CN119894987A - 膜、叠层体、等离子体处理装置及叠层体的制造方法 - Google Patents

膜、叠层体、等离子体处理装置及叠层体的制造方法 Download PDF

Info

Publication number
CN119894987A
CN119894987A CN202380066626.XA CN202380066626A CN119894987A CN 119894987 A CN119894987 A CN 119894987A CN 202380066626 A CN202380066626 A CN 202380066626A CN 119894987 A CN119894987 A CN 119894987A
Authority
CN
China
Prior art keywords
film
less
compound
group
mass ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380066626.XA
Other languages
English (en)
Chinese (zh)
Inventor
谷垣勇刚
岛田彰
田中大作
酒部庸平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of CN119894987A publication Critical patent/CN119894987A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380066626.XA 2022-09-21 2023-09-06 膜、叠层体、等离子体处理装置及叠层体的制造方法 Pending CN119894987A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022-149958 2022-09-21
JP2022149959 2022-09-21
JP2022149958 2022-09-21
JP2022-149959 2022-09-21
PCT/JP2023/032488 WO2024062923A1 (ja) 2022-09-21 2023-09-06 フィルム、積層体、プラズマ処理装置、及び積層体の製造方法

Publications (1)

Publication Number Publication Date
CN119894987A true CN119894987A (zh) 2025-04-25

Family

ID=90454230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380066626.XA Pending CN119894987A (zh) 2022-09-21 2023-09-06 膜、叠层体、等离子体处理装置及叠层体的制造方法

Country Status (5)

Country Link
JP (1) JPWO2024062923A1 (https=)
KR (1) KR20250069538A (https=)
CN (1) CN119894987A (https=)
TW (1) TW202419541A (https=)
WO (1) WO2024062923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026070861A1 (ja) * 2024-09-27 2026-04-02 リンテック株式会社 熱硬化性組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5422413B2 (ja) 2010-01-25 2014-02-19 電気化学工業株式会社 放熱部材及びその製造方法
WO2012046814A1 (ja) * 2010-10-06 2012-04-12 日立化成工業株式会社 多層樹脂シート及びその製造方法、樹脂シート積層体及びその製造方法、多層樹脂シート硬化物、金属箔付き多層樹脂シート、並びに半導体装置
KR101958506B1 (ko) * 2011-11-02 2019-03-14 히타치가세이가부시끼가이샤 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치
JP6250949B2 (ja) 2013-04-15 2017-12-20 日本特殊陶業株式会社 半導体製造装置用部品及びその製造方法
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP6621882B2 (ja) 2018-08-08 2019-12-18 東京エレクトロン株式会社 エッチング装置
WO2021079900A1 (ja) * 2019-10-25 2021-04-29 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板
JP7352173B2 (ja) * 2019-12-10 2023-09-28 東レ株式会社 組成物、硬化物、多層シート、放熱部品、並びに電子部品
JP2021091784A (ja) * 2019-12-10 2021-06-17 東レ株式会社 硬化物、多層シート、放熱部品、並びに電子部品
US20240400825A1 (en) * 2021-10-19 2024-12-05 Toray Industries, Inc. Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipment

Also Published As

Publication number Publication date
JPWO2024062923A1 (https=) 2024-03-28
WO2024062923A1 (ja) 2024-03-28
TW202419541A (zh) 2024-05-16
KR20250069538A (ko) 2025-05-19

Similar Documents

Publication Publication Date Title
KR101131369B1 (ko) 절연 시트 및 적층 구조체
JP6947032B2 (ja) 樹脂組成物、それを用いたシート、積層体、パワー半導体装置、プラズマ処理装置および半導体の製造方法
US20120244351A1 (en) Multilayer resin sheet and method for producing the same, method for producing cured multilayer resin sheet, and highly thermally conductive resin sheet laminate and method for producing the same
EP3121210A1 (en) Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing same, semiconductor device, and led device.
WO2018181606A1 (ja) 伝熱部材及びこれを含む放熱構造体
JP7395849B2 (ja) 熱硬化性樹脂組成物、その樹脂シート、及び金属ベース基板
JP6361566B2 (ja) 樹脂組成物、樹脂フィルム及び半導体装置とその製造方法
KR20140007894A (ko) 수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 적층체, 수지 시트 적층체 경화물 및 그 제조 방법, 반도체 장치, 그리고 ｌｅｄ 장치
JP5679237B2 (ja) アルコキシシリル基含有シラン変性ポリイミド樹脂、樹脂ワニス、ポリイミド系接着剤、硬化物、接着シート、積層体およびフレキシブルプリント基板
KR101612596B1 (ko) 적층체 및 파워 반도체 모듈용 부품의 제조 방법
KR20160024917A (ko) 수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 구조체, 수지 시트 구조체 경화물, 수지 시트 구조체 경화물의 제조 방법, 반도체 장치 및 led 장치
KR20120106993A (ko) 폴리이미드 수지 조성물, 그것을 포함하는 접착제, 적층체 및 디바이스
JP3979792B2 (ja) 静電チャック装置用接着シート及び静電チャック装置
JP2016155985A (ja) エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、及びそれらを用いた樹脂シート、プリプレグ、積層板、金属基板、配線板、パワー半導体装置
JP7517510B2 (ja) 樹脂組成物
TWI513810B (zh) 攝像零件
CN104412721A (zh) 电路基板用层叠板、金属基底电路基板及电源模块
CN108137793A (zh) 环氧树脂组合物、膜状环氧树脂组合物及电子装置
US6473288B2 (en) Adhesive sheet and electrostatic chucking device
CN119894987A (zh) 膜、叠层体、等离子体处理装置及叠层体的制造方法
CN107534026A (zh) 密封树脂片
JP6487829B2 (ja) 熱伝導性熱硬化型接着剤組成物及び熱伝導性熱硬化型接着シート
WO2022210686A1 (ja) 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス
KR20180027599A (ko) 적층체
JP7718393B2 (ja) 樹脂組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination