SG71795A1 - Heat conductive substrate press-mounted in pc board hole for transferring heat from ic to heat sink - Google Patents
Heat conductive substrate press-mounted in pc board hole for transferring heat from ic to heat sinkInfo
- Publication number
- SG71795A1 SG71795A1 SG1998001253A SG1998001253A SG71795A1 SG 71795 A1 SG71795 A1 SG 71795A1 SG 1998001253 A SG1998001253 A SG 1998001253A SG 1998001253 A SG1998001253 A SG 1998001253A SG 71795 A1 SG71795 A1 SG 71795A1
- Authority
- SG
- Singapore
- Prior art keywords
- heat
- conductive substrate
- board hole
- substrate press
- transferring
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/958,954 US5960535A (en) | 1997-10-28 | 1997-10-28 | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
SG71795A1 true SG71795A1 (en) | 2000-04-18 |
Family
ID=25501485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998001253A SG71795A1 (en) | 1997-10-28 | 1998-06-06 | Heat conductive substrate press-mounted in pc board hole for transferring heat from ic to heat sink |
Country Status (8)
Country | Link |
---|---|
US (2) | US5960535A (zh) |
EP (2) | EP0913861B1 (zh) |
JP (1) | JPH11330750A (zh) |
CN (1) | CN1155082C (zh) |
DE (1) | DE69829536T2 (zh) |
HK (1) | HK1018920A1 (zh) |
SG (1) | SG71795A1 (zh) |
TW (1) | TW430961B (zh) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6235991B1 (en) * | 1998-06-30 | 2001-05-22 | Lucent Technologies Inc. | Recessed mechanical fasteners for circuit boards |
TW451535B (en) * | 1998-09-04 | 2001-08-21 | Sony Corp | Semiconductor device and package, and fabrication method thereof |
US6352203B1 (en) * | 1999-03-17 | 2002-03-05 | Compaq Information Technologies Group, L.P. | Automated semiconductor identification system |
US6188579B1 (en) * | 1999-07-12 | 2001-02-13 | Lucent Technologies Inc. | Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage |
US6219243B1 (en) * | 1999-12-14 | 2001-04-17 | Intel Corporation | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
DE10142987A1 (de) * | 2001-09-01 | 2003-04-03 | Conti Temic Microelectronic | Wärmeableitelement für elektronische Bauteile |
US6563696B1 (en) * | 2001-10-17 | 2003-05-13 | Ciena Corporation | Solderless laser assembly |
US7206626B2 (en) * | 2002-03-06 | 2007-04-17 | Z-Kat, Inc. | System and method for haptic sculpting of physical objects |
JP3583762B2 (ja) * | 2002-03-07 | 2004-11-04 | 株式会社東芝 | 電子機器 |
EP1333492B1 (en) * | 2002-11-08 | 2006-03-01 | Agilent Technologies Inc. a Delaware Corporation | Cooling a microchip on a circuit board |
JP3790225B2 (ja) * | 2003-03-25 | 2006-06-28 | 東芝キヤリア株式会社 | 放熱装置 |
EP1480269A1 (en) * | 2003-05-13 | 2004-11-24 | Agilent Technologies Inc | Printed Circuit Board with improved cooling of electrical component |
DE10335129B3 (de) * | 2003-07-31 | 2005-06-23 | Kathrein-Werke Kg | Kühlanordnung für auf einer Leiterplatte angeordnete elektrische Bauelemente, insbesondere SMD-Bausteine |
CN1296918C (zh) * | 2003-10-13 | 2007-01-24 | 华硕电脑股份有限公司 | 光学读写头的控制芯片散热机构 |
US7145774B2 (en) * | 2003-12-29 | 2006-12-05 | Intel Corporation | Backside cooling apparatus for modular platforms |
US20050236716A1 (en) * | 2004-04-22 | 2005-10-27 | Hsuch-Chung Chen | Heat dissipation structure and method thereof |
US7199496B2 (en) * | 2005-01-18 | 2007-04-03 | Oriental Motor Boston Technology Group Incorporated | Integrated electric motor and drive, optimized for high-temperature operation |
JP4538359B2 (ja) * | 2005-03-31 | 2010-09-08 | 株式会社日立産機システム | 電気回路モジュール |
DE102005049872B4 (de) * | 2005-10-18 | 2010-09-23 | Continental Automotive Gmbh | IC-Bauelement mit Kühlanordnung |
TWI340010B (en) * | 2006-08-04 | 2011-04-01 | Everlight Electronics Co Ltd | Circuit board with cooling functionality |
CN101026953B (zh) * | 2007-03-29 | 2010-07-28 | 杭州华三通信技术有限公司 | 压力安装装置及压力安装方法 |
US7706144B2 (en) * | 2007-12-17 | 2010-04-27 | Lynch Thomas W | Heat dissipation system and related method |
US7724528B2 (en) * | 2008-07-11 | 2010-05-25 | Cisco Technology, Inc. | Thermal dissipation heat slug sandwich |
JP4789997B2 (ja) * | 2008-11-20 | 2011-10-12 | 三菱電機株式会社 | 電子基板装置 |
CN102347437A (zh) * | 2010-07-30 | 2012-02-08 | 欧司朗有限公司 | 电子发热模块及其制造方法 |
JP2012142391A (ja) * | 2010-12-28 | 2012-07-26 | Sumitomo Electric Ind Ltd | 電気機器および電気機器の製造方法 |
FR2973942B1 (fr) * | 2011-04-08 | 2013-09-06 | Continental Automotive France | Composant électronique avec pastille de dissipation thermique et carte utilisant ce composant |
US9209106B2 (en) * | 2012-06-21 | 2015-12-08 | Ati Technologies Ulc | Thermal management circuit board for stacked semiconductor chip device |
CN104684338B (zh) * | 2013-11-26 | 2018-01-30 | 台达电子企业管理(上海)有限公司 | 散热基座与电子装置 |
CN106488686B (zh) * | 2015-08-31 | 2020-09-29 | 上海伯乐电子有限公司 | 照明器件、电气组件、柔性电路及热传递方法 |
CN108781018B (zh) | 2016-03-11 | 2021-09-21 | Itt制造企业有限责任公司 | 包括具有多层功率和控制印刷电路板组件的功率平面的用于驱动泵或旋转装置的电机组件 |
US10504813B2 (en) * | 2016-09-30 | 2019-12-10 | Astec International Limited | Heat sink assemblies for surface mounted devices |
US11394264B2 (en) | 2020-01-21 | 2022-07-19 | Itt Manufacturing Enterprises Llc | Motor assembly for driving a pump or rotary device with a low inductance resistor for a matrix converter |
US11448225B2 (en) | 2020-01-21 | 2022-09-20 | Itt Manufacturing Enterprises Llc | Motor assembly for driving a pump or rotary device having a cooling duct |
US11451156B2 (en) | 2020-01-21 | 2022-09-20 | Itt Manufacturing Enterprises Llc | Overvoltage clamp for a matrix converter |
KR20230011733A (ko) * | 2021-07-14 | 2023-01-25 | 엘지이노텍 주식회사 | 전자장치 |
CN113709968A (zh) * | 2021-09-10 | 2021-11-26 | 上海移远通信技术股份有限公司 | 一种pcb散热组件 |
Family Cites Families (27)
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DE3378871D1 (en) * | 1982-09-09 | 1989-02-09 | Siemens Ag | Cooling device for a plurality of integrated components assembled as a flat structure |
US4602314A (en) * | 1983-10-14 | 1986-07-22 | Intel Corporation | Heat conduction mechanism for semiconductor devices |
IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
US4750089A (en) * | 1985-11-22 | 1988-06-07 | Texas Instruments Incorporated | Circuit board with a chip carrier and mounting structure connected to the chip carrier |
US4731693A (en) * | 1986-09-29 | 1988-03-15 | Tektronix, Inc. | Connection apparatus for integrated circuit |
JP2590521B2 (ja) * | 1988-03-29 | 1997-03-12 | 日本電気株式会社 | チップキャリア |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
JPH0279451A (ja) * | 1988-09-14 | 1990-03-20 | Hitachi Ltd | 半導体装置およびその製造方法 |
US5095404A (en) * | 1990-02-26 | 1992-03-10 | Data General Corporation | Arrangement for mounting and cooling high density tab IC chips |
US5099309A (en) * | 1990-04-30 | 1992-03-24 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
JP2745786B2 (ja) * | 1990-06-15 | 1998-04-28 | 松下電器産業株式会社 | Tab半導体装置 |
IT1250405B (it) * | 1991-01-31 | 1995-04-07 | Sgs Thomson Microelectronics | Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa |
JPH0582685A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法 |
US5172301A (en) * | 1991-10-08 | 1992-12-15 | Lsi Logic Corporation | Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same |
US5278724A (en) * | 1992-07-06 | 1994-01-11 | International Business Machines Corporation | Electronic package and method of making same |
DE4232575A1 (de) * | 1992-09-29 | 1994-03-31 | Bosch Gmbh Robert | Anordnung mit einer Leiterplatte, mindestens einem Leistungsbauelement und einem Kühlkörper |
KR100307465B1 (ko) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | 파워모듈 |
US5481136A (en) * | 1992-10-28 | 1996-01-02 | Sumitomo Electric Industries, Ltd. | Semiconductor element-mounting composite heat-sink base |
US5886407A (en) * | 1993-04-14 | 1999-03-23 | Frank J. Polese | Heat-dissipating package for microcircuit devices |
US5444296A (en) * | 1993-11-22 | 1995-08-22 | Sun Microsystems, Inc. | Ball grid array packages for high speed applications |
US5410451A (en) * | 1993-12-20 | 1995-04-25 | Lsi Logic Corporation | Location and standoff pins for chip on tape |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
EP0742682B1 (en) * | 1995-05-12 | 2005-02-23 | STMicroelectronics, Inc. | Low-profile socketed integrated circuit packaging system |
US5617294A (en) * | 1995-09-29 | 1997-04-01 | Intel Corporation | Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board |
US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
US5856911A (en) * | 1996-11-12 | 1999-01-05 | National Semiconductor Corporation | Attachment assembly for integrated circuits |
US5920458A (en) * | 1997-05-28 | 1999-07-06 | Lucent Technologies Inc. | Enhanced cooling of a heat dissipating circuit element |
-
1997
- 1997-10-28 US US08/958,954 patent/US5960535A/en not_active Expired - Fee Related
-
1998
- 1998-06-06 SG SG1998001253A patent/SG71795A1/en unknown
- 1998-07-16 TW TW087111604A patent/TW430961B/zh not_active IP Right Cessation
- 1998-07-28 CN CNB981166911A patent/CN1155082C/zh not_active Expired - Fee Related
- 1998-09-23 EP EP98307725A patent/EP0913861B1/en not_active Expired - Lifetime
- 1998-09-23 EP EP04076633A patent/EP1496546A2/en not_active Withdrawn
- 1998-09-23 DE DE69829536T patent/DE69829536T2/de not_active Expired - Fee Related
- 1998-10-28 JP JP10307070A patent/JPH11330750A/ja active Pending
-
1999
- 1999-06-28 US US09/343,161 patent/US6018193A/en not_active Expired - Fee Related
- 1999-09-13 HK HK99103974A patent/HK1018920A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW430961B (en) | 2001-04-21 |
DE69829536D1 (de) | 2005-05-04 |
US5960535A (en) | 1999-10-05 |
EP1496546A2 (en) | 2005-01-12 |
EP0913861A2 (en) | 1999-05-06 |
DE69829536T2 (de) | 2006-02-16 |
CN1215922A (zh) | 1999-05-05 |
EP0913861B1 (en) | 2005-03-30 |
EP0913861A3 (en) | 1999-07-28 |
US6018193A (en) | 2000-01-25 |
JPH11330750A (ja) | 1999-11-30 |
CN1155082C (zh) | 2004-06-23 |
HK1018920A1 (en) | 2000-01-07 |
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