CN1198297C - 温度补偿用薄膜电容器 - Google Patents
温度补偿用薄膜电容器 Download PDFInfo
- Publication number
- CN1198297C CN1198297C CNB011449012A CN01144901A CN1198297C CN 1198297 C CN1198297 C CN 1198297C CN B011449012 A CNB011449012 A CN B011449012A CN 01144901 A CN01144901 A CN 01144901A CN 1198297 C CN1198297 C CN 1198297C
- Authority
- CN
- China
- Prior art keywords
- thin dielectric
- dielectric film
- temperature
- film
- film capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 149
- 239000000463 material Substances 0.000 claims description 159
- 229920002521 macromolecule Polymers 0.000 claims description 68
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 43
- 229910052731 fluorine Inorganic materials 0.000 claims description 43
- 239000011737 fluorine Substances 0.000 claims description 43
- MXVTXRCFKWSEAZ-UHFFFAOYSA-N 1,2-dihydrocyclobuta[a]naphthalene Chemical compound C1=CC2=CC=CC=C2C2=C1CC2 MXVTXRCFKWSEAZ-UHFFFAOYSA-N 0.000 claims description 30
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical class C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 28
- 229960000834 vinyl ether Drugs 0.000 claims description 25
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 20
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 229920002554 vinyl polymer Polymers 0.000 claims description 8
- 238000012545 processing Methods 0.000 abstract description 6
- 239000010409 thin film Substances 0.000 abstract 6
- 230000001939 inductive effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 70
- 230000015572 biosynthetic process Effects 0.000 description 27
- 238000005755 formation reaction Methods 0.000 description 27
- 238000005260 corrosion Methods 0.000 description 18
- 230000007797 corrosion Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- -1 polypropylene Polymers 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 239000000470 constituent Substances 0.000 description 13
- 238000011161 development Methods 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 229910052573 porcelain Inorganic materials 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 229920001577 copolymer Polymers 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 9
- 229920001155 polypropylene Polymers 0.000 description 9
- 238000005507 spraying Methods 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 9
- 239000004696 Poly ether ether ketone Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- 229920002530 polyetherether ketone Polymers 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 6
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 6
- 229920001780 ECTFE Polymers 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 208000034189 Sclerosis Diseases 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- XWUCFAJNVTZRLE-UHFFFAOYSA-N 7-thiabicyclo[2.2.1]hepta-1,3,5-triene Chemical compound C1=C(S2)C=CC2=C1 XWUCFAJNVTZRLE-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 244000139609 Euphoria longan Species 0.000 description 1
- 235000000235 Euphoria longan Nutrition 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- GEZAXHSNIQTPMM-UHFFFAOYSA-N dysprosium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Dy+3].[Dy+3] GEZAXHSNIQTPMM-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000389008 | 2000-12-21 | ||
| JP2000389008 | 2000-12-21 | ||
| JP2001254927 | 2001-08-24 | ||
| JP2001254927A JP2002252143A (ja) | 2000-12-21 | 2001-08-24 | 温度補償用薄膜コンデンサ及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1360323A CN1360323A (zh) | 2002-07-24 |
| CN1198297C true CN1198297C (zh) | 2005-04-20 |
Family
ID=26606293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011449012A Expired - Fee Related CN1198297C (zh) | 2000-12-21 | 2001-12-21 | 温度补偿用薄膜电容器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6556421B2 (https=) |
| EP (1) | EP1217637A3 (https=) |
| JP (1) | JP2002252143A (https=) |
| KR (1) | KR100428225B1 (https=) |
| CN (1) | CN1198297C (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461886B1 (en) * | 2000-05-13 | 2002-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
| UA77459C2 (en) * | 2001-11-03 | 2006-12-15 | Thin-film capacitor and a method for producing the capacitor | |
| US20040061990A1 (en) * | 2002-09-26 | 2004-04-01 | Dougherty T. Kirk | Temperature-compensated ferroelectric capacitor device, and its fabrication |
| DE102004005082B4 (de) * | 2004-02-02 | 2006-03-02 | Infineon Technologies Ag | Kondensator mit einem Dielektrikum aus einer selbstorganisierten Monoschicht einer organischen Verbindung und Verfahren zu dessen Herstellung |
| US7161795B1 (en) * | 2005-09-26 | 2007-01-09 | Ferro Corporation | COG dielectric composition for use with copper electrodes |
| WO2009151694A2 (en) * | 2008-03-13 | 2009-12-17 | Strategic Polymer Sciences, Inc. | High electrric energy density polymeric compositions, methods of the manufacture therefor, and articles comprising the same |
| US8223472B1 (en) * | 2008-11-14 | 2012-07-17 | Sandia Corporation | Norbornylene-based polymer systems for dielectric applications |
| JP4905497B2 (ja) * | 2009-04-22 | 2012-03-28 | 株式会社村田製作所 | 電子部品 |
| TW201121786A (en) * | 2009-10-22 | 2011-07-01 | Chi Lin Technology Co Ltd | Hybrid electret |
| US8315032B2 (en) | 2010-07-16 | 2012-11-20 | Ut-Battelle, Llc | High power density capacitor and method of fabrication |
| JP5679167B2 (ja) * | 2010-10-18 | 2015-03-04 | 信越ポリマー株式会社 | フィルムキャパシタ用フィルム |
| GB201212487D0 (en) | 2012-07-13 | 2012-08-29 | Secr Defence | A device for measuring the hydration level of humans |
| CN103772783A (zh) * | 2013-12-18 | 2014-05-07 | 芜湖万润机械有限责任公司 | 一种电容器用改性聚乙烯等规聚丙烯复合金属化薄膜及其制备方法 |
| WO2016003523A2 (en) * | 2014-04-16 | 2016-01-07 | Board Of Trustees Of The Leland Stanford Junior University | Polar elastomers for high performance electronic and optoelectronic devices |
| TWI754606B (zh) * | 2014-05-29 | 2022-02-11 | 美商西凱渥資訊處理科技公司 | 用於射頻裝置之溫度補償電路 |
| WO2019097750A1 (ja) * | 2017-11-15 | 2019-05-23 | 株式会社村田製作所 | フィルムコンデンサ、及び、金属化フィルム |
| CN109166730B (zh) * | 2018-08-28 | 2020-05-22 | 西安交通大学 | 一种宽温高储能的无铅柔性的介电薄膜电容器及其制备方法 |
| US11469761B1 (en) | 2020-09-11 | 2022-10-11 | Mixed-Signal Devices Inc. | CMOS frequency reference circuit with temperature coefficient cancellation |
| US12261596B1 (en) | 2020-09-11 | 2025-03-25 | Mixed-Signal Devices Inc. | Systems and methods for low temperature coefficient capacitors |
| US12085972B1 (en) | 2021-04-01 | 2024-09-10 | Mixed-Signal Devices Inc. | Sampled band-gap reference voltage generators |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3949280A (en) * | 1975-02-18 | 1976-04-06 | Mitsumi Electric Co., Ltd. | Miniature variable capacitor and method of manufacture |
| JPS5873908A (ja) * | 1981-10-28 | 1983-05-04 | ティーディーケイ株式会社 | 高周波用誘電体磁器組成物 |
| WO1984003003A1 (fr) * | 1983-01-31 | 1984-08-02 | Nippon Soda Co | Dielectrique a film mince et son procede de production |
| JPS63110618A (ja) | 1986-10-28 | 1988-05-16 | 沖電気工業株式会社 | 積層型マイクロ波用誘電体磁器組成物 |
| EP0393271A1 (en) * | 1987-08-08 | 1990-10-24 | The Standard Oil Company | Fluoropolymer thin film coatings and method of preparation by plasma polymerization |
| DE68906219T2 (de) | 1988-08-25 | 1993-08-05 | Matsushita Electric Ind Co Ltd | Duennfilmkapazitaet und verfahren zur herstellung einer integrierten hybridmikrowellenschaltung. |
| US5088003A (en) * | 1989-08-24 | 1992-02-11 | Tosoh Corporation | Laminated silicon oxide film capacitors and method for their production |
| JPH03252160A (ja) * | 1990-02-28 | 1991-11-11 | Nec Corp | コンデンサ、コンデンサネットワーク及び抵抗―コンデンサネットワーク |
| US5311406A (en) * | 1991-10-30 | 1994-05-10 | Honeywell Inc. | Microstrip printed wiring board and a method for making same |
| US5723171A (en) * | 1992-10-23 | 1998-03-03 | Symetrix Corporation | Integrated circuit electrode structure and process for fabricating same |
| JPH08115851A (ja) * | 1994-10-14 | 1996-05-07 | Ngk Spark Plug Co Ltd | 薄膜コンデンサ付きセラミック基板および その製造方法 |
| JP3475976B2 (ja) * | 1995-01-13 | 2003-12-10 | 出光石油化学株式会社 | コンデンサ |
| EP0749134B1 (en) | 1995-06-16 | 2002-10-02 | AT&T IPM Corp. | Dielectric material comprising Ta2O5 doped with TiO2 and devices employing same |
| EP0981823A1 (en) * | 1996-04-18 | 2000-03-01 | California Institute Of Technology | Thin film electret microphone |
| US5965273A (en) * | 1997-01-31 | 1999-10-12 | Hoechst Celanese Corporation | Polymeric compositions having a temperature-stable dielectric constant |
| US6153525A (en) * | 1997-03-13 | 2000-11-28 | Alliedsignal Inc. | Methods for chemical mechanical polish of organic polymer dielectric films |
| JPH11214250A (ja) * | 1998-01-28 | 1999-08-06 | Kuraray Co Ltd | デバイスとこれを実装した実装回路基板 |
| US6324048B1 (en) * | 1998-03-04 | 2001-11-27 | Avx Corporation | Ultra-small capacitor array |
| US6154311A (en) * | 1998-04-20 | 2000-11-28 | Simtek Hardcoatings, Inc. | UV reflective photocatalytic dielectric combiner having indices of refraction greater than 2.0 |
-
2001
- 2001-08-24 JP JP2001254927A patent/JP2002252143A/ja not_active Withdrawn
- 2001-10-31 EP EP01125397A patent/EP1217637A3/en not_active Withdrawn
- 2001-12-19 US US10/028,543 patent/US6556421B2/en not_active Expired - Fee Related
- 2001-12-20 KR KR10-2001-0081832A patent/KR100428225B1/ko not_active Expired - Fee Related
- 2001-12-21 CN CNB011449012A patent/CN1198297C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1360323A (zh) | 2002-07-24 |
| JP2002252143A (ja) | 2002-09-06 |
| EP1217637A3 (en) | 2005-01-26 |
| KR100428225B1 (ko) | 2004-04-28 |
| KR20020050734A (ko) | 2002-06-27 |
| EP1217637A2 (en) | 2002-06-26 |
| US20020122285A1 (en) | 2002-09-05 |
| US6556421B2 (en) | 2003-04-29 |
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| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |