active IP Right Cessation
- 1998-07-28 CN CNB981166911A patent/CN1155082C/zh not_active Expired - Fee Related
- 1998-09-23 EP EP98307725A patent/EP0913861B1/en not_active Expired - Lifetime
- 1998-09-23 EP EP04076633A patent/EP1496546A2/en not_active Withdrawn
- 1998-09-23 DE DE69829536T patent/DE69829536T2/de not_active Expired - Fee Related
- 1998-10-28 JP JP10307070A patent/JPH11330750A/ja active Pending
-
1999
- 1999-06-28 US US09/343,161 patent/US6018193A/en not_active Expired - Fee Related
- 1999-09-13 HK HK99103974A patent/HK1018920A1/xx not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100335993C (zh) * | 2002-03-07 | 2007-09-05 | 株式会社东芝 | 具有促进存储器模块中热辐射的导热板的电子设备 |
CN100373600C (zh) * | 2003-03-25 | 2008-03-05 | 东芝开利株式会社 | 散热装置 |
CN1296918C (zh) * | 2003-10-13 | 2007-01-24 | 华硕电脑股份有限公司 | 光学读写头的控制芯片散热机构 |
CN104684338A (zh) * | 2013-11-26 | 2015-06-03 | 台达电子企业管理(上海)有限公司 | 散热基座与电子装置 |
CN113709968A (zh) * | 2021-09-10 | 2021-11-26 | 上海移远通信技术股份有限公司 | 一种pcb散热组件 |
Also Published As
Publication number | Publication date |
---|---|
TW430961B (en) | 2001-04-21 |
DE69829536D1 (de) | 2005-05-04 |
US5960535A (en) | 1999-10-05 |
EP1496546A2 (en) | 2005-01-12 |
EP0913861A2 (en) | 1999-05-06 |
DE69829536T2 (de) | 2006-02-16 |
EP0913861B1 (en) | 2005-03-30 |
EP0913861A3 (en) | 1999-07-28 |
SG71795A1 (en) | 2000-04-18 |
US6018193A (en) | 2000-01-25 |
JPH11330750A (ja) | 1999-11-30 |
CN1155082C (zh) | 2004-06-23 |
HK1018920A1 (en) | 2000-01-07 |
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