CN1191550C - 信息记录标签 - Google Patents

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CN1191550C
CN1191550C CNB011173297A CN01117329A CN1191550C CN 1191550 C CN1191550 C CN 1191550C CN B011173297 A CNB011173297 A CN B011173297A CN 01117329 A CN01117329 A CN 01117329A CN 1191550 C CN1191550 C CN 1191550C
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铃木和明
松村孝
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Dexerials Corp
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Sony Chemicals Corp
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
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    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

信息记录标签10A包括由薄膜电容5和天线线圈2构成的谐振电路及IC芯片3安装在基体1上的IC模块和设置在IC模块上、用于使IC模块粘附在被附着体上的粘结剂17，粘结剂17粘结薄膜电容5的薄膜状电极7b，粘结剂17和被附着体S之间的粘附力大于薄膜电容5的绝缘薄膜6和薄膜状电极7a，7b之间的附着力。在使用了贴附于规定被附着体的信息记录标签中，为了防止信息记录标签的非法使用，一旦将信息记录标签贴附在被附着体后，在从所述被附着体剥离时，可以破坏信息记录标签。

Description

信息记录标签
本申请涉及内置IC模块的信息记录标签，其被用于附着在被附着体上以记录所述被附着体的产品信息等。
在各种制品中，作为记录制造者，制造名称，制造年月日，规格，目前的使用频率等各种信息的标签，可采用信息记录标签，其内置有IC模块且被附着在规定制品上来使用。
如图6所示，所述信息记录标签10通常在由绝缘薄膜构成的基体1上安装有由天线线圈2和薄膜电容5构成的谐振电路及IC芯片3，并利用由环氧树脂等热固性树脂或聚酯等热熔性树脂等构成的密封树脂11对其进行密封，通过丙烯酸系树脂等粘结剂12使聚酯薄膜等的外层薄膜13层叠在所述基体1的侧面，在其相对侧的表面，通过粘结剂14层叠有剥离纸15。在将信息记录标签10作为标签贴附于构成被附着体的规定制品时，剥离所述剥离纸15，被树脂密封的IC模块通过粘结剂14被粘附在规定的被附着体上。在外层表面13上形成规定制品的标识等。
可是，在将信息纪录标签贴附在规定的被附着体之后，为了防止非法剥离所述信息记录标签并以不同于原来贴附的被附着体的制品进行使用而产生的信息记录标签的非法使用，则希望一旦将信息记录标签贴附在规定的被附着体后，若非法剥离所述信息记录标签，则会使信息记录标签自身破坏。
本发明的目的在于解决以上现有技术中的问题，一旦将信息记录标签贴附在规定的被附着体后，在从所述被附着体剥离所述信息记录标签时，易于破坏内置于信息记录标签的薄膜状电容或使用了该电容的谐振电路，从而能够防止信息记录标签的非法使用。
本发明人在实现本发明时发现，不是以密封树脂密封内置于信息记录标签的IC模块，而是在IC模块上直接设置粘结剂，进而使将IC模块附着在被附着体时的粘结剂与被附着体之间的粘附力大于薄膜电容的绝缘薄膜和薄膜状电极之间的附着力，便易于破坏薄膜状电容或使用了该电容的谐振电路。
即，本发明提供了这样的信息记录标签，其包括IC模块及设置在IC模块上、用于使所述IC模块粘附在被附着体上的粘结剂，在所述IC模块中，由薄膜电容和天线线圈构成的谐振电路和IC芯片安装在基体上，其特征在于，粘结剂粘结薄膜电容的薄膜状电极，粘结剂和被附着体之间的粘附力大于薄膜电容的绝缘薄膜和薄膜状电极之间的附着力。
图1为本发明信息记录标签的平面图(同图(a))及断面图(同图(b))。
图2为防止本发明的信息记录标签非法使用的操作的说明图。
图3为防止本发明的信息记录标签非法使用的操作的说明图。
图4为本发明信息记录标签的平面图(同图(a))及断面图(同图(b))。
图5为防止本发明的信息记录标签非法使用的操作的说明图。
图6为以往的信息记录标签的平面图(同图(a))及断面图(同图(b))。
发明的实施例
下面，根据附图对本发明进行详细描述。在各个附图中，相同的符合表示相同或等同的结构元件。
图1为本发明信息记录标签10A的平面图(同图(a))及断面图(同图(b))，所述信息记录标签用于记录通过被固定于色带，图象胶片及其它产品上以记录其产品信息。
该信息记录标签10A为这样一种装置，其中，在由PET，聚酰亚胺等绝缘薄膜构成的基体1上安装有天线线圈2，IC芯片3及薄膜电容5，以形成IC模块，剥离纸15通过可兼作为填充材料的粘结剂17层叠至所述IC模块的薄膜电容5，通过粘结剂17使聚酯薄膜等外层薄膜13粘结至剥离纸的相对面。在将信息记录标签10A贴附在规定的被附着体上时剥离所述剥离纸15，以使IC模块通过粘结剂17贴附于被附着体上。
在所述信息记录标签10A，并未象图6所示的以往信息记录标签10那样用密封树脂11密封IC模块，且也未在IC模块上设置隔离材料，而是使粘结剂17直接粘附于薄膜电容5的薄膜状电极7b上。因此，所述信息记录标签10A与图6中的信息记录标签10相比，其厚变薄了一半。因此，如图3(a)所示，在以外层薄膜13为外侧使信息记录标签10A贴附于被附着体上后，如图(b)所述剥离信息记录标签10A时，剥离角θ1大于剥离较厚的以往信息记录标签10时的剥离角θ2(同图(c))。所以，在所述信息记录标签10A中，在从被附着体S上剥离时，会在IC模块上作用较大的载荷，从而易于破坏IC模块。因此，能够防止非法的二次使用。
在所述信息记录标签10A中，粘结剂17和被附着体S的附着力大于薄膜电容5中绝缘薄膜6和薄膜状电极7a，7b的附着力。因此，在将信息记录标签10A贴附于被附着体S后，在进行剥离时，如图2中箭头A1，A2所示，易于从薄膜电容5中绝缘薄膜6和薄膜状电极7a，7b的附着界面引发薄膜电容5的破坏。
在所述信息记录标签10A中，粘结剂17和被附着体S之间的粘附力大于粘结剂17和基体1之间的粘附力。因此，在将信息记录标签10A贴附于被附着体S后，在进行剥离时，如图2中箭头B所示，也会由粘结剂17和基体1的附着界面引发谐振电路的破坏。因此，能够确切防止信息记录标签的非法使用。
作为使与被附着体S的附着力大于绝缘薄膜6和薄膜状电极7a，7b之间的附着力且大于粘结剂17和基体1之间的粘附力的粘结剂17的种类，根据被附着体S的表面材料，表面状态等，例如在预定将ABS树脂作为被附着体S的情况下，希望采用丙烯酸系粘结剂，紫外线硬化型粘结剂等。由此，能够将粘结剂17和基体1之间的粘附力设定为700-1000g/cm。
可是，薄膜电容5的绝缘薄膜6和薄膜状电极7a，7b之间的附着力虽然取决于形成它们的材料等，例如，在绝缘薄膜6由聚酰亚胺形成，薄膜状电极7a，7b由铜箔构成的情况下，该附着力通常大约为800g/cm或大于800g/cm，而在绝缘薄膜6由云母表面构成，薄膜状电极7a，7b由铜箔构成的情况下，该附着力通常大约为1-10g/cm。粘结剂17和薄膜状电极7a，7b之间的粘附力取决于形成它们的材料，通常为700-1000g/cm。
所以，通过选择适合的粘结剂17，能够使粘结剂17与被附着体S之间的粘附力大于绝缘薄膜6和薄膜状电极7a，7b之间的附着力。另外，可使粘结剂17与被附着体S之间的粘附力大于粘结剂17与基体1之间的粘附力，使粘结剂17与被附着体S之间的附着力大于粘结剂17和薄膜状电极7a，7b之间的粘附力。
作为将粘结剂17设置在IC模块的方法，可采用：(i)在附着在外层薄膜13上的IC模块上覆盖在一侧具有剥离纸15的薄膜状粘结剂的方法，(ii)在剥离纸15上涂布液态粘结剂并使其覆盖在粘结于外层薄膜13的IC模块上的方法，(iii)在粘结在外层薄膜13的IC模块上涂布液态粘结剂并覆盖剥离纸15的方法等，若使用(iii)的方法，能够获得具有大致均匀厚度的信息记录标签。
另一方面，在所述信息记录标签10A中，天线线圈2是通过对由构成基体1的绝缘薄膜和铜箔形成的层叠体的该铜箔进行蚀刻形成的。另外，IC芯片3通过各向异性粘结剂4以朝下方式装配在基体1上。
作为薄膜电容5，虽可使用各种薄膜状电容，但是最好使用云母电容器，该电容将云母薄膜作为绝缘薄膜6使用。由于云母薄膜的吸水率较低，因此通过使用云母电容器，能够防止由吸湿而改变IC模块的共振频率。通常，绝缘薄膜6和其两个侧面的薄膜状电极7a ，7b之间的附着力小于利用聚酰亚胺等作为绝缘薄膜的薄膜电容5与所述薄膜状电极之间的附着力，由于远小于粘结剂17与被附着体S之间的粘附力，因此，一旦从所述被附着体S上撕下附着在被附着体S上的信息记录标签10A，便能够通过绝缘薄膜6与其薄膜状电极7a，7b之间的剥离而更确保引发云母电容5的破坏。
在这一信息记录标签10A中，薄膜电容5的电极通过各向异性导电性粘结剂4连接在基体1上，而电极以外的薄膜电容5则不会通过各向异性导电性粘结剂4粘结在基体1上。薄膜电容5的周边通过粘结剂17与基体1相连，粘结剂1不应存在于与薄膜电容5中央部的基体1的相对面5a，薄膜电容5的中央部与基体1处于非粘着状态。如果薄膜电容5仅通过其电极部与基体1附着，在一旦使信息记录标签10A附着在被附着体S上后，在进行剥离时，如图2中箭头C所示，易于使薄膜电容5于基体1的连接部破坏，从而能进一步确保防止信息记录标签10A的非法使用。
图4为本发明中其它状态的信息记录标签10B的平面图(同图(a))及断面图(同图(b))。
所述信息记录标签10B与上述图1中的信息记录标签10A相比，其不同点在于：在薄膜电容5的周围设置隔离材料18，在薄膜电容5的周围，粘结剂17与隔离材料18粘结在一起，而其它的结构与图1中信息记录标签10A相同。
通过设置隔离材料18，能够简便地形成具有均匀厚度的信息记录标签。隔离材料18最好设有IC芯片3，薄膜电容5等的安装部件的余量孔等贯通孔。
在设置隔离材料18的情况下，粘结剂17和被附着体S之间的粘附力最好大于粘结剂17和隔离材料18之间的粘附力。结果，在使信息记录标签10B附着在被附着体S上后，在进行剥离时，如图5中箭头D所示，易于由粘结剂17和隔离材料18之间的粘附界面破坏信息记录标签10B。接着，如箭头A1，A2所示，由薄膜电容5的绝缘薄膜6和薄膜状电极7a，7b之间的粘附界面破坏薄膜电容5，进而如图C所示，能够引发以各向异性导电性粘结剂4使薄膜电容5连接至基体1的连接部的破坏。
通过使粘结剂17和隔离材料18之间的粘附力大于隔离材料18和基体1之间的粘附力，与前述内容相同，如箭头B所示，能够由隔离材料18和基体1之间的附着界面引发谐振电路的破坏。
本发明的信息记录标签不应局限于上述信息记录标签10A，10B，可采用多种形式。因此，只要IC模块上的粘结剂17与薄膜电容5的薄膜状电极7a，7b粘结，且粘结剂17和被附着体S之间的粘附力相对于其它部分的粘附力具有上述大小的关系，便可以适当地确定构成IC模块的天线线圈2，IC芯片3及薄膜电容5的各个种类，形状，配置等。
对于本发明的信息记录标签，一旦被附着在规定的被附着体后，在从所述被附着体剥离所述信息记录标签时，由于能够容易地破坏内置于信息记录标签中的薄膜电容或包围薄膜电容的谐振电路，因此能够防止信息记录标签的非法使用。

Claims (6)

1、信息记录标签，其包括IC模块及设置在IC模块上、用于使所述IC模块粘附在被附着体上的粘结剂，在所述IC模块中，由薄膜电容和天线线圈构成的谐振电路和IC芯片安装在基体上，其特征在于，粘结剂粘结薄膜电容的薄膜状电极，粘结剂和被附着体之间的粘附力大于薄膜电容的绝缘薄膜和薄膜状电极之间的附着力。
2、根据权利要求1所述的信息记录标签，其特征在于：在薄膜电容的周围设置隔离材料，粘结剂与隔离材料粘附在一起，粘结剂与被附着体之间的粘附力应大于粘结剂和隔离材料之间的粘附力。
3、根据权利要求1所述的信息记录标签，其特征在于：在IC模块上不必设置隔离材料，但应设置粘结剂。
4、根据权利要求1-3中任一项所述的信息记录标签，其特征在于：粘结剂与被附着体的粘附力大于粘结剂和基体之间的粘附力。
5、根据权利要求1-3中任一项所述的信息记录标签，其特征在于：薄膜电容为云母电容。
6、根据权利要求4所述的信息记录标签，其特征在于：薄膜电容为云母电容。
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