KR20240162150A - 경화성 조성물 - Google Patents

경화성 조성물 Download PDF

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Publication number
KR20240162150A
KR20240162150A KR1020247035429A KR20247035429A KR20240162150A KR 20240162150 A KR20240162150 A KR 20240162150A KR 1020247035429 A KR1020247035429 A KR 1020247035429A KR 20247035429 A KR20247035429 A KR 20247035429A KR 20240162150 A KR20240162150 A KR 20240162150A
Authority
KR
South Korea
Prior art keywords
curable composition
group
manufactured
mass
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247035429A
Other languages
English (en)
Korean (ko)
Inventor
나오키 나토리
다이가 도미나가
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20240162150A publication Critical patent/KR20240162150A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020247035429A 2022-03-24 2023-03-24 경화성 조성물 Pending KR20240162150A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-048354 2022-03-24
JP2022048354 2022-03-24
PCT/JP2023/011801 WO2023182492A1 (ja) 2022-03-24 2023-03-24 硬化性組成物

Publications (1)

Publication Number Publication Date
KR20240162150A true KR20240162150A (ko) 2024-11-14

Family

ID=88101660

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247035429A Pending KR20240162150A (ko) 2022-03-24 2023-03-24 경화성 조성물

Country Status (5)

Country Link
JP (1) JP7758162B2 (https=)
KR (1) KR20240162150A (https=)
CN (1) CN118715283A (https=)
TW (1) TW202406969A (https=)
WO (1) WO2023182492A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025119211A (ja) * 2024-02-01 2025-08-14 味の素株式会社 樹脂組成物
CN120795552B (zh) * 2025-08-11 2026-02-24 上海熙邦新材料有限公司 一种光纤阵列用环氧树脂及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012177013A (ja) 2011-02-25 2012-09-13 Adeka Corp エポキシ樹脂組成物及び絶縁接着剤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001346A (ja) 2008-06-19 2010-01-07 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及び硬化物
DE102009026548A1 (de) 2009-05-28 2011-03-24 Henkel Ag & Co. Kgaa Klebefolie oder Klebeband auf Basis von Epoxiden
JP2015168687A (ja) * 2014-03-04 2015-09-28 京セラケミカル株式会社 コイル含浸用樹脂組成物及びコイル装置
JP2018119032A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6929069B2 (ja) 2017-01-23 2021-09-01 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2019116556A (ja) 2017-12-27 2019-07-18 京セラ株式会社 エポキシ樹脂組成物およびリフレクター
JP2020033514A (ja) 2018-08-31 2020-03-05 京セラ株式会社 エポキシ樹脂組成物および半導体装置
TWI698484B (zh) 2018-10-12 2020-07-11 台燿科技股份有限公司 無溶劑之樹脂組合物及其應用
JP7388160B2 (ja) 2019-12-03 2023-11-29 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012177013A (ja) 2011-02-25 2012-09-13 Adeka Corp エポキシ樹脂組成物及び絶縁接着剤

Also Published As

Publication number Publication date
JP7758162B2 (ja) 2025-10-22
WO2023182492A1 (ja) 2023-09-28
TW202406969A (zh) 2024-02-16
JPWO2023182492A1 (https=) 2023-09-28
CN118715283A (zh) 2024-09-27

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241023

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application