CN1203545A - 树脂封装电子制品的制造方法 - Google Patents

树脂封装电子制品的制造方法 Download PDF

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CN1203545A
CN1203545A CN96198754.5A CN96198754A CN1203545A CN 1203545 A CN1203545 A CN 1203545A CN 96198754 A CN96198754 A CN 96198754A CN 1203545 A CN1203545 A CN 1203545A
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coat
electronic product
encapsulated
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resin material
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吉田幸一
福岛哲夫
末次宪一郎
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Panasonic Holdings Corp
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/681—Component parts, details or accessories; Auxiliary operations
    • B29C70/683—Pretreatment of the preformed part, e.g. insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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Abstract

本发明提供了一种可提高合格率的小型电子部件的制造方法。该方法包括:将所需的电子部件2～4利用焊接安装于印刷线路板1上的安装工序;将整个包含电子部件2～4的印刷线路板用具有优异耐热性的涂覆材料包覆,密封,形成涂覆层14的涂覆层形成工序;用热塑性树脂材料12包覆、密封涂覆层14的周围,形成封装层17的封装层形成工序。在封装层形成工序中,涂覆层14抑止了由热塑性树脂材料12发热对电子部件2～4及基板1等的影响。

Description

树脂封装电子制品的制造方法
技术领域
本发明涉及一种树脂封装电子制品的制造方法，所述树脂封装电子制品系将安装了所需要的电子元器件的基板及全部电子部件密封于封装用的树脂内而形成。
背景技术
上述这种树脂封装电子制品通常经过如下所述的工序制造。即，如图2(a)所示，在其二面形成所需的布线图案的双面印刷线路板1上，利用焊接安装必要的电子部件2～4，同时在印刷线路板1的二侧装上引线接头7，组装成具有装置所必须的功能、例如，具有作为煤气表功能的状态。其次，如同该图(b)所示，将包含各个电子部件2～4的整个印刷线路板1插入由组合下模8和上模9而形成的型腔10内之后，锁紧模具8、9。接着，将在高温下加热熔融的热塑性树脂材料12从浇注口11注入型腔10内。在热塑性树脂材料12冷却、固化之后，松开模具8和9，得到如同该图(c)所示的、由热塑性树脂材料12形成的封装层17所覆盖的、不受外界气体侵蚀的树脂封装电子制品13。
然而，在如上所述的以往的制造方法中，从浇模口11将热塑性树脂材料12注入型腔10内时，由于该热塑性树脂材料12是在高温加热、熔融的状态下注入的原因，容易发生一些问题，例如电子部件2～4受热损坏；或者是，将电子部件2～4安装于基板1上的一部分焊锡熔融流失；或者是，电子部件受到挤压，从原安装位置偏移等等。由此产生的问题是，这种树脂封装电子制品13的合格率降低。
发明揭示
本发明的目的在于，提供一种不会降低其合格率的小型电子部件的制造方法。
为达成上述目的，本发明提供了一种树脂封装电子制品的制造方法，其特征在于，所述树脂封装电子制品的制造方法包括：将所需的电子部件安装于基板上的安装工序，将整个包含上述电子部件的上述基板用具有优异耐热性的涂覆材料包覆的涂覆层形成工序；用热塑性树脂材料包覆上述涂覆层的周围，进行密封的封装层形成工序。
根据本发明的制造方法，在封装层的形成工序中，电子部件、基板、及焊锡由具有优异耐热性的涂覆层所保护，并不直接接触热塑性树脂材料。为此，由于涂覆层的存在，阻止了来自热塑性树脂材料的热传导所产生的影响，降低了电子部件上的热应力，所以，不会受到热破坏。又，电子部件及焊锡受到的来自流入的热塑性树脂材料的剪切应力，由于其被涂覆层所固定，所以，与没有涂覆层包覆的场合比较起来，该应力特别地小，从而，不会发生电子部件位移、或一部分焊锡熔融流失的不良现象。为此，可以藉由所述的封装层，在功能方面及可靠性方面进行极为良好的密封，制造的树脂封装电子制品的合格率将明显提高。
另外，在上述本发明中，较好的是，分别使用聚硅氧烷作为涂覆材料，使用液晶聚合物作为热塑性树脂材料。
聚硅氧烷的耐热性高，可确实地保护电子部件及基板等不受封装层形成工序中因高温下的加热而熔融的热塑性树脂材料产生的热破坏。而且，由于聚硅氧烷具有优异的介电特性及耐部分放电特性或耐电弧性能等的电气特性，所以，也具有适当的电绝缘的功能。另一方面，由于液晶聚合物具有优异的成形性能，所以，可以形成良好的封装层。
附图的简单说明
图1为本发明的一个实施方式有关的制造方法按工序顺序的剖视示意图。图中，(a)表示安装工序，(b)表示涂覆层形成工序，(c)表示封装层形成工序，(d)表示完成的树脂封装电子制品。
图2为以往的树脂封装电子制品的制造方法按工序顺序的剖视示意图。图中，(a)表示安装工序，(b)表示封装层形成工序，(c)表示完成的树脂封装电子制品。
实施发明的最佳方式
以下，参照附图，就本发明的理想实施方式作一详细说明。图1为本发明的一个实施方式有关的树脂封装电子制品制造方法按工序顺序的剖视示意图。
首先，如该图(a)所示，在其二面形成所需的布线图案的双面印刷线路板1上，用焊接安装必要的电子部件2～4。同时，在印刷线路板1的二侧装上引线接头7，组装成具有所必须的功能、例如具有作为煤气表功能的状态。
其次，如同该图(b)所示，将包含各个电子部件2～4的整个印刷线路板1用涂覆层14包覆，封装成气密状态。在形成该涂覆层14时，作为涂覆材料使用具有优异耐热性能的聚硅氧烷(例如，东来达康宁硅株式会社制的商品号为AX42-360等的聚硅氧烷)。藉由浸渍方式，在包含电子部件2～4的印刷线路板1的整个线路板上涂覆以该聚硅氧烷。然后，藉由150℃×30分速度的热固化，形成涂覆层14。
其次，如同该图(c)所示，将由涂覆层14包覆的整个部分插入由组合下模8和上模9而形成的型腔10内之后，锁模模具8、9。接着，将在高温下加热熔融的热塑性树脂材料12从浇模口11注入型腔10内。此处，作为热塑性树脂材料12较好的是使用如日本石油化学株式会社制的商品号CX-966的液晶聚合物。在使用所述热塑性树脂材料12作浇铸成形时，以设定注入速度为120～150mm/秒、树脂温度为320～330℃、模具温度为50℃左右的条件为宜。
在将上述熔融的热塑性树脂材料12注入型腔10内时，电子部件2～4，印刷线路板1及焊锡受到藉由优异耐热性的涂覆层14的保护，并不直接接触热塑性树脂材料12。因此，电子部件2～4因涂覆层14的存在，阻止了来自热塑性树脂材料12的热传导，由此缓和了其上所受到的热应力，不会发生热破坏。又，电子部件及焊锡所受到的来自流入的热塑性树脂材料的剪切应力也因其被涂覆层14而固定，所以，与没有涂覆层包覆的场合比较起来，电子部件上的该应力特别地小，从而，不会发生电子部件2～4发生位移、或一部分焊锡熔融流失的不良现象。由此，藉由由上述热塑性树脂材料12所组成的所述封装层17，在功能方面及可靠性方面进行极为良好的密封封装，制造的树脂封装电子制品18的合格率明显提高。在所述的热塑性树脂材料12冷却、固化之后，松开模具8和9，则得到如同该图(d)所示的、由封装层17所包覆的、具有所需功能的树脂封装电子制品18。
产业上的可利用性
如上所述，根据本发明，是将整个包含电子部件的基板用具有优异耐热性的涂覆材料包覆，密封，预先形成涂覆层之后，再用热塑性树脂材料形成封装层。所以，此时印刷线路板及焊锡由于具有优异耐热性的涂覆层而不直接接触热塑性树脂材料。为此，电子部件上所受到的热应力因涂覆层的存在而降低，所以，不会受到热破坏。又，电子部件及焊锡受到的来自流入的热塑性树脂材料的剪切应力与没有涂覆层包覆的场合比较起来，该应力特别地小，从而，不会发生电子部件位移、或一部分焊锡熔融流失的不良现象。其结果，藉由所述封装层，可以在功能方面及可靠性方面进行极为良好的密封，特别提高制造的树脂封装电子制品的合格率明显提高。

Claims (2)

1.一种树脂封装电子制品的制造方法，其特征在于，所述树脂封装电子制品的制造方法包括：将所需的电子部件安装于基板上的元器件安装工序；将整个包含上述电子部件的所述基板用具有优异耐热性的涂覆材料包覆的涂覆层形成工序；用热塑性树脂材料包覆上述涂覆层的周围进行密封形成封闭层的封装层形成工序。
2.如权利要求1所述的树脂封装电子制品的制造方法，其特征在于，分别使用聚硅氧烷作为涂覆层材料，和使用液晶聚合物作为热塑性树脂材料。
CN96198754A 1995-12-07 1996-12-06 树脂封装电子制品的制造方法 Expired - Fee Related CN1082422C (zh)

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JP7318963A JPH09155918A (ja) 1995-12-07 1995-12-07 樹脂封止電子製品の製造方法

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CN102539209A (zh) * 2012-01-04 2012-07-04 肇庆理士电源技术有限公司 一种用于浇铸金相观察样品的装置及其使用方法
CN106910519A (zh) * 2015-12-31 2017-06-30 中山市江波龙电子有限公司 一种固态硬盘存储模块及固态硬盘
CN111109772A (zh) * 2018-10-30 2020-05-08 Ykk株式会社 拉片与拉片的制造方法

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CN100388485C (zh) * 2003-03-05 2008-05-14 三洋电机株式会社 树脂密封型半导体装置及其制造方法
CN102539209A (zh) * 2012-01-04 2012-07-04 肇庆理士电源技术有限公司 一种用于浇铸金相观察样品的装置及其使用方法
CN106910519A (zh) * 2015-12-31 2017-06-30 中山市江波龙电子有限公司 一种固态硬盘存储模块及固态硬盘
CN106910519B (zh) * 2015-12-31 2022-12-16 中山市江波龙电子有限公司 一种固态硬盘存储模块及固态硬盘
CN111109772A (zh) * 2018-10-30 2020-05-08 Ykk株式会社 拉片与拉片的制造方法
CN111109772B (zh) * 2018-10-30 2023-05-23 Ykk株式会社 拉片与拉片的制造方法

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WO1997020673A1 (fr) 1997-06-12
US6052893A (en) 2000-04-25
JPH09155918A (ja) 1997-06-17
CN1082422C (zh) 2002-04-10

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