JPWO2023189345A1 - - Google Patents

Info

Publication number
JPWO2023189345A1
JPWO2023189345A1 JP2024511630A JP2024511630A JPWO2023189345A1 JP WO2023189345 A1 JPWO2023189345 A1 JP WO2023189345A1 JP 2024511630 A JP2024511630 A JP 2024511630A JP 2024511630 A JP2024511630 A JP 2024511630A JP WO2023189345 A1 JPWO2023189345 A1 JP WO2023189345A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511630A
Other languages
Japanese (ja)
Other versions
JPWO2023189345A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189345A1 publication Critical patent/JPWO2023189345A1/ja
Publication of JPWO2023189345A5 publication Critical patent/JPWO2023189345A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H10W70/686—Shapes or dispositions thereof comprising multiple insulating layers the multiple insulating layers having different compositions, e.g. polymer layer on glass substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2024511630A 2022-03-30 2023-03-09 Pending JPWO2023189345A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022056183 2022-03-30
PCT/JP2023/009008 WO2023189345A1 (ja) 2022-03-30 2023-03-09 配線基板及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023189345A1 true JPWO2023189345A1 (https=) 2023-10-05
JPWO2023189345A5 JPWO2023189345A5 (https=) 2024-12-05

Family

ID=88200704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511630A Pending JPWO2023189345A1 (https=) 2022-03-30 2023-03-09

Country Status (5)

Country Link
US (1) US20250221079A1 (https=)
EP (1) EP4503113A1 (https=)
JP (1) JPWO2023189345A1 (https=)
CN (1) CN118922935A (https=)
WO (1) WO2023189345A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025143199A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
WO2025143245A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
WO2025143198A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
TW202539314A (zh) * 2024-01-31 2025-10-01 日商京瓷股份有限公司 配線基板及半導體裝置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3787765B2 (ja) * 2001-11-30 2006-06-21 松下電器産業株式会社 固体撮像装置およびその製造方法
JP2016122978A (ja) * 2014-12-25 2016-07-07 京セラ株式会社 電子素子実装用基板および電子装置
JPWO2015060345A1 (ja) * 2013-10-23 2017-03-09 京セラ株式会社 撮像素子搭載用基板および撮像装置
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JPWO2018079644A1 (ja) * 2016-10-27 2019-09-19 京セラ株式会社 撮像素子実装用基体、撮像装置および撮像モジュール
JP2020004901A (ja) * 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3201681B2 (ja) * 1993-04-15 2001-08-27 株式会社日立国際電気 表面実装型混成集積回路装置
JP4671744B2 (ja) 2005-04-18 2011-04-20 京セラ株式会社 撮像素子収納用パッケージおよび撮像装置
JP2012164816A (ja) * 2011-02-07 2012-08-30 Murata Mfg Co Ltd 多層配線基板
JP2013058864A (ja) * 2011-09-07 2013-03-28 Daishinku Corp 圧電デバイス
JP5964858B2 (ja) * 2011-11-30 2016-08-03 京セラ株式会社 撮像素子収納用パッケージおよび撮像装置
JP7414720B2 (ja) * 2018-08-21 2024-01-16 ソニーセミコンダクタソリューションズ株式会社 半導体装置、電子機器、および半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3787765B2 (ja) * 2001-11-30 2006-06-21 松下電器産業株式会社 固体撮像装置およびその製造方法
JPWO2015060345A1 (ja) * 2013-10-23 2017-03-09 京セラ株式会社 撮像素子搭載用基板および撮像装置
JP2016122978A (ja) * 2014-12-25 2016-07-07 京セラ株式会社 電子素子実装用基板および電子装置
JPWO2018079644A1 (ja) * 2016-10-27 2019-09-19 京セラ株式会社 撮像素子実装用基体、撮像装置および撮像モジュール
JP2019096778A (ja) * 2017-11-24 2019-06-20 京セラ株式会社 蓋体および光学装置
JP2020004901A (ja) * 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Also Published As

Publication number Publication date
WO2023189345A1 (ja) 2023-10-05
US20250221079A1 (en) 2025-07-03
CN118922935A (zh) 2024-11-08
EP4503113A1 (en) 2025-02-05

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