CN121420628A - 印刷布线板及印刷布线板的制造方法 - Google Patents

印刷布线板及印刷布线板的制造方法

Info

Publication number
CN121420628A
CN121420628A CN202480044112.9A CN202480044112A CN121420628A CN 121420628 A CN121420628 A CN 121420628A CN 202480044112 A CN202480044112 A CN 202480044112A CN 121420628 A CN121420628 A CN 121420628A
Authority
CN
China
Prior art keywords
region
plating layer
hole
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480044112.9A
Other languages
English (en)
Chinese (zh)
Inventor
松冈秀树
木谷聪志
宫田和弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN121420628A publication Critical patent/CN121420628A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202480044112.9A 2023-07-21 2024-06-24 印刷布线板及印刷布线板的制造方法 Pending CN121420628A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023119454 2023-07-21
JP2023-119454 2023-07-21
PCT/JP2024/022768 WO2025022898A1 (ja) 2023-07-21 2024-06-24 プリント配線板およびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN121420628A true CN121420628A (zh) 2026-01-27

Family

ID=94375147

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480044112.9A Pending CN121420628A (zh) 2023-07-21 2024-06-24 印刷布线板及印刷布线板的制造方法

Country Status (3)

Country Link
JP (1) JPWO2025022898A1 (https=)
CN (1) CN121420628A (https=)
WO (1) WO2025022898A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3775970B2 (ja) * 2000-03-27 2006-05-17 新光電気工業株式会社 電子部品実装用基板の製造方法
JP2017041475A (ja) * 2015-08-17 2017-02-23 凸版印刷株式会社 配線基板及び多層配線基板、配線基板の製造方法
JP6986221B2 (ja) * 2016-06-15 2021-12-22 大日本印刷株式会社 孔電極基板の製造方法、孔電極基板および半導体装置
JP6819268B2 (ja) * 2016-12-15 2021-01-27 凸版印刷株式会社 配線基板、多層配線基板、及び配線基板の製造方法

Also Published As

Publication number Publication date
JPWO2025022898A1 (https=) 2025-01-30
WO2025022898A1 (ja) 2025-01-30

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