CN120153477A - 半导体装置的冷却结构体 - Google Patents

半导体装置的冷却结构体 Download PDF

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Publication number
CN120153477A
CN120153477A CN202380073010.5A CN202380073010A CN120153477A CN 120153477 A CN120153477 A CN 120153477A CN 202380073010 A CN202380073010 A CN 202380073010A CN 120153477 A CN120153477 A CN 120153477A
Authority
CN
China
Prior art keywords
semiconductor device
conductive layer
cooling structure
layer
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380073010.5A
Other languages
English (en)
Chinese (zh)
Inventor
望月阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN120153477A publication Critical patent/CN120153477A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN202380073010.5A 2022-10-21 2023-10-06 半导体装置的冷却结构体 Pending CN120153477A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022168826 2022-10-21
JP2022-168826 2022-10-21
PCT/JP2023/036569 WO2024085003A1 (ja) 2022-10-21 2023-10-06 半導体装置の冷却構造体

Publications (1)

Publication Number Publication Date
CN120153477A true CN120153477A (zh) 2025-06-13

Family

ID=90737517

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380073010.5A Pending CN120153477A (zh) 2022-10-21 2023-10-06 半导体装置的冷却结构体

Country Status (5)

Country Link
US (1) US20250246510A1 (https=)
JP (1) JPWO2024085003A1 (https=)
CN (1) CN120153477A (https=)
DE (1) DE112023003909T5 (https=)
WO (1) WO2024085003A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
JP5120032B2 (ja) * 2008-04-03 2013-01-16 株式会社デンソー 電子装置
JP5383717B2 (ja) * 2011-01-04 2014-01-08 三菱電機株式会社 半導体装置
EP3358614B1 (en) * 2015-09-28 2022-12-14 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device
JP6929788B2 (ja) * 2015-12-04 2021-09-01 ローム株式会社 パワーモジュール装置、および電気自動車またはハイブリッドカー
JP6669586B2 (ja) * 2016-05-26 2020-03-18 新光電気工業株式会社 半導体装置、半導体装置の製造方法
WO2022080055A1 (ja) * 2020-10-14 2022-04-21 ローム株式会社 半導体モジュール

Also Published As

Publication number Publication date
DE112023003909T5 (de) 2025-07-03
WO2024085003A1 (ja) 2024-04-25
US20250246510A1 (en) 2025-07-31
JPWO2024085003A1 (https=) 2024-04-25

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