JP2023525648A - 反射要素を有する発光ダイオードチップ構造 - Google Patents

反射要素を有する発光ダイオードチップ構造 Download PDF

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Publication number
JP2023525648A
JP2023525648A JP2022560437A JP2022560437A JP2023525648A JP 2023525648 A JP2023525648 A JP 2023525648A JP 2022560437 A JP2022560437 A JP 2022560437A JP 2022560437 A JP2022560437 A JP 2022560437A JP 2023525648 A JP2023525648 A JP 2023525648A
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led chip
chip structure
mesa
isolation portion
isolation
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Japanese (ja)
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JP2023525648A5 (https=
JPWO2021216684A5 (https=
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リ，キミン
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ジェイド バード ディスプレイ（シャンハイ） リミテッド
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Publication of JP2023525648A publication Critical patent/JP2023525648A/ja
Publication of JP2023525648A5 publication Critical patent/JP2023525648A5/ja
Publication of JPWO2021216684A5 publication Critical patent/JPWO2021216684A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2022560437A 2020-04-21 2021-04-21 反射要素を有する発光ダイオードチップ構造 Ceased JP2023525648A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063013358P 2020-04-21 2020-04-21
US63/013,358 2020-04-21
PCT/US2021/028364 WO2021216684A1 (en) 2020-04-21 2021-04-21 Light-emitting diode chip structures with reflective elements

Publications (3)

Publication Number Publication Date
JP2023525648A true JP2023525648A (ja) 2023-06-19
JP2023525648A5 JP2023525648A5 (https=) 2024-02-09
JPWO2021216684A5 JPWO2021216684A5 (https=) 2024-02-09

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JP2022560437A Ceased JP2023525648A (ja) 2020-04-21 2021-04-21 反射要素を有する発光ダイオードチップ構造

Country Status (9)

Country Link
US (1) US11804582B2 (https=)
EP (1) EP4139956A4 (https=)
JP (1) JP2023525648A (https=)
KR (1) KR20230003506A (https=)
CN (2) CN121127012A (https=)
AU (1) AU2021261321A1 (https=)
DE (1) DE21792139T1 (https=)
TW (2) TWI893104B (https=)
WO (1) WO2021216684A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240141202A (ko) * 2022-01-31 2024-09-25 제이드 버드 디스플레이(상하이) 리미티드 마이크로 led, 마이크로 led 어레이 패널 및 그의 제조 방법
US12300774B2 (en) * 2022-02-25 2025-05-13 Meta Platforms Technologies, Llc Microdisplay architecture with light extraction efficiency enhancement
CN115171530B (zh) * 2022-06-30 2024-07-05 上海天马微电子有限公司 一种显示装置
JP2025530533A (ja) 2023-01-10 2025-09-11 エルジー エナジー ソリューション リミテッド 電極乾燥設備およびそれを含む電極乾燥システム
FR3154230A1 (fr) 2023-10-11 2025-04-18 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoélectronique à extraction lumineuse améliorée
WO2025217788A1 (en) * 2024-04-16 2025-10-23 Jade Bird Display (shanghai) Limited Micro led array and micro led display panel
FR3164871A1 (fr) 2024-07-19 2026-01-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoélectronique à extraction lumineuse améliorée
WO2026038906A1 (ko) * 2024-08-16 2026-02-19 삼성전자 주식회사 접지를 포함하는 전자장치
TWI895124B (zh) * 2024-09-26 2025-08-21 友達光電股份有限公司 顯示裝置

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070194343A1 (en) * 2006-02-16 2007-08-23 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
JP2008263015A (ja) * 2007-04-11 2008-10-30 Hitachi Cable Ltd 半導体発光素子
JP2009537982A (ja) * 2006-05-19 2009-10-29 ブリッジラックス インコーポレイテッド Ｌｅｄ用低光学損失電極構造体
US20110297914A1 (en) * 2010-06-07 2011-12-08 Xiamen Sanan Optoelectronics Technology Co., Ltd. Gallium nitride-based flip-chip light-emitting diode with double reflective layers on its side and fabrication method thereof
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
JP2012124248A (ja) * 2010-12-07 2012-06-28 Toppan Printing Co Ltd Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JP2012174810A (ja) * 2011-02-18 2012-09-10 Fuji Xerox Co Ltd 発光部品、プリントヘッドおよび画像形成装置
JP2013109907A (ja) * 2011-11-18 2013-06-06 Sharp Corp 蛍光体基板および表示装置
WO2013141032A1 (ja) * 2012-03-23 2013-09-26 シャープ株式会社 半導体発光素子、半導体発光素子の製造方法、半導体発光装置及び基板
WO2013161146A1 (ja) * 2012-04-26 2013-10-31 シャープ株式会社 半導体装置の製造方法
JP2013232590A (ja) * 2012-05-01 2013-11-14 Dainippon Printing Co Ltd Ｌｅｄ素子搭載用リードフレーム、樹脂付リードフレーム、多面付ｌｅｄパッケージ、ｌｅｄパッケージの製造方法および半導体素子搭載用リードフレーム
JP2014216588A (ja) * 2013-04-30 2014-11-17 株式会社沖データ 発光装置、その製造方法、画像表示装置、及び画像形成装置
US20150115293A1 (en) * 2013-10-30 2015-04-30 Au Optronics Corp. Light emitting diode display panel
US20150207038A1 (en) * 2014-01-20 2015-07-23 Samsung Electronics Co., Ltd. Semiconductor light-emitting device
US20150333221A1 (en) * 2014-05-15 2015-11-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
JP2016500925A (ja) * 2012-10-26 2016-01-14 グロ アーベーＧｌｏ Ａｂ ナノワイヤｌｅｄ構造及びその製造方法
JP2016503958A (ja) * 2012-12-10 2016-02-08 ルクスビュー テクノロジー コーポレイション 発光素子反射バンク構造
WO2016129658A1 (ja) * 2015-02-13 2016-08-18 シチズン電子株式会社 発光装置及びその製造方法
US20170062674A1 (en) * 2015-08-31 2017-03-02 Samsung Display Co., Ltd. Display apparatus and manufacturing method thereof
US20170133357A1 (en) * 2015-11-05 2017-05-11 Innolux Corporation Display device
US20170179097A1 (en) * 2015-12-21 2017-06-22 Hong Kong Beida Jade Bird Display Limited Making Semiconductor Devices with Alignment Bonding and Substrate Removal
JP2017168797A (ja) * 2016-03-17 2017-09-21 ルーメンス カンパニー リミテッド 発光ダイオード
US20180090058A1 (en) * 2016-09-23 2018-03-29 Hong Kong Beida Jade Bird Display Limited Micro Display Panels With Integrated Micro-Reflectors
WO2019038961A1 (ja) * 2017-08-25 2019-02-28 シャープ株式会社 マイクロｌｅｄ素子、画像表示素子、及び製造方法
US20190074417A1 (en) * 2017-09-01 2019-03-07 Cree, Inc. Light emitting diodes, components and related methods
WO2019044173A1 (ja) * 2017-08-31 2019-03-07 東芝マテリアル株式会社 半導体発光素子およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4837295B2 (ja) 2005-03-02 2011-12-14 株式会社沖データ 半導体装置、ｌｅｄ装置、ｌｅｄヘッド、及び画像形成装置
EP1850378A3 (en) * 2006-04-28 2013-08-07 Semiconductor Energy Laboratory Co., Ltd. Memory device and semicondutor device
TW200834962A (en) 2007-02-08 2008-08-16 Touch Micro System Tech LED array package structure having Si-substrate and method of making the same
EP2375452A1 (en) * 2010-04-06 2011-10-12 FOM Institute for Atomic and Moleculair Physics Nanoparticle antireflection layer
US20110284887A1 (en) * 2010-05-21 2011-11-24 Shang-Yi Wu Light emitting chip package and method for forming the same
WO2016043113A1 (ja) 2014-09-16 2016-03-24 シャープ株式会社 有機エレクトロルミネッセンス装置および有機エレクトロルミネッセンス装置の製造方法
US10079264B2 (en) 2015-12-21 2018-09-18 Hong Kong Beida Jade Bird Display Limited Semiconductor devices with integrated thin-film transistor circuitry
EP3698415A1 (en) * 2017-10-19 2020-08-26 Lumileds LLC Light emitting device package
US10804429B2 (en) 2017-12-22 2020-10-13 Lumileds Llc III-nitride multi-wavelength LED for visible light communication
KR102652645B1 (ko) * 2018-09-03 2024-04-02 삼성디스플레이 주식회사 발광 장치 및 이를 구비하는 표시 장치
TWI851085B (zh) * 2018-09-27 2024-08-01 美商亮銳公司 於圖案化模板及基板上之微米級發光二極體顯示器
KR102852286B1 (ko) * 2019-09-24 2025-08-28 삼성전자주식회사 디스플레이 장치
US11817435B2 (en) 2019-10-28 2023-11-14 Seoul Viosys Co., Ltd. Light emitting device for display and LED display apparatus having the same

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070194343A1 (en) * 2006-02-16 2007-08-23 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
JP2009537982A (ja) * 2006-05-19 2009-10-29 ブリッジラックス インコーポレイテッド Ｌｅｄ用低光学損失電極構造体
JP2008263015A (ja) * 2007-04-11 2008-10-30 Hitachi Cable Ltd 半導体発光素子
US20110297914A1 (en) * 2010-06-07 2011-12-08 Xiamen Sanan Optoelectronics Technology Co., Ltd. Gallium nitride-based flip-chip light-emitting diode with double reflective layers on its side and fabrication method thereof
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
JP2012124248A (ja) * 2010-12-07 2012-06-28 Toppan Printing Co Ltd Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JP2012174810A (ja) * 2011-02-18 2012-09-10 Fuji Xerox Co Ltd 発光部品、プリントヘッドおよび画像形成装置
JP2013109907A (ja) * 2011-11-18 2013-06-06 Sharp Corp 蛍光体基板および表示装置
WO2013141032A1 (ja) * 2012-03-23 2013-09-26 シャープ株式会社 半導体発光素子、半導体発光素子の製造方法、半導体発光装置及び基板
WO2013161146A1 (ja) * 2012-04-26 2013-10-31 シャープ株式会社 半導体装置の製造方法
JP2013232590A (ja) * 2012-05-01 2013-11-14 Dainippon Printing Co Ltd Ｌｅｄ素子搭載用リードフレーム、樹脂付リードフレーム、多面付ｌｅｄパッケージ、ｌｅｄパッケージの製造方法および半導体素子搭載用リードフレーム
JP2016500925A (ja) * 2012-10-26 2016-01-14 グロ アーベーＧｌｏ Ａｂ ナノワイヤｌｅｄ構造及びその製造方法
JP2016503958A (ja) * 2012-12-10 2016-02-08 ルクスビュー テクノロジー コーポレイション 発光素子反射バンク構造
JP2014216588A (ja) * 2013-04-30 2014-11-17 株式会社沖データ 発光装置、その製造方法、画像表示装置、及び画像形成装置
US20150115293A1 (en) * 2013-10-30 2015-04-30 Au Optronics Corp. Light emitting diode display panel
US20150207038A1 (en) * 2014-01-20 2015-07-23 Samsung Electronics Co., Ltd. Semiconductor light-emitting device
US20150333221A1 (en) * 2014-05-15 2015-11-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
WO2016129658A1 (ja) * 2015-02-13 2016-08-18 シチズン電子株式会社 発光装置及びその製造方法
US20170062674A1 (en) * 2015-08-31 2017-03-02 Samsung Display Co., Ltd. Display apparatus and manufacturing method thereof
US20170133357A1 (en) * 2015-11-05 2017-05-11 Innolux Corporation Display device
US20170179097A1 (en) * 2015-12-21 2017-06-22 Hong Kong Beida Jade Bird Display Limited Making Semiconductor Devices with Alignment Bonding and Substrate Removal
JP2017168797A (ja) * 2016-03-17 2017-09-21 ルーメンス カンパニー リミテッド 発光ダイオード
US20180090058A1 (en) * 2016-09-23 2018-03-29 Hong Kong Beida Jade Bird Display Limited Micro Display Panels With Integrated Micro-Reflectors
WO2019038961A1 (ja) * 2017-08-25 2019-02-28 シャープ株式会社 マイクロｌｅｄ素子、画像表示素子、及び製造方法
WO2019044173A1 (ja) * 2017-08-31 2019-03-07 東芝マテリアル株式会社 半導体発光素子およびその製造方法
US20190074417A1 (en) * 2017-09-01 2019-03-07 Cree, Inc. Light emitting diodes, components and related methods

Also Published As

Publication number Publication date
WO2021216684A1 (en) 2021-10-28
CN115413372A (zh) 2022-11-29
EP4139956A4 (en) 2024-07-17
KR20230003506A (ko) 2023-01-06
CN121127012A (zh) 2025-12-12
EP4139956A1 (en) 2023-03-01
TW202543464A (zh) 2025-11-01
TWI893104B (zh) 2025-08-11
US20210328116A1 (en) 2021-10-21
DE21792139T1 (de) 2023-06-22
TW202147645A (zh) 2021-12-16
AU2021261321A1 (en) 2022-12-08
US11804582B2 (en) 2023-10-31

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