DE112023003909T5 - Kühlstruktur für halbleitervorrichtung - Google Patents

Kühlstruktur für halbleitervorrichtung Download PDF

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Publication number
DE112023003909T5
DE112023003909T5 DE112023003909.7T DE112023003909T DE112023003909T5 DE 112023003909 T5 DE112023003909 T5 DE 112023003909T5 DE 112023003909 T DE112023003909 T DE 112023003909T DE 112023003909 T5 DE112023003909 T5 DE 112023003909T5
Authority
DE
Germany
Prior art keywords
semiconductor device
conductive layer
cooling structure
layer
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023003909.7T
Other languages
German (de)
English (en)
Inventor
Yo Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112023003909T5 publication Critical patent/DE112023003909T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
DE112023003909.7T 2022-10-21 2023-10-06 Kühlstruktur für halbleitervorrichtung Pending DE112023003909T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022168826 2022-10-21
JP2022-168826 2022-10-21
PCT/JP2023/036569 WO2024085003A1 (ja) 2022-10-21 2023-10-06 半導体装置の冷却構造体

Publications (1)

Publication Number Publication Date
DE112023003909T5 true DE112023003909T5 (de) 2025-07-03

Family

ID=90737517

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023003909.7T Pending DE112023003909T5 (de) 2022-10-21 2023-10-06 Kühlstruktur für halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20250246510A1 (https=)
JP (1) JPWO2024085003A1 (https=)
CN (1) CN120153477A (https=)
DE (1) DE112023003909T5 (https=)
WO (1) WO2024085003A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
JP5120032B2 (ja) * 2008-04-03 2013-01-16 株式会社デンソー 電子装置
JP5383717B2 (ja) * 2011-01-04 2014-01-08 三菱電機株式会社 半導体装置
EP3358614B1 (en) * 2015-09-28 2022-12-14 Kabushiki Kaisha Toshiba Circuit substrate and semiconductor device
JP6929788B2 (ja) * 2015-12-04 2021-09-01 ローム株式会社 パワーモジュール装置、および電気自動車またはハイブリッドカー
JP6669586B2 (ja) * 2016-05-26 2020-03-18 新光電気工業株式会社 半導体装置、半導体装置の製造方法
WO2022080055A1 (ja) * 2020-10-14 2022-04-21 ローム株式会社 半導体モジュール

Also Published As

Publication number Publication date
CN120153477A (zh) 2025-06-13
WO2024085003A1 (ja) 2024-04-25
US20250246510A1 (en) 2025-07-31
JPWO2024085003A1 (https=) 2024-04-25

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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023373000

Ipc: H10W0040250000