WO2006047910A1 - Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible - Google Patents

Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible Download PDF

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Publication number
WO2006047910A1
WO2006047910A1 PCT/CN2004/001269 CN2004001269W WO2006047910A1 WO 2006047910 A1 WO2006047910 A1 WO 2006047910A1 CN 2004001269 W CN2004001269 W CN 2004001269W WO 2006047910 A1 WO2006047910 A1 WO 2006047910A1
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WO
WIPO (PCT)
Prior art keywords
heat
base
conducting
dissipating module
flexible
Prior art date
Application number
PCT/CN2004/001269
Other languages
English (en)
Chinese (zh)
Inventor
Chunfu Liu
Original Assignee
Chunfu Liu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chunfu Liu filed Critical Chunfu Liu
Priority to PCT/CN2004/001269 priority Critical patent/WO2006047910A1/fr
Publication of WO2006047910A1 publication Critical patent/WO2006047910A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Definitions

  • the present invention relates to a heat dissipation module for use in information, communication or other products, and more particularly to a heat dissipation module that can transfer heat through a constantly changing path for heat dissipation.
  • the heat sinks used by the industry for computer central processing units (CPUs) or high heat source products mostly use a pedestal of a heat sink made of metal with high heat transfer efficiency to contact the heat source to absorb and transfer heat to On the fins of the heat sink, a fan is used to blow out cold air to dissipate heat from the heat sink.
  • This method has its effect on the small amount of heat generated by a small CPU.
  • the large amount of heat generated by a large CPU that is operating faster and faster cannot effectively and quickly achieve the heat dissipation effect.
  • the reason is that the heat sink is There is a distance between the metal base and the end of the heat sink fin. Since the heat sink and the heat source (ie CPU:) are in contact with only the base, the heat absorbed by the base cannot be quickly transferred to the end of the heat sink fin.
  • the heat absorbed by the root and the end of the heat sink fin is not the same; in other words, the more heat is absorbed from the root of the fin closer to the base, the less heat is absorbed from the end of the fin farther away from the base.
  • the heat-dissipating fins with limited area can only use the parts close to the metal base to dissipate heat. Therefore, the heat dissipation efficiency of the conventional heat-dissipating device cannot meet the demand of rapidly developing CPU operation efficiency or heat dissipation of high heat source products. Especially for small-sized electronic products such as notebook computers or folding mobile phones, the problem of heat dissipation is a topic that researchers are paying attention to.
  • US Pat. No. 6,519,148 provides a liquid cooling system applied to a notebook computer, which is provided with a heat absorbing component and a hydraulic pump on a host where the CPU is located, and a curved circulation line is disposed inside the casing of the display, and a circulation line is connected to the heat absorbing component, the circulation line is filled with a heat-conductive operating liquid; and the hydraulic pump continuously extracts the heat-conductive operating liquid in the pipeline
  • the ring flows to conduct heat absorbed by the heat absorbing component to various parts of the pipeline to increase the heat dissipation area.
  • the drawback of the U.S. patent is that it requires a pump to drive the flow of the thermally conductive liquid, so that the cost is high, and the power is consumed, and the circulation distance is long.
  • the notebook computer heat sink provided in Taiwan Patent No. 425501 is not effective because of its long heat conduction distance.
  • Taiwan's Announcement No. 446131 the contact between the heated end and the central processing unit is not good, and the operation is not easy, so that the heat dissipating end cannot effectively conduct heat to a large area, so the heat conduction effect is not good.
  • the invention mainly solves the defects of high cost, power consumption and poor heat conduction effect of the conventional heat sink device provided in the notebook computer or the palm type input device.
  • the technical feature of the present invention is to provide a heat receiving end device, a heat dissipating end device and a flexible heat conducting device;
  • the flexible heat conducting device is connected between the heating end device and the heat dissipating end device, and the heat receiving end device is connected to a heat source a heat pipe and a body are connected between the first base;
  • the heat radiating end device additionally connects the heat pipe and the body between the heat sink and the second base; and the first base and the second base are connected to each other a flexible conduit of a closed loop, the flexible conduit is filled with a heat-conductive operating liquid;
  • the heat-receiving liquid in the flexible conduit is automatically formed by the heat-receiving end to form heat convection to transfer heat to the heat-dissipating end device;
  • the end device can be installed inside a host of a notebook computer, a folding mobile phone or other folding function to contact the heat source, and the heat sink device can be installed in a notebook computer, a folding mobile phone or the like
  • the heat conduction channel and the tube (31) are disposed in the first base, and the two openings are exposed to the first base, and the heat conduction channel and the tube (32) are disposed in the second Inside the pedestal, And the two openings are exposed to the second base.
  • the thermally conductive operating liquid is a refrigerant.
  • the thermally conductive operating liquid is a condensing agent.
  • the thermally conductive operating liquid is liquid pure water.
  • the thermally conductive operating liquid is liquid nitrogen.
  • the heat pipe and the body disposed between the heat source and the first base are a branch, and the heat pipe, the body is embedded or fixed to the heat source and the first base.
  • the heat pipe and the body disposed between the heat source and the first base are two or more, and the heat pipe or body is embedded or fixed to the heat source and the first base.
  • the heat pipe and the body disposed between the heat sink and the second base are one, and the heat pipe, the body is embedded or fixed to the heat sink and the second base.
  • the heat transfer tube and the body disposed between the heat sink and the second base are two or more, and the heat transfer tube and the body are embedded or fixed to the heat sink and the second base.
  • the flexible conduit provided in the flexible heat transfer device is made of a metal material having reproducible flexural properties.
  • the flexible conduit provided in the flexible heat transfer device is made of a mixed material of a metal and a polymer material having reproducible flexural properties.
  • the present invention has the advantages of lower manufacturing cost and better heat conduction efficiency.
  • FIG. 1 is a schematic plan view showing a heat conduction and heat dissipation module of the present invention.
  • Fig. 2 is a perspective view showing the heat conduction and heat dissipation module of the present invention applied to a notebook computer.
  • the reference numerals are as follows: 1 _ heated end device; 11 a heat source; 12 - heat pipe, body; 13 - first pedestal;
  • 3 flexible heat conduction device
  • 31 heat conduction channel and tube
  • 32 heat conduction channel and tube
  • the heat conduction and heat dissipation module comprises a heat receiving end device 1 , a heat dissipating device 2 and a flexible heat conducting device 3 ;
  • the heating end device 1 further comprises a heat source 11 and a first base;
  • the base 13 and the heat source 11 are connected to the first base 13 and the heat source 11 with one or more heat pipes and a body 12, and a part of the heat pipe and the body 12 is embedded or fixed to the heat source 11 and the first
  • the susceptor 13 can be embedded or fixed by techniques such as die casting, casting, welding, locking, welding or pressing.
  • the heat source 11 and the first susceptor 13 are made of a material having good thermal conductivity.
  • the heat dissipation end device 2 further includes a second base 23 and a heat sink 21, and one or more heat pipes and bodies 22 are connected between the second base 23 and the heat sink 21; A portion of the body 22 is embedded or fixed to the second base 23 and the heat sink 21; the manner of embedding or fixing may be accomplished by techniques such as die casting, casting, welding, locking, welding or pressing.
  • the heat sink 21 may be a heat sink having a plurality of fins or a mechanical casing having a good heat conducting property.
  • the flexible heat conducting device 3 further includes a heat conducting channel and tubes 31 and 32 having openings at both ends and penetrating each other, and bonding the heat conducting channel and the tube 31 to the first base 13 while the heat conducting channel and the tube 32 are
  • the second base 23 is combined; preferably, the heat conducting channel and the tubes 31, 32 are respectively disposed in the first base 13 and the second base 23, and only the two openings are exposed outside the base;
  • the heat-conducting passages already provided in the first and second bases 13, 23 and the two openings of the tube 31 and the two openings of the heat-conducting passage and the tube 32 are connected by two flexible conduits 33 to form a closed a circuit; the heat conducting channel and the tubes 31, 32 and the flexible conduit 33 are filled with Thermally conductive liquid.
  • the heat-conductive operating liquid can be a refrigerant, a condensing agent, a liquid pure water, a liquid nitrogen or other liquid capable of conducting heat conduction.
  • the heat conducting tube and the body 12, 22 are a heat conducting superconductor and a body filled with a superconducting material in a metal tube having good thermal conductivity.
  • the superconducting material may be selected as follows: 1. Inorganic high temperature Superconducting compound materials, such as: yttrium copper oxy-compound (YBCO) superconducting material, strontium calcium copper oxide (TBCCO) superconducting material, mercury strontium calcium copper oxide (HBCCO) superconducting material, strontium calcium oxychloride Compound (BSCCO) superconducting material, or other inorganic superconducting material.
  • YBCO yttrium copper oxy-compound
  • TBCCO strontium calcium copper oxide
  • HBCCO mercury strontium calcium copper oxide
  • BSCCO strontium calcium oxychloride Compound
  • organic superconducting materials such as: pure water or other organic superconducting materials.
  • the inorganic high-superconducting material is applied by using high-speed vibration and friction generated when the molecules in the tube and the body are heated, so that the heat can be rapidly transferred in a fluctuating manner;
  • the organic high-temperature superconducting material the principle applied thereto, It is the use of metal tubes, liquid molecules in the body to change the phase of the heat generated by the rapid change of heat, because the transmission speed is very fast, it is called “heat conduction supercatheter, body", and due to the heat conduction supercatheter, the body is transferred from the hot end to the cold
  • the transmission time of the end is very short, so the temperature difference between the hot end and the cold end is small, and the best thermal conduction effect can be achieved. It has been experimentally confirmed that the heat transfer rate is about five times higher than that of copper, and is more than ten times faster than the heat transfer rate of general aluminum metal.
  • the heat source 11 absorbs heat
  • the heat is quickly transmitted from the heat pipe and the body 12 to the first pedestal 13, and heat is transferred from the susceptor 13 to the heat conduction channel and the tube 31, so that
  • the thermally conductive passages and the thermally conductive operating liquid in the tubes 31, 32 and the flexible conduit 33 are naturally convected by heat, causing heat to be conducted to the second susceptor 23 via the thermally conductive operating liquid, and the heat is transferred via the second pedestal 23 via the second susceptor 23
  • the heat pipe and body 22 are conducted to the radiator 21 for heat removal.
  • the heat transfer operation liquid conducts heat from the first base 13 to the second base 23, which lowers the temperature and thus flows back to the first base.
  • the seat 13 absorbs heat and conducts it to the second base 23, so that it circulates to achieve effective heat conduction and heat dissipation at a shorter distance.
  • Figure 2 shows an embodiment of the present invention actually applied to a notebook computer 4, which can be heated
  • the end device 1 is disposed inside the main body casing 41 of the notebook computer 4, the heat dissipating end device 2 is disposed inside the display casing 42, and the flexible heat conducting device 3 is disposed between the main body casing 41 and the display casing 42;
  • the housing 42 and the main housing 41 need to be rotated frequently. Therefore, the present invention can provide a proper flexing function through the flexible conduit 33 at the time of turning, without affecting the heat conduction and heat dissipation effects.
  • the structure of the present invention can also be applied to a folding mobile phone (not shown) or other implement having a folding function, which similarly places the heated end device 1 inside the main body casing of the action, the heat sink device It is placed inside the display case, and the flexible heat transfer device is placed between the main unit casing and the display case.

Abstract

L’invention concerne un module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible comprenant un dispositif récepteur de chaleur, un dispositif dissipateur de chaleur et un dispositif conducteur de chaleur flexible. Le dispositif récepteur de chaleur comprend une source thermique, une première base et un tuyau conducteur de chaleur entre la source thermique et la première base. Le dispositif dissipateur de chaleur comprend un dissipateur, une seconde base et un second tuyau conducteur de chaleur entre le dissipateur et la seconde base. Un tuyau flexible est formé entre le premier tuyau et le second tuyau, qui est en circuit fermé et rempli de liquide conducteur de chaleur. Lorsque le dispositif récepteur de chaleur reçoit la chaleur, le liquide conducteur de chaleur dans le tuyau flexible forme automatiquement une convexion thermique pour acheminer la chaleur au dispositif dissipateur de chaleur, permettant ainsi de conduire la chaleur à travers un circuit fréquemment mobile à des fins de dissipation.
PCT/CN2004/001269 2004-11-08 2004-11-08 Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible WO2006047910A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2004/001269 WO2006047910A1 (fr) 2004-11-08 2004-11-08 Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2004/001269 WO2006047910A1 (fr) 2004-11-08 2004-11-08 Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible

Publications (1)

Publication Number Publication Date
WO2006047910A1 true WO2006047910A1 (fr) 2006-05-11

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PCT/CN2004/001269 WO2006047910A1 (fr) 2004-11-08 2004-11-08 Module dissipateur de chaleur et conducteur de chaleur à plusieurs courbures avec charnière flexible

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0842983A (ja) * 1994-07-28 1996-02-16 Diamond Electric Mfg Co Ltd ヒートパイプ
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
TW425501B (en) * 1997-05-03 2001-03-11 Huang Bing Jiun A flexible loop heat pipe cooling device for notebook micro-computers
US6519148B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Liquid cooling system for notebook computer
JP2003060372A (ja) * 2002-07-08 2003-02-28 Hitachi Ltd 電子機器の冷却方法及び電子機器
CN1469701A (zh) * 2002-07-15 2004-01-21 株式会社日立制作所 电子机器的冷却装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0842983A (ja) * 1994-07-28 1996-02-16 Diamond Electric Mfg Co Ltd ヒートパイプ
TW425501B (en) * 1997-05-03 2001-03-11 Huang Bing Jiun A flexible loop heat pipe cooling device for notebook micro-computers
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
US6519148B2 (en) * 2000-12-19 2003-02-11 Hitachi, Ltd. Liquid cooling system for notebook computer
JP2003060372A (ja) * 2002-07-08 2003-02-28 Hitachi Ltd 電子機器の冷却方法及び電子機器
CN1469701A (zh) * 2002-07-15 2004-01-21 株式会社日立制作所 电子机器的冷却装置

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