CN1200600C - 电子机器的冷却装置 - Google Patents

电子机器的冷却装置 Download PDF

Info

Publication number
CN1200600C
CN1200600C CNB031243029A CN03124302A CN1200600C CN 1200600 C CN1200600 C CN 1200600C CN B031243029 A CNB031243029 A CN B031243029A CN 03124302 A CN03124302 A CN 03124302A CN 1200600 C CN1200600 C CN 1200600C
Authority
CN
China
Prior art keywords
liquid
heat
copper
cooling
corrosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031243029A
Other languages
English (en)
Chinese (zh)
Other versions
CN1469701A (zh
Inventor
南谷林太郎
大桥繁男
近藤义广
吉冨雄二
长绳尚
中西正人
中川毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1469701A publication Critical patent/CN1469701A/zh
Application granted granted Critical
Publication of CN1200600C publication Critical patent/CN1200600C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB031243029A 2002-07-15 2003-04-30 电子机器的冷却装置 Expired - Fee Related CN1200600C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP204977/2002 2002-07-15
JP2002204977A JP4151328B2 (ja) 2002-07-15 2002-07-15 電子機器の冷却装置

Publications (2)

Publication Number Publication Date
CN1469701A CN1469701A (zh) 2004-01-21
CN1200600C true CN1200600C (zh) 2005-05-04

Family

ID=29774579

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031243029A Expired - Fee Related CN1200600C (zh) 2002-07-15 2003-04-30 电子机器的冷却装置

Country Status (5)

Country Link
US (2) US6808014B2 (enExample)
EP (1) EP1383030A3 (enExample)
JP (1) JP4151328B2 (enExample)
CN (1) CN1200600C (enExample)
TW (1) TW556470B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4151328B2 (ja) * 2002-07-15 2008-09-17 株式会社日立製作所 電子機器の冷却装置
KR100468783B1 (ko) * 2003-02-11 2005-01-29 삼성전자주식회사 반도체 모듈로부터 발생되는 열을 소산시키는 집게형 장치
JP2005190091A (ja) * 2003-12-25 2005-07-14 Matsushita Electric Ind Co Ltd 冷却装置およびこれを備えた電子機器
RU2263865C1 (ru) * 2004-03-18 2005-11-10 Шмунк Дмитрий Валерьевич Теплообменник
US7239804B2 (en) * 2004-03-23 2007-07-03 Canon Kabushiki Kaisha Cooling device, and apparatus and method for manufacturing image display panel using cooling device
JP4056504B2 (ja) 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 冷却装置及びこれを備えた電子機器
JP2006057920A (ja) * 2004-08-20 2006-03-02 Hitachi Ltd 電子機器の液冷システム、及び、これを用いた電子機器
WO2006047910A1 (fr) * 2004-11-08 2006-05-11 Chunfu Liu Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible
CN100468709C (zh) * 2005-03-18 2009-03-11 鸿富锦精密工业（深圳）有限公司 发光模组及其光源装置
JP4015164B2 (ja) * 2005-08-10 2007-11-28 ファナック株式会社 電子機器の筐体構造
US20070227710A1 (en) * 2006-04-03 2007-10-04 Belady Christian L Cooling system for electrical devices
JP4809377B2 (ja) * 2008-01-10 2011-11-09 富士通株式会社 電子装置用冷却システム
JP5169675B2 (ja) * 2008-09-22 2013-03-27 富士通株式会社 冷却ユニットおよび電子機器
JP5966731B2 (ja) * 2012-07-30 2016-08-10 富士通株式会社 電子機器
US8919388B2 (en) 2013-01-18 2014-12-30 International Business Machines Corporation Implementing pre-treatment of water cooling hoses to increase reliability
EP3171465B1 (en) * 2014-07-14 2019-09-25 Panasonic Intellectual Property Management Co., Ltd. Cooled semiconductor laser device
US20160377356A1 (en) * 2015-06-25 2016-12-29 Asia Vital Components Co., Ltd. Flexible and transformable water-cooling device
CN106774735A (zh) * 2016-12-05 2017-05-31 王建 一种便携式电脑液冷散热系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965000A (en) * 1972-11-16 1976-06-22 Industrial Filter & Pump Mfg. Co. Method for operating ion exchange columns
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
JPS55147946A (en) * 1979-05-09 1980-11-18 Hitachi Ltd Preventive method for corrosion of winding
JPS6484699A (en) 1987-09-26 1989-03-29 Actronics Kk Structure of electromagnetic equipment
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
JPH02244748A (ja) 1989-03-17 1990-09-28 Furukawa Electric Co Ltd:The ヒートパイプ式放熱器
JPH03192798A (ja) * 1989-12-22 1991-08-22 Fujitsu Ltd 水冷式冷却装置
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
CA2075444C (en) * 1991-08-28 2002-05-28 Richard F. Creeron Cooling system change-over apparatus and process
JP3070787B2 (ja) 1991-12-19 2000-07-31 株式会社日立製作所 電子装置
JPH05335454A (ja) 1992-04-03 1993-12-17 Fuji Electric Co Ltd 電子機器の冷却装置
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
JPH0678539A (ja) * 1992-08-26 1994-03-18 Toshiba Corp 電力変換機器の冷却システム
JP2801998B2 (ja) 1992-10-12 1998-09-21 富士通株式会社 電子機器の冷却装置
JPH06266474A (ja) 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
JP3385482B2 (ja) 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
JP2000353891A (ja) * 1999-06-10 2000-12-19 Pfu Ltd 薄型冷却装置
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
JP2002099356A (ja) * 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
JP2002189536A (ja) 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよび液冷システムを用いたパーソナルコンピュータ
JP2002232174A (ja) * 2001-02-06 2002-08-16 Hitachi Ltd 電子装置
JP4151328B2 (ja) * 2002-07-15 2008-09-17 株式会社日立製作所 電子機器の冷却装置

Also Published As

Publication number Publication date
EP1383030A2 (en) 2004-01-21
US6808014B2 (en) 2004-10-26
EP1383030A3 (en) 2008-12-10
JP4151328B2 (ja) 2008-09-17
JP2004047842A (ja) 2004-02-12
TW556470B (en) 2003-10-01
TW200401600A (en) 2004-01-16
CN1469701A (zh) 2004-01-21
US20040035557A1 (en) 2004-02-26
US20050082036A1 (en) 2005-04-21

Similar Documents

Publication Publication Date Title
CN1200600C (zh) 电子机器的冷却装置
CN1738521A (zh) 电子设备的液冷系统和使用它的电子设备
CN1455954A (zh) 电子装置
JP3757200B2 (ja) 冷却機構を備えた電子機器
CN1223920C (zh) 配备了冷却发热部件的液冷型冷却装置的电子仪器
JP2002189535A (ja) 液冷システムおよびこれを用いたパーソナルコンピュータ
CN1455953A (zh) 电子装置
CN1902754A (zh) 带有气泡泵的冷却系统
CN101902895A (zh) 散热系统
CN1601731A (zh) 冷却模块
CN104883857A (zh) 一种刀片服务器的散热方法及散热装置
CN1691880A (zh) 电子设备
CN1469220A (zh) 电子装置
CN1841265A (zh) 冷却套
CN1179188C (zh) 板式散热管和冷却装置
JP2006234255A (ja) ラジエータと、当該ラジエータを備えた液冷システム
CN1275502C (zh) 电子装置用水冷装置
JP4720688B2 (ja) 電子制御装置の冷却装置
CN1591851A (zh) 液冷系统和使用该液冷系统的电子设备
CN118131872A (zh) 服务器散热单元、服务器散热系统及车载服务器
JP4744280B2 (ja) 冷却機構を備えた電子機器
CN1741725A (zh) 电子设备
CN2580507Y (zh) 散热装置
JP3727647B2 (ja) 電子機器の冷却装置
CN2840615Y (zh) 用于电子元件的散热装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: HITACHI LTD.

Free format text: FORMER OWNER: HITACHI,LTD.

Effective date: 20130718

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20130718

Address after: Tokyo, Japan

Patentee after: HITACHI CONSUMER ELECTRONICS Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Hitachi, Ltd.

ASS Succession or assignment of patent right

Owner name: HITACHI MAXELL LTD.

Free format text: FORMER OWNER: HITACHI LTD.

Effective date: 20150326

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150326

Address after: Osaka, Japan

Patentee after: Hitachi Maxell, Ltd.

Address before: Tokyo, Japan

Patentee before: Hitachi Consumer Electronics Co.,Ltd.

TR01 Transfer of patent right

Effective date of registration: 20171213

Address after: Kyoto Japan

Patentee after: MAXELL, Ltd.

Address before: Osaka, Japan

Patentee before: Hitachi Maxell, Ltd.

TR01 Transfer of patent right
CP01 Change in the name or title of a patent holder

Address after: Kyoto Japan

Patentee after: MAXELL, Ltd.

Address before: Kyoto Japan

Patentee before: MAXELL HOLDINGS, Ltd.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20220608

Address after: Kyoto Japan

Patentee after: MAXELL HOLDINGS, Ltd.

Address before: Kyoto, Japan

Patentee before: MAXELL, Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050504