JP7758162B2 - 硬化性組成物 - Google Patents

硬化性組成物

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Publication number
JP7758162B2
JP7758162B2 JP2024509256A JP2024509256A JP7758162B2 JP 7758162 B2 JP7758162 B2 JP 7758162B2 JP 2024509256 A JP2024509256 A JP 2024509256A JP 2024509256 A JP2024509256 A JP 2024509256A JP 7758162 B2 JP7758162 B2 JP 7758162B2
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JP
Japan
Prior art keywords
curable composition
component
composition according
group
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2024509256A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023182492A1 (https=
JPWO2023182492A5 (https=
Inventor
直輝 名取
大雅 冨永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
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Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of JPWO2023182492A1 publication Critical patent/JPWO2023182492A1/ja
Publication of JPWO2023182492A5 publication Critical patent/JPWO2023182492A5/ja
Application granted granted Critical
Publication of JP7758162B2 publication Critical patent/JP7758162B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2024509256A 2022-03-24 2023-03-24 硬化性組成物 Active JP7758162B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022048354 2022-03-24
JP2022048354 2022-03-24
PCT/JP2023/011801 WO2023182492A1 (ja) 2022-03-24 2023-03-24 硬化性組成物

Publications (3)

Publication Number Publication Date
JPWO2023182492A1 JPWO2023182492A1 (https=) 2023-09-28
JPWO2023182492A5 JPWO2023182492A5 (https=) 2024-10-09
JP7758162B2 true JP7758162B2 (ja) 2025-10-22

Family

ID=88101660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509256A Active JP7758162B2 (ja) 2022-03-24 2023-03-24 硬化性組成物

Country Status (5)

Country Link
JP (1) JP7758162B2 (https=)
KR (1) KR20240162150A (https=)
CN (1) CN118715283A (https=)
TW (1) TW202406969A (https=)
WO (1) WO2023182492A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025119211A (ja) * 2024-02-01 2025-08-14 味の素株式会社 樹脂組成物
CN120795552B (zh) * 2025-08-11 2026-02-24 上海熙邦新材料有限公司 一种光纤阵列用环氧树脂及其制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001346A (ja) 2008-06-19 2010-01-07 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及び硬化物
JP2012528205A (ja) 2009-05-28 2012-11-12 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン エポキシドに基づく接着フィルムまたは接着テープ
JP2015168687A (ja) 2014-03-04 2015-09-28 京セラケミカル株式会社 コイル含浸用樹脂組成物及びコイル装置
JP2018119031A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2018119032A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2019116556A (ja) 2017-12-27 2019-07-18 京セラ株式会社 エポキシ樹脂組成物およびリフレクター
JP2020033514A (ja) 2018-08-31 2020-03-05 京セラ株式会社 エポキシ樹脂組成物および半導体装置
US20200115572A1 (en) 2018-10-12 2020-04-16 Taiwan Union Technology Corporation Solvent-free resin composition and uses of the same
JP2021088635A (ja) 2019-12-03 2021-06-10 昭和電工マテリアルズ株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5603803B2 (ja) 2011-02-25 2014-10-08 株式会社Ａｄｅｋａ エポキシ樹脂組成物及び絶縁接着剤

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001346A (ja) 2008-06-19 2010-01-07 Hitachi Chem Co Ltd 熱硬化性樹脂組成物及び硬化物
JP2012528205A (ja) 2009-05-28 2012-11-12 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン エポキシドに基づく接着フィルムまたは接着テープ
JP2015168687A (ja) 2014-03-04 2015-09-28 京セラケミカル株式会社 コイル含浸用樹脂組成物及びコイル装置
JP2018119031A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2018119032A (ja) 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2019116556A (ja) 2017-12-27 2019-07-18 京セラ株式会社 エポキシ樹脂組成物およびリフレクター
JP2020033514A (ja) 2018-08-31 2020-03-05 京セラ株式会社 エポキシ樹脂組成物および半導体装置
US20200115572A1 (en) 2018-10-12 2020-04-16 Taiwan Union Technology Corporation Solvent-free resin composition and uses of the same
JP2021088635A (ja) 2019-12-03 2021-06-10 昭和電工マテリアルズ株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Also Published As

Publication number Publication date
KR20240162150A (ko) 2024-11-14
WO2023182492A1 (ja) 2023-09-28
TW202406969A (zh) 2024-02-16
JPWO2023182492A1 (https=) 2023-09-28
CN118715283A (zh) 2024-09-27

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