CN118922935A - 布线基板及半导体装置 - Google Patents

布线基板及半导体装置 Download PDF

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Publication number
CN118922935A
CN118922935A CN202380029916.7A CN202380029916A CN118922935A CN 118922935 A CN118922935 A CN 118922935A CN 202380029916 A CN202380029916 A CN 202380029916A CN 118922935 A CN118922935 A CN 118922935A
Authority
CN
China
Prior art keywords
layer
wiring
hole
ceramic
ceramic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380029916.7A
Other languages
English (en)
Chinese (zh)
Inventor
松本有平
山元泉太郎
柴田真光
太田菜月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118922935A publication Critical patent/CN118922935A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H10W70/686—Shapes or dispositions thereof comprising multiple insulating layers the multiple insulating layers having different compositions, e.g. polymer layer on glass substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202380029916.7A 2022-03-30 2023-03-09 布线基板及半导体装置 Pending CN118922935A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-056183 2022-03-30
JP2022056183 2022-03-30
PCT/JP2023/009008 WO2023189345A1 (ja) 2022-03-30 2023-03-09 配線基板及び半導体装置

Publications (1)

Publication Number Publication Date
CN118922935A true CN118922935A (zh) 2024-11-08

Family

ID=88200704

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380029916.7A Pending CN118922935A (zh) 2022-03-30 2023-03-09 布线基板及半导体装置

Country Status (5)

Country Link
US (1) US20250221079A1 (https=)
EP (1) EP4503113A1 (https=)
JP (1) JPWO2023189345A1 (https=)
CN (1) CN118922935A (https=)
WO (1) WO2023189345A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025143199A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
WO2025143245A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
WO2025143198A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
TW202539314A (zh) * 2024-01-31 2025-10-01 日商京瓷股份有限公司 配線基板及半導體裝置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3201681B2 (ja) * 1993-04-15 2001-08-27 株式会社日立国際電気 表面実装型混成集積回路装置
JP3787765B2 (ja) * 2001-11-30 2006-06-21 松下電器産業株式会社 固体撮像装置およびその製造方法
JP4671744B2 (ja) 2005-04-18 2011-04-20 京セラ株式会社 撮像素子収納用パッケージおよび撮像装置
JP2012164816A (ja) * 2011-02-07 2012-08-30 Murata Mfg Co Ltd 多層配線基板
JP2013058864A (ja) * 2011-09-07 2013-03-28 Daishinku Corp 圧電デバイス
JP5964858B2 (ja) * 2011-11-30 2016-08-03 京セラ株式会社 撮像素子収納用パッケージおよび撮像装置
US9608020B2 (en) * 2013-10-23 2017-03-28 Kyocera Corporation Imaging element mounting substrate and imaging device
JP6329065B2 (ja) * 2014-12-25 2018-05-23 京セラ株式会社 電子素子実装用基板および電子装置
JP6732932B2 (ja) * 2016-10-27 2020-07-29 京セラ株式会社 撮像素子実装用基体、撮像装置および撮像モジュール
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JP2020004901A (ja) * 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法
JP7414720B2 (ja) * 2018-08-21 2024-01-16 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法

Also Published As

Publication number Publication date
WO2023189345A1 (ja) 2023-10-05
US20250221079A1 (en) 2025-07-03
JPWO2023189345A1 (https=) 2023-10-05
EP4503113A1 (en) 2025-02-05

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