CN118715283A - 固化性组合物 - Google Patents

固化性组合物 Download PDF

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Publication number
CN118715283A
CN118715283A CN202380022567.6A CN202380022567A CN118715283A CN 118715283 A CN118715283 A CN 118715283A CN 202380022567 A CN202380022567 A CN 202380022567A CN 118715283 A CN118715283 A CN 118715283A
Authority
CN
China
Prior art keywords
curable composition
manufactured
mass
component
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380022567.6A
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English (en)
Chinese (zh)
Inventor
名取直辉
富永大雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN118715283A publication Critical patent/CN118715283A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN202380022567.6A 2022-03-24 2023-03-24 固化性组合物 Pending CN118715283A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-048354 2022-03-24
JP2022048354 2022-03-24
PCT/JP2023/011801 WO2023182492A1 (ja) 2022-03-24 2023-03-24 硬化性組成物

Publications (1)

Publication Number Publication Date
CN118715283A true CN118715283A (zh) 2024-09-27

Family

ID=88101660

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380022567.6A Pending CN118715283A (zh) 2022-03-24 2023-03-24 固化性组合物

Country Status (5)

Country Link
JP (1) JP7758162B2 (https=)
KR (1) KR20240162150A (https=)
CN (1) CN118715283A (https=)
TW (1) TW202406969A (https=)
WO (1) WO2023182492A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120795552A (zh) * 2025-08-11 2025-10-17 上海熙邦新材料有限公司 一种光纤阵列用环氧树脂及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025119211A (ja) * 2024-02-01 2025-08-14 味の素株式会社 樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001346A (ja) 2008-06-19 2010-01-07 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及び硬化物
DE102009026548A1 (de) 2009-05-28 2011-03-24 Henkel Ag & Co. Kgaa Klebefolie oder Klebeband auf Basis von Epoxiden
JP5603803B2 (ja) 2011-02-25 2014-10-08 株式会社Ａｄｅｋａ エポキシ樹脂組成物及び絶縁接着剤
JP2015168687A (ja) * 2014-03-04 2015-09-28 京セラケミカル株式会社 コイル含浸用樹脂組成物及びコイル装置
JP2018119032A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6929069B2 (ja) 2017-01-23 2021-09-01 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2019116556A (ja) 2017-12-27 2019-07-18 京セラ株式会社 エポキシ樹脂組成物およびリフレクター
JP2020033514A (ja) 2018-08-31 2020-03-05 京セラ株式会社 エポキシ樹脂組成物および半導体装置
TWI698484B (zh) 2018-10-12 2020-07-11 台燿科技股份有限公司 無溶劑之樹脂組合物及其應用
JP7388160B2 (ja) 2019-12-03 2023-11-29 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120795552A (zh) * 2025-08-11 2025-10-17 上海熙邦新材料有限公司 一种光纤阵列用环氧树脂及其制备方法

Also Published As

Publication number Publication date
KR20240162150A (ko) 2024-11-14
JP7758162B2 (ja) 2025-10-22
WO2023182492A1 (ja) 2023-09-28
TW202406969A (zh) 2024-02-16
JPWO2023182492A1 (https=) 2023-09-28

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