JPWO2025022898A1 - - Google Patents
Info
- Publication number
- JPWO2025022898A1 JPWO2025022898A1 JP2025535650A JP2025535650A JPWO2025022898A1 JP WO2025022898 A1 JPWO2025022898 A1 JP WO2025022898A1 JP 2025535650 A JP2025535650 A JP 2025535650A JP 2025535650 A JP2025535650 A JP 2025535650A JP WO2025022898 A1 JPWO2025022898 A1 JP WO2025022898A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023119454 | 2023-07-21 | ||
| PCT/JP2024/022768 WO2025022898A1 (ja) | 2023-07-21 | 2024-06-24 | プリント配線板およびプリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025022898A1 true JPWO2025022898A1 (https=) | 2025-01-30 |
| JPWO2025022898A5 JPWO2025022898A5 (https=) | 2026-04-21 |
Family
ID=94375147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535650A Pending JPWO2025022898A1 (https=) | 2023-07-21 | 2024-06-24 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025022898A1 (https=) |
| CN (1) | CN121420628A (https=) |
| WO (1) | WO2025022898A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3775970B2 (ja) * | 2000-03-27 | 2006-05-17 | 新光電気工業株式会社 | 電子部品実装用基板の製造方法 |
| JP2017041475A (ja) * | 2015-08-17 | 2017-02-23 | 凸版印刷株式会社 | 配線基板及び多層配線基板、配線基板の製造方法 |
| JP6986221B2 (ja) * | 2016-06-15 | 2021-12-22 | 大日本印刷株式会社 | 孔電極基板の製造方法、孔電極基板および半導体装置 |
| JP6819268B2 (ja) * | 2016-12-15 | 2021-01-27 | 凸版印刷株式会社 | 配線基板、多層配線基板、及び配線基板の製造方法 |
-
2024
- 2024-06-24 WO PCT/JP2024/022768 patent/WO2025022898A1/ja active Pending
- 2024-06-24 CN CN202480044112.9A patent/CN121420628A/zh active Pending
- 2024-06-24 JP JP2025535650A patent/JPWO2025022898A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025022898A1 (ja) | 2025-01-30 |
| CN121420628A (zh) | 2026-01-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260115 |