CN114399017A - 局部防转移rfid标签 - Google Patents
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Abstract
本发明公开了局部防转移RFID标签,包括自上而下层叠设置的面层、第一压敏胶层、铝箔层、PET基材层和第二压敏胶层,铝箔层与PET基材层通过胶水紧密粘合,第一压敏胶层包括高粘区和低粘区,高粘区自低粘区的外边缘向铝箔层的外边缘延伸,铝箔层上开设有开口于其周侧的容置通孔,容置通孔内设有芯片,容置通孔至少设有芯片的部分与低粘区相对。由于高粘区与低粘区的粘力差,将转移RFID标签剥离产品时,铝箔层和PET基材层在容置通孔的开口处断开并随面层脱离产品,而芯片及与芯片相对的部分PET基材层则留在产品上,实现转移RFID标签的破坏,而由于PET基材的属性,使残留在产品上的PET基材层和附着在PET基材层上的芯片极易清理,且将该转移RFID标签粘贴在产品上时,5秒既可粘牢,贴合效率高。
Description
【技术领域】
本申请涉及转移标签,尤其涉及局部防转移RFID标签。
【背景技术】
局部防转移电子标签是能粘贴、印刷、转移在标的物表面、或标的物包装、或标的物附属物上,具有防伪作用的标识,多应用于烟草、酒类、药品、化妆品及汽车零部件等物品的溯源和防伪。现有的局部防转移标签为了防止标签被转移仿制而增强标签底层6的胶水的粘结强度,使标签在撕拉过程中无法整块取下,完整性遭到破坏,从而避免标签被转移,但将在商品上留下难看的残留物。
【发明内容】
本申请提供了一种局部防转移RFID标签,以解决上述背景技术中提出的局部防转移标签粘结性较强而污染商品的问题。
本申请是通过以下技术方案实现的:
局部防转移RFID标签,包括自上而下层叠设置的面层、第一压敏胶层、铝箔层、PET基材层和第二压敏胶层,所述铝箔层与所述PET基材层通过胶水紧密粘合,所述第一压敏胶层包括高粘区和低粘区,所述高粘区自所述低粘区的外边缘向所述铝箔层的外边缘延伸,所述铝箔层上开设有开口于其周侧的容置通孔,所述容置通孔内设有芯片,所述容置通孔至少设有所述芯片的部分与所述低粘区相对。
如上所述的局部防转移RFID标签,所述铝箔层的面积分别小于所述PET基材层的面积和所述面层的面积,且所述高粘区自所述低粘区的外边缘延伸至所述铝箔层的外边缘以外。
如上所述的局部防转移RFID标签,所述高粘区自所述低粘区的外边缘延伸至所述面层的外边缘和/或所述PET基材层的外边缘。
如上所述的局部防转移RFID标签,所述面层和所述PET基材层的形状大小相同,且外边缘对齐。
如上所述的局部防转移RFID标签,所述第一压敏胶层于所述低粘区的位置开设有外露通孔,所述外露通孔与所述芯片相对;或所述第一压敏胶层于所述低粘区的位置设有可移胶膜,所述可移胶膜与所述芯片相对。
如上所述的局部防转移RFID标签,所述第一压敏胶层的高粘区的粘力大于4N,所述第一压敏胶层的低粘区的粘力小于0.02N。
如上所述的局部防转移RFID标签,所述铝箔层、所述PET基材层和所述第二压敏胶层上均开设有切口,各所述切口位于所述容置通孔一侧,任两相邻的所述切口相对设置。
如上所述的局部防转移RFID标签,所述面层为纸或镭射膜或塑料。
如上所述的局部防转移RFID标签,所述容置通孔关于所述铝箔层长边方向的中心线对称。
如上所述的局部防转移RFID标签,所述容置通孔包括沿所述铝箔层长边方向延伸的长边通孔和沿所述铝箔层短边方向延伸的短边通孔,所述短边通孔与所述长边通孔连通且开口于所述铝箔层短边方向的一侧,所述短边通孔位于所述长边通孔的中部,且开口于所述铝箔层前侧,所述长边通孔自其中部向后拱起,所述铝箔层前侧开设有向后凹伸并与所述短边通孔连通的弧形缺口。
与现有技术相比,本发明具有如下优点:
本发明通过在粘合面层和铝箔层的第一压敏胶层上设置高粘区和低粘区,使将该转移RFID标签剥离产品时,铝箔层与高粘区粘合的部分以及PET基材层与该部分相对的部分在容置通孔的开口处断开并随面层脱离产品,而PET基材层与低粘区相对或粘合的部分以及位于容置通孔内并附着在PET基材层上的芯片则残留在产品上,实现转移标签的破坏,达到防伪效果,而由于PET基材的属性,使残留在产品上的PET基材层和附着在PET基材层上的芯片极易清理,同时,由于PET基材的属性,使将该转移标签粘贴在产品上时,5秒既可粘牢,贴合效率高。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。
图1为本申请局部防转移RFID标签的实施例的侧视方向的结构示意图;
图2为本申请局部防转移RFID标签的实施例的结构分解图;
图3为本申请实施例中第一压敏胶层和铝箔层俯视方向的装配示意图。
【具体实施方式】
为了使本申请所解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本申请,并不用于限定本申请。
实施例:如图1-3所示,该局部防转移RFID标签包括包括自上而下层叠设置的面层1、第一压敏胶层2、铝箔层3、PET基材层4、第二压敏胶层5和底层6,所述铝箔层3与所述PET基材层4通过胶水紧密粘合,所述第一压敏胶层2包括高粘区21和低粘区22,所述高粘区21自所述低粘区22的外边缘向所述铝箔层3的外边缘延伸,所述铝箔层3上开设有开口于其周侧的容置通孔31,所述容置通孔31内设有芯片7,所述容置通孔31至少设有所述芯片7的部分与所述低粘区22相对,其中,所述铝箔层3与所述PET基材层4紧密粘合形成复合层。其中,在将该转移标签撕离产品时,由于所述高粘区21与所述低粘区22的粘力差,使所述铝箔层3与所述高粘区21粘合的部分以及所述PET基材层4与该部分相对的部分在所述容置通孔31的开口处断开并随所述面层1脱离产品,而所述PET基材层4与所述低粘区22相对或粘合的部分以及位于所述容置通孔31内并附着在所述PET基材层4上的所述芯片7则残留在产品上,实现转移标签的破坏,达到防伪效果,而由于PET基材的属性,使残留在产品上的所述PET基材层4和附着在所述PET基材层4上的所述芯片7极易清理,同时,由于PET基材的属性,使将该转移标签粘贴在产品上时,5秒既可粘牢,贴合效率高。
进一步地,为了提高所述高粘区21的粘合效果,所述铝箔层3的面积分别小于所述PET基材层4的面积和所述面层1的面积,且所述高粘区21自所述低粘区22的外边缘延伸至所述铝箔层3的外边缘以外。
进一步地,为了提高粘合效果,所述高粘区21与所述铝箔层3的重合部分占所述高粘区21的0.65~0.7。
进一步地,为了提高粘合效果,所述高粘区21自所述低粘区22的外边缘延伸至所述面层1的外边缘和/或所述PET基材层4的外边缘。
进一步地,为了提高粘合效果,所述面层1和所述PET基材层4的形状大小相同,且外边缘对齐。
进一步地,为了提高剥离效果,所述第一压敏胶层2于所述低粘区22的位置开设外露通孔,所述外露通孔与所述芯片7相对,此时,所述低粘区22的粘力为零;
或者所述第一压敏胶层2于所述低粘区22的位置设有可移胶膜,所述可移胶膜与所述芯片7相对,所述可移胶膜的粘力大于0小于0.02N,既所述低粘区22的粘力大于0小于0.02N。
进一步地,为了提高剥离效果,所述第一压敏胶层2的高粘区21的粘力大于4N,其中,所述第一压敏胶层2的高粘区21与所述第一压敏胶层2的低粘区22的粘力差距越大,在将该转移RFID标签剥离产品时,剥离效果越好。
进一步地,为了提高剥离效果,所述铝箔层3、所述PET基材层4和所述第二压敏胶层5上均开设有切口8,各所述切口8位于所述容置通孔31一侧,任两相邻的所述切口8相对设置。此设置使所述铝箔层3、所述PET基材层4和所述第二压敏胶层5易于在所述容置通孔31的开口处断开。
具体地,所述面层1为纸或镭射膜或塑料。
进一步地,为了提高剥离效果,避免所述面层1在转移RFID标签剥离产品时断裂,增加产品上的残留物,所述面层1采用PP材料、PET材料、PVC材料、BOPP材料或PE材料等不易碎裂的材料。
当然所述面层1包括但不限于上述材料。
进一步地,为了使所述铝箔层3易于在所述容置通孔31的开口处断开,所述容置通孔31包括沿所述铝箔层3长边方向延伸的长边通孔311和沿所述铝箔层3短边方向延伸的短边通孔312,所述短边通孔312与所述长边通孔311连通且开口于所述铝箔层3短边方向的一侧,所述芯片7设于所述短边通孔312内。
进一步地,为了使所述铝箔层3易于在所述容置通孔31的开口处断开,所述短边通孔312位于所述长边通孔311的中部,且开口于所述铝箔层3前侧,所述长边通孔311自其中部向后拱起,所述容置通孔31关于所述铝箔层3长边方向的中心线对称。
进一步地,为了使所述铝箔层3易于在所述容置通孔31处断开,所述铝箔层3前侧开设有向后凹伸并与所述短边通孔312连通的弧形缺口33。
应当理解的是,本申请中采用术语“第一”、“第二”等来描述各种信息,但这些信息不应限于这些术语,这些术语仅用来将同一类型的信息彼此区分开。例如,在不脱离本申请范围的情况下,“第一”信息也可以被称为“第二”信息,类似的,“第二”信息也可以被称为“第一”信息。此外,术语“圆心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。
如上所述是结合具体内容提供的一种或多种实施方式,并不认定本申请的具体实施只局限于这些说明。凡与本申请的方法、结构等近似、雷同,或是对于本申请构思前提下做出若干技术推演,或替换都应当视为本申请的保护范围。
Claims (10)
1.局部防转移RFID标签,其特征在于,包括自上而下层叠设置的面层、第一压敏胶层、铝箔层、PET基材层和第二压敏胶层,所述铝箔层与所述PET基材层通过胶水紧密粘合,所述第一压敏胶层包括高粘区和低粘区,所述高粘区自所述低粘区的外边缘向所述铝箔层的外边缘延伸,所述铝箔层上开设有开口于其周侧的容置通孔,所述容置通孔内设有芯片,所述容置通孔至少设有所述芯片的部分与所述低粘区相对。
2.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述铝箔层的面积分别小于所述PET基材层的面积和所述面层的面积,且所述高粘区自所述低粘区的外边缘延伸至所述铝箔层的外边缘以外。
3.根据权利要求1或2所述的局部防转移RFID标签,其特征在于,所述高粘区自所述低粘区的外边缘延伸至所述面层的外边缘和/或所述PET基材层的外边缘。
4.根据权利要求3所述的局部防转移RFID标签,其特征在于,所述面层和所述PET基材层的形状大小相同,且外边缘对齐。
5.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述第一压敏胶层于所述低粘区的位置开设有外露通孔,所述外露通孔与所述芯片相对;
或所述第一压敏胶层于所述低粘区的位置设有可移胶膜,所述可移胶膜与所述芯片相对。
6.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述第一压敏胶层的高粘区的粘力大于4N,所述第一压敏胶层的低粘区的粘力小于0.02N。
7.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述铝箔层、所述PET基材层和所述第二压敏胶层上均开设有切口,各所述切口位于所述容置通孔一侧,任两相邻的所述切口相对设置。
8.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述面层为纸或镭射膜或塑料。
9.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述容置通孔关于所述铝箔层长边方向的中心线对称。
10.根据权利要求1所述的局部防转移RFID标签,其特征在于,所述容置通孔包括沿所述铝箔层长边方向延伸的长边通孔和沿所述铝箔层短边方向延伸的短边通孔,所述短边通孔与所述长边通孔连通且开口于所述铝箔层短边方向的一侧,所述短边通孔位于所述长边通孔的中部,且开口于所述铝箔层前侧,所述长边通孔自其中部向后拱起,所述铝箔层前侧开设有向后凹伸并与所述短边通孔连通的弧形缺口。
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