JPWO2024085003A1 - - Google Patents
Info
- Publication number
- JPWO2024085003A1 JPWO2024085003A1 JP2024551499A JP2024551499A JPWO2024085003A1 JP WO2024085003 A1 JPWO2024085003 A1 JP WO2024085003A1 JP 2024551499 A JP2024551499 A JP 2024551499A JP 2024551499 A JP2024551499 A JP 2024551499A JP WO2024085003 A1 JPWO2024085003 A1 JP WO2024085003A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022168826 | 2022-10-21 | ||
| PCT/JP2023/036569 WO2024085003A1 (ja) | 2022-10-21 | 2023-10-06 | 半導体装置の冷却構造体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024085003A1 true JPWO2024085003A1 (https=) | 2024-04-25 |
Family
ID=90737517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024551499A Pending JPWO2024085003A1 (https=) | 2022-10-21 | 2023-10-06 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250246510A1 (https=) |
| JP (1) | JPWO2024085003A1 (https=) |
| CN (1) | CN120153477A (https=) |
| DE (1) | DE112023003909T5 (https=) |
| WO (1) | WO2024085003A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6400012B1 (en) * | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
| JP5120032B2 (ja) * | 2008-04-03 | 2013-01-16 | 株式会社デンソー | 電子装置 |
| JP5383717B2 (ja) * | 2011-01-04 | 2014-01-08 | 三菱電機株式会社 | 半導体装置 |
| EP3358614B1 (en) * | 2015-09-28 | 2022-12-14 | Kabushiki Kaisha Toshiba | Circuit substrate and semiconductor device |
| JP6929788B2 (ja) * | 2015-12-04 | 2021-09-01 | ローム株式会社 | パワーモジュール装置、および電気自動車またはハイブリッドカー |
| JP6669586B2 (ja) * | 2016-05-26 | 2020-03-18 | 新光電気工業株式会社 | 半導体装置、半導体装置の製造方法 |
| WO2022080055A1 (ja) * | 2020-10-14 | 2022-04-21 | ローム株式会社 | 半導体モジュール |
-
2023
- 2023-10-06 DE DE112023003909.7T patent/DE112023003909T5/de active Pending
- 2023-10-06 JP JP2024551499A patent/JPWO2024085003A1/ja active Pending
- 2023-10-06 WO PCT/JP2023/036569 patent/WO2024085003A1/ja not_active Ceased
- 2023-10-06 CN CN202380073010.5A patent/CN120153477A/zh active Pending
-
2025
- 2025-04-18 US US19/183,532 patent/US20250246510A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN120153477A (zh) | 2025-06-13 |
| DE112023003909T5 (de) | 2025-07-03 |
| WO2024085003A1 (ja) | 2024-04-25 |
| US20250246510A1 (en) | 2025-07-31 |