TW202406969A - 硬化性組成物 - Google Patents

硬化性組成物 Download PDF

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Publication number
TW202406969A
TW202406969A TW112111072A TW112111072A TW202406969A TW 202406969 A TW202406969 A TW 202406969A TW 112111072 A TW112111072 A TW 112111072A TW 112111072 A TW112111072 A TW 112111072A TW 202406969 A TW202406969 A TW 202406969A
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TW
Taiwan
Prior art keywords
curable composition
mass
component
group
manufactured
Prior art date
Application number
TW112111072A
Other languages
English (en)
Chinese (zh)
Inventor
輝
冨永大雅
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202406969A publication Critical patent/TW202406969A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW112111072A 2022-03-24 2023-03-24 硬化性組成物 TW202406969A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-048354 2022-03-24
JP2022048354 2022-03-24

Publications (1)

Publication Number Publication Date
TW202406969A true TW202406969A (zh) 2024-02-16

Family

ID=88101660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111072A TW202406969A (zh) 2022-03-24 2023-03-24 硬化性組成物

Country Status (5)

Country Link
JP (1) JP7758162B2 (https=)
KR (1) KR20240162150A (https=)
CN (1) CN118715283A (https=)
TW (1) TW202406969A (https=)
WO (1) WO2023182492A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025119211A (ja) * 2024-02-01 2025-08-14 味の素株式会社 樹脂組成物
CN120795552B (zh) * 2025-08-11 2026-02-24 上海熙邦新材料有限公司 一种光纤阵列用环氧树脂及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001346A (ja) 2008-06-19 2010-01-07 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及び硬化物
DE102009026548A1 (de) 2009-05-28 2011-03-24 Henkel Ag & Co. Kgaa Klebefolie oder Klebeband auf Basis von Epoxiden
JP5603803B2 (ja) 2011-02-25 2014-10-08 株式会社Ａｄｅｋａ エポキシ樹脂組成物及び絶縁接着剤
JP2015168687A (ja) * 2014-03-04 2015-09-28 京セラケミカル株式会社 コイル含浸用樹脂組成物及びコイル装置
JP2018119032A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6929069B2 (ja) 2017-01-23 2021-09-01 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2019116556A (ja) 2017-12-27 2019-07-18 京セラ株式会社 エポキシ樹脂組成物およびリフレクター
JP2020033514A (ja) 2018-08-31 2020-03-05 京セラ株式会社 エポキシ樹脂組成物および半導体装置
TWI698484B (zh) 2018-10-12 2020-07-11 台燿科技股份有限公司 無溶劑之樹脂組合物及其應用
JP7388160B2 (ja) 2019-12-03 2023-11-29 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Also Published As

Publication number Publication date
KR20240162150A (ko) 2024-11-14
JP7758162B2 (ja) 2025-10-22
WO2023182492A1 (ja) 2023-09-28
JPWO2023182492A1 (https=) 2023-09-28
CN118715283A (zh) 2024-09-27

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