CN121127012A - 具有反射元件的发光二极管芯片结构 - Google Patents

具有反射元件的发光二极管芯片结构

Info

Publication number
CN121127012A
CN121127012A CN202511076135.0A CN202511076135A CN121127012A CN 121127012 A CN121127012 A CN 121127012A CN 202511076135 A CN202511076135 A CN 202511076135A CN 121127012 A CN121127012 A CN 121127012A
Authority
CN
China
Prior art keywords
led chip
mesa
chip structure
layer
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202511076135.0A
Other languages
English (en)
Chinese (zh)
Inventor
李起鸣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Xianyao Display Technology Co ltd
Original Assignee
Shanghai Xianyao Display Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Xianyao Display Technology Co ltd filed Critical Shanghai Xianyao Display Technology Co ltd
Publication of CN121127012A publication Critical patent/CN121127012A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
CN202511076135.0A 2020-04-21 2021-04-21 具有反射元件的发光二极管芯片结构 Pending CN121127012A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202063013358P 2020-04-21 2020-04-21
US63/013,358 2020-04-21
CN202180029006.XA CN115413372A (zh) 2020-04-21 2021-04-21 具有反射元件的发光二极管芯片结构
PCT/US2021/028364 WO2021216684A1 (en) 2020-04-21 2021-04-21 Light-emitting diode chip structures with reflective elements

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202180029006.XA Division CN115413372A (zh) 2020-04-21 2021-04-21 具有反射元件的发光二极管芯片结构

Publications (1)

Publication Number Publication Date
CN121127012A true CN121127012A (zh) 2025-12-12

Family

ID=78082779

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202511076135.0A Pending CN121127012A (zh) 2020-04-21 2021-04-21 具有反射元件的发光二极管芯片结构
CN202180029006.XA Pending CN115413372A (zh) 2020-04-21 2021-04-21 具有反射元件的发光二极管芯片结构

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202180029006.XA Pending CN115413372A (zh) 2020-04-21 2021-04-21 具有反射元件的发光二极管芯片结构

Country Status (9)

Country Link
US (1) US11804582B2 (https=)
EP (1) EP4139956A4 (https=)
JP (1) JP2023525648A (https=)
KR (1) KR20230003506A (https=)
CN (2) CN121127012A (https=)
AU (1) AU2021261321A1 (https=)
DE (1) DE21792139T1 (https=)
TW (2) TWI893104B (https=)
WO (1) WO2021216684A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240141202A (ko) * 2022-01-31 2024-09-25 제이드 버드 디스플레이(상하이) 리미티드 마이크로 led, 마이크로 led 어레이 패널 및 그의 제조 방법
US12300774B2 (en) * 2022-02-25 2025-05-13 Meta Platforms Technologies, Llc Microdisplay architecture with light extraction efficiency enhancement
CN115171530B (zh) * 2022-06-30 2024-07-05 上海天马微电子有限公司 一种显示装置
JP2025530533A (ja) 2023-01-10 2025-09-11 エルジー エナジー ソリューション リミテッド 電極乾燥設備およびそれを含む電極乾燥システム
FR3154230A1 (fr) 2023-10-11 2025-04-18 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoélectronique à extraction lumineuse améliorée
WO2025217788A1 (en) * 2024-04-16 2025-10-23 Jade Bird Display (shanghai) Limited Micro led array and micro led display panel
FR3164871A1 (fr) 2024-07-19 2026-01-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoélectronique à extraction lumineuse améliorée
WO2026038906A1 (ko) * 2024-08-16 2026-02-19 삼성전자 주식회사 접지를 포함하는 전자장치
TWI895124B (zh) * 2024-09-26 2025-08-21 友達光電股份有限公司 顯示裝置

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4837295B2 (ja) 2005-03-02 2011-12-14 株式会社沖データ 半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
US7928462B2 (en) * 2006-02-16 2011-04-19 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
EP1850378A3 (en) * 2006-04-28 2013-08-07 Semiconductor Energy Laboratory Co., Ltd. Memory device and semicondutor device
US7573074B2 (en) * 2006-05-19 2009-08-11 Bridgelux, Inc. LED electrode
TW200834962A (en) 2007-02-08 2008-08-16 Touch Micro System Tech LED array package structure having Si-substrate and method of making the same
JP4985067B2 (ja) * 2007-04-11 2012-07-25 日立電線株式会社 半導体発光素子
EP2375452A1 (en) * 2010-04-06 2011-10-12 FOM Institute for Atomic and Moleculair Physics Nanoparticle antireflection layer
US20110284887A1 (en) * 2010-05-21 2011-11-24 Shang-Yi Wu Light emitting chip package and method for forming the same
CN101872824A (zh) * 2010-06-07 2010-10-27 厦门市三安光电科技有限公司 侧面具有双反射层的氮化镓基倒装发光二极管及其制备方法
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
JP2012124248A (ja) * 2010-12-07 2012-06-28 Toppan Printing Co Ltd Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JP2012174810A (ja) * 2011-02-18 2012-09-10 Fuji Xerox Co Ltd 発光部品、プリントヘッドおよび画像形成装置
JP2013109907A (ja) * 2011-11-18 2013-06-06 Sharp Corp 蛍光体基板および表示装置
WO2013141032A1 (ja) * 2012-03-23 2013-09-26 シャープ株式会社 半導体発光素子、半導体発光素子の製造方法、半導体発光装置及び基板
WO2013161146A1 (ja) * 2012-04-26 2013-10-31 シャープ株式会社 半導体装置の製造方法
JP5971552B2 (ja) * 2012-05-01 2016-08-17 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、樹脂付リードフレーム、多面付ｌｅｄパッケージ、ｌｅｄパッケージの製造方法および半導体素子搭載用リードフレーム
KR20150103661A (ko) * 2012-10-26 2015-09-11 글로 에이비 나노와이어 led 구조 및 이를 제조하는 방법
US9178123B2 (en) * 2012-12-10 2015-11-03 LuxVue Technology Corporation Light emitting device reflective bank structure
JP2014216588A (ja) * 2013-04-30 2014-11-17 株式会社沖データ 発光装置、その製造方法、画像表示装置、及び画像形成装置
TWI467528B (zh) * 2013-10-30 2015-01-01 友達光電股份有限公司 發光二極體顯示面板及其製作方法
KR102285786B1 (ko) * 2014-01-20 2021-08-04 삼성전자 주식회사 반도체 발광 소자
US9318475B2 (en) * 2014-05-15 2016-04-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
WO2016043113A1 (ja) 2014-09-16 2016-03-24 シャープ株式会社 有機エレクトロルミネッセンス装置および有機エレクトロルミネッセンス装置の製造方法
JP6606517B2 (ja) * 2015-02-13 2019-11-13 シチズン電子株式会社 発光装置の製造方法
KR102465382B1 (ko) * 2015-08-31 2022-11-10 삼성디스플레이 주식회사 표시장치 및 표시장치의 제조방법
US10304813B2 (en) 2015-11-05 2019-05-28 Innolux Corporation Display device having a plurality of bank structures
US10079264B2 (en) 2015-12-21 2018-09-18 Hong Kong Beida Jade Bird Display Limited Semiconductor devices with integrated thin-film transistor circuitry
US10068888B2 (en) * 2015-12-21 2018-09-04 Hong Kong Beida Jade Bird Display Limited Making semiconductor devices with alignment bonding and substrate removal
KR20170108321A (ko) * 2016-03-17 2017-09-27 주식회사 루멘스 발광 다이오드
US10304375B2 (en) * 2016-09-23 2019-05-28 Hong Kong Beida Jade Bird Display Limited Micro display panels with integrated micro-reflectors
CN111052412B (zh) * 2017-08-25 2023-07-25 夏普株式会社 微型led元件、图像显示元件以及制造方法
KR102295780B1 (ko) * 2017-08-31 2021-09-01 도시바 마테리알 가부시키가이샤 반도체 발광 소자 및 그의 제조 방법
US10361349B2 (en) * 2017-09-01 2019-07-23 Cree, Inc. Light emitting diodes, components and related methods
EP3698415A1 (en) * 2017-10-19 2020-08-26 Lumileds LLC Light emitting device package
US10804429B2 (en) 2017-12-22 2020-10-13 Lumileds Llc III-nitride multi-wavelength LED for visible light communication
KR102652645B1 (ko) * 2018-09-03 2024-04-02 삼성디스플레이 주식회사 발광 장치 및 이를 구비하는 표시 장치
TWI851085B (zh) * 2018-09-27 2024-08-01 美商亮銳公司 於圖案化模板及基板上之微米級發光二極體顯示器
KR102852286B1 (ko) * 2019-09-24 2025-08-28 삼성전자주식회사 디스플레이 장치
US11817435B2 (en) 2019-10-28 2023-11-14 Seoul Viosys Co., Ltd. Light emitting device for display and LED display apparatus having the same

Also Published As

Publication number Publication date
WO2021216684A1 (en) 2021-10-28
CN115413372A (zh) 2022-11-29
EP4139956A4 (en) 2024-07-17
KR20230003506A (ko) 2023-01-06
JP2023525648A (ja) 2023-06-19
EP4139956A1 (en) 2023-03-01
TW202543464A (zh) 2025-11-01
TWI893104B (zh) 2025-08-11
US20210328116A1 (en) 2021-10-21
DE21792139T1 (de) 2023-06-22
TW202147645A (zh) 2021-12-16
AU2021261321A1 (en) 2022-12-08
US11804582B2 (en) 2023-10-31

Similar Documents

Publication Publication Date Title
CN121127012A (zh) 具有反射元件的发光二极管芯片结构
CN115413371B (zh) 具有反射元件的发光二极管芯片结构
KR20240149971A (ko) 동축 다색 led를 위한 시스템들 및 방법들
CN106067462B (zh) 使用半导体发光器件的显示装置及其制造方法
JP2023542832A (ja) 一体型オフアクシスマイクロレンズアレイを備えるディスプレイパネル
US12021172B2 (en) Light-emitting element and image displaying apparatus
WO2022014421A1 (ja) 発光装置および画像表示装置
JP2025527582A (ja) 発光効率を向上させる発光画素構造システム及びその製造方法
CN117199103A (zh) 发光基板、显示装置及发光基板制备方法
CN121286129A (zh) 多色微型led像素阵列
CN121336517A (zh) 具有非同轴堆叠led结构的多色微型led像素
CN121220207A (zh) 具有非同轴堆叠led结构的多色微型led像素
CN121220221A (zh) 具有非同轴堆叠led结构的多色微型led像素
CN121241693A (zh) 一种具有高反射率的单色微型led像素
CN121264193A (zh) 一种具有高反射率的单色微型led像素
CN121220205A (zh) 一种具有侧壁台阶的微型发光二极管结构
WO2017104547A1 (ja) 発光ユニットおよび表示装置
WO2023007823A1 (ja) 発光デバイスおよび画像表示装置
WO2023189384A1 (ja) 発光デバイスおよび画像表示装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Country or region after: China

Address after: 201306 Shanghai Pudong New Area China Free Trade Zone Lingang New Area Ocean Road 99, No. 11, 13 7th Floor

Applicant after: Shanghai Xianyao Display Technology Co., Ltd.

Address before: 201306, 7th Floor, No. 11 and 13, Lane 99, Haiyang Fourth Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai

Applicant before: SHANGHAI XIANYAO DISPLAY TECHNOLOGY Co.,Ltd.

Country or region before: China

CB02 Change of applicant information