CN121232530A - 单体、聚合物和包含其的光刻组合物 - Google Patents

单体、聚合物和包含其的光刻组合物

Info

Publication number
CN121232530A
CN121232530A CN202511456411.6A CN202511456411A CN121232530A CN 121232530 A CN121232530 A CN 121232530A CN 202511456411 A CN202511456411 A CN 202511456411A CN 121232530 A CN121232530 A CN 121232530A
Authority
CN
China
Prior art keywords
monomers
groups
photoresist
acid
polymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202511456411.6A
Other languages
English (en)
Chinese (zh)
Inventor
E·阿卡德
J·F·卡梅伦
J·W·萨克莱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
DuPont Electronic Materials International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DuPont Electronic Materials International LLC filed Critical DuPont Electronic Materials International LLC
Publication of CN121232530A publication Critical patent/CN121232530A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • C08F230/04Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C395/00Compounds containing tellurium
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D345/00Heterocyclic compounds containing rings having selenium or tellurium atoms as the only ring hetero atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F11/00Compounds containing elements of Groups 6 or 16 of the Periodic Table
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F230/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F30/00Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters
    • C09D133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D143/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Coating compositions based on derivatives of such polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0042Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094Multilayer resist systems, e.g. planarising layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • G03F7/322Aqueous alkaline compositions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma & Fusion (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CN202511456411.6A 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物 Pending CN121232530A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762612555P 2017-12-31 2017-12-31
US62/612,555 2017-12-31
CN201811552540.5A CN109988259B (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201811552540.5A Division CN109988259B (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物

Publications (1)

Publication Number Publication Date
CN121232530A true CN121232530A (zh) 2025-12-30

Family

ID=67058820

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202511456411.6A Pending CN121232530A (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物
CN202211143472.3A Active CN115373221B (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物
CN201811552540.5A Active CN109988259B (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202211143472.3A Active CN115373221B (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物
CN201811552540.5A Active CN109988259B (zh) 2017-12-31 2018-12-18 单体、聚合物和包含其的光刻组合物

Country Status (5)

Country Link
US (1) US11932713B2 (https=)
JP (3) JP2019119851A (https=)
KR (1) KR102208670B1 (https=)
CN (3) CN121232530A (https=)
TW (1) TWI733069B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6810728B2 (ja) 2017-11-30 2021-01-06 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC 双性イオン化合物およびそれを含むフォトレジスト
CN109851539A (zh) 2017-11-30 2019-06-07 罗门哈斯电子材料有限责任公司 盐和包含其的光致抗蚀剂
KR20220104708A (ko) * 2019-11-20 2022-07-26 에이에스엠엘 네델란즈 비.브이. 레지스트 조성물
JPWO2022130919A1 (https=) * 2020-12-14 2022-06-23
US12393118B2 (en) * 2021-05-28 2025-08-19 Dupont Electronic Materials International, Llc Composition for photoresist underlayer
US20240369924A1 (en) * 2021-07-30 2024-11-07 Mitsubishi Gas Chemical Company, Inc. Resist composition and resist film forming method using same
JPWO2023008355A1 (https=) * 2021-07-30 2023-02-02
JP7802644B2 (ja) * 2021-11-09 2026-01-20 信越化学工業株式会社 半導体基板パターン倒壊抑制用充填膜形成材料及び半導体基板の処理方法
US20240393689A1 (en) * 2023-05-26 2024-11-28 Dupont Electronic Materials International, Llc Compounds, monomers, polymers, photoresist compositions and pattern formation methods
WO2025197401A1 (ja) * 2024-03-22 2025-09-25 Jsr株式会社 感放射線性組成物及びレジストパターン形成方法
WO2026009861A1 (ja) * 2024-07-05 2026-01-08 三菱瓦斯化学株式会社 半導体製造用組成物及び膜形成方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE792908A (fr) * 1971-12-20 1973-04-16 Western Electric Co Procede de fabrication de dispositifs semi-conducteurs
US4434098A (en) * 1981-07-01 1984-02-28 Eastman Kodak Company Substituted benzotelluropyrones
JPS62287201A (ja) * 1986-06-06 1987-12-14 Canon Inc 光学素子用樹脂
GB2192189B (en) * 1986-06-06 1990-08-22 Canon Kk Polymer of vinyl-biphenyl derivative adapted for optical use
US5043477A (en) * 1987-07-13 1991-08-27 The United States Of America As Represented By The Secretary Of The Navy Methyl allyl telluride
US5264246A (en) * 1989-05-02 1993-11-23 Mitsubishi Denki Kabushiki Kaisha Spin coating method
GB8913799D0 (en) * 1989-06-15 1989-08-02 Secr Defence Method for preparation of organotellurium and selenium compounds
US5212046A (en) * 1989-10-17 1993-05-18 Shipley Company Inc. Near UV photoresist
US5164524A (en) * 1990-02-06 1992-11-17 The United States Of America As Represented By The Secretary Of The Navy Process for preparing tetra (organyl) telluride compounds
JPH0888159A (ja) * 1994-09-16 1996-04-02 Tokyo Gas Co Ltd 高アスペクト比を有するレジストパターン形成方法
US6007963A (en) * 1995-09-21 1999-12-28 Sandia Corporation Method for extreme ultraviolet lithography
JP2001075284A (ja) * 1998-12-03 2001-03-23 Fuji Photo Film Co Ltd ポジ型レジスト組成物
US6787281B2 (en) 2002-05-24 2004-09-07 Kodak Polychrome Graphics Llc Selected acid generating agents and their use in processes for imaging radiation-sensitive elements
US7326514B2 (en) 2003-03-12 2008-02-05 Cornell Research Foundation, Inc. Organoelement resists for EUV lithography and methods of making the same
JP2005344009A (ja) * 2004-06-03 2005-12-15 Shin Etsu Chem Co Ltd レジスト材料用高分子化合物及びその製造方法並びに化学増幅ポジ型レジスト材料
US7459261B2 (en) * 2005-01-06 2008-12-02 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process using the same
WO2007109633A2 (en) * 2006-03-17 2007-09-27 Andover Healthcare, Inc. Organotellurium and selenium-based antimicrobial antimicrobial formulations and articles
JP2008163242A (ja) * 2006-12-28 2008-07-17 Lion Corp コアシェル型ハイパーブランチポリマーの合成方法
JP5756265B2 (ja) 2009-07-27 2015-07-29 住友化学株式会社 化学増幅型レジスト組成物及びそれに用いられる塩
US8632948B2 (en) * 2009-09-30 2014-01-21 Az Electronic Materials Usa Corp. Positive-working photoimageable bottom antireflective coating
KR101830780B1 (ko) * 2011-08-05 2018-04-05 삼성전자주식회사 박막의 제조방법, 박막, 박막의 제조장치 및 전자소자
WO2015080189A1 (ja) * 2013-11-27 2015-06-04 日本ゼオン株式会社 ラジカル重合開始剤、および重合体の製造方法
KR101943347B1 (ko) * 2014-09-02 2019-01-29 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법, 및 전자 디바이스의 제조 방법
US9971243B2 (en) * 2015-06-10 2018-05-15 Samsung Sdi Co., Ltd. Polymer, organic layer composition, organic layer, and method of forming patterns
EP3343290A4 (en) * 2015-08-24 2019-09-04 A School Corporation Kansai University LITHOGRAPHIC MATERIAL AND METHOD OF MANUFACTURING THEREOF, LITHOGRAPHIC COMPOSITION, PATTERN PROCESSING, COMPOUND, RESIN AND METHOD OF PROCESSING FOR CONNECTION AND RESIN
JP6998769B2 (ja) * 2015-10-01 2022-01-18 東洋合成工業株式会社 ポリマー、該ポリマーを含有するレジスト組成物及びそれを用いたデバイスの製造方法
KR102648061B1 (ko) 2015-12-01 2024-03-18 제이에스알 가부시끼가이샤 감방사선성 조성물, 패턴 형성 방법 및 감방사선성 산 발생제
US10503070B2 (en) * 2015-12-10 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Photosensitive material and method of lithography
KR20170098173A (ko) * 2016-02-19 2017-08-29 제이에스알 가부시끼가이샤 감방사선성 조성물 및 패턴 형성 방법
KR20190003528A (ko) * 2016-04-28 2019-01-09 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 레지스트 하층막 형성용 조성물, 리소그래피용 하층막, 및, 패턴 형성방법
JP2019113571A (ja) 2016-04-28 2019-07-11 三菱瓦斯化学株式会社 レジスト下層膜形成用組成物、並びに、それを用いたリソグラフィー用下層膜及びパターン形成方法
JP2017207532A (ja) 2016-05-16 2017-11-24 東洋合成工業株式会社 レジスト組成物及びそれを用いたデバイスの製造方法
WO2018117167A1 (ja) * 2016-12-21 2018-06-28 東洋合成工業株式会社 感光性化合物、該感光性化合物を含有する光酸発生剤及びレジスト組成物、並びに、該レジスト組成物を用いたデバイスの製造方法
JP6820233B2 (ja) * 2017-05-26 2021-01-27 東洋合成工業株式会社 ポリマー、該ポリマーを含有するレジスト組成物及びそれを用いたデバイスの製造方法
WO2019006600A1 (zh) * 2017-07-03 2019-01-10 深圳市宏昌发科技有限公司 抛光剂、铜件及其抛光处理方法
TW201923451A (zh) * 2017-09-29 2019-06-16 學校法人關西大學 微影用組成物、圖案形成方法及化合物
CN109856911B (zh) * 2017-11-30 2023-10-27 罗门哈斯电子材料有限责任公司 盐和包含其的光致抗蚀剂
JP6810728B2 (ja) * 2017-11-30 2021-01-06 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC 双性イオン化合物およびそれを含むフォトレジスト
CN109851539A (zh) * 2017-11-30 2019-06-07 罗门哈斯电子材料有限责任公司 盐和包含其的光致抗蚀剂
CN112088336A (zh) * 2018-04-27 2020-12-15 三菱瓦斯化学株式会社 抗蚀剂下层膜形成用组合物和图案形成方法

Also Published As

Publication number Publication date
TWI733069B (zh) 2021-07-11
JP6983970B2 (ja) 2021-12-17
JP2021005115A (ja) 2021-01-14
CN109988259A (zh) 2019-07-09
CN115373221B (zh) 2025-10-10
CN109988259B (zh) 2022-10-14
JP2021005116A (ja) 2021-01-14
JP2019119851A (ja) 2019-07-22
KR20190082663A (ko) 2019-07-10
KR102208670B1 (ko) 2021-01-27
JP7206242B2 (ja) 2023-01-17
TW201930283A (zh) 2019-08-01
US11932713B2 (en) 2024-03-19
CN115373221A (zh) 2022-11-22
US20190202955A1 (en) 2019-07-04

Similar Documents

Publication Publication Date Title
CN115373221B (zh) 单体、聚合物和包含其的光刻组合物
CN104216224B (zh) 包含氨基甲酸酯组分的光刻胶
US9256125B2 (en) Acid generators and photoresists comprising same
JP6965232B2 (ja) 塩およびそれを含むフォトレジスト
JP6716643B2 (ja) 酸発生剤化合物及びそれを含むフォトレジスト
KR20160032074A (ko) 오늄 화합물 및 그의 합성방법
JP7357034B2 (ja) 塩およびこれを含むフォトレジスト
KR102163904B1 (ko) 쯔비터이온 화합물 및 이를 포함하는 포토레지스트

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination