CN118414891A - 带加强件的布线基板 - Google Patents

带加强件的布线基板 Download PDF

Info

Publication number
CN118414891A
CN118414891A CN202280084771.6A CN202280084771A CN118414891A CN 118414891 A CN118414891 A CN 118414891A CN 202280084771 A CN202280084771 A CN 202280084771A CN 118414891 A CN118414891 A CN 118414891A
Authority
CN
China
Prior art keywords
stiffener
thermal expansion
wiring substrate
layer
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202280084771.6A
Other languages
English (en)
Chinese (zh)
Inventor
门胁杰
鬼丸祥平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118414891A publication Critical patent/CN118414891A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10462—Flat component oriented parallel to the PCB surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
CN202280084771.6A 2021-12-28 2022-12-23 带加强件的布线基板 Withdrawn CN118414891A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021214992 2021-12-28
JP2021-214992 2021-12-28
PCT/JP2022/047631 WO2023127725A1 (ja) 2021-12-28 2022-12-23 スティフナ付き配線基板

Publications (1)

Publication Number Publication Date
CN118414891A true CN118414891A (zh) 2024-07-30

Family

ID=86999232

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280084771.6A Withdrawn CN118414891A (zh) 2021-12-28 2022-12-23 带加强件的布线基板

Country Status (6)

Country Link
US (1) US20250106984A1 (https=)
JP (1) JP7784446B2 (https=)
KR (1) KR20240108500A (https=)
CN (1) CN118414891A (https=)
TW (1) TWI854415B (https=)
WO (1) WO2023127725A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243527A1 (ja) * 2024-05-24 2025-11-27 株式会社レゾナック 半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367554B2 (ja) * 1999-10-13 2003-01-14 日本電気株式会社 フリップチップパッケージ
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
JP2004356569A (ja) * 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP4885425B2 (ja) 2004-01-28 2012-02-29 京セラ株式会社 半導体素子収納パッケージ
JP4599891B2 (ja) 2004-05-28 2010-12-15 凸版印刷株式会社 半導体装置用基板並びに半導体装置
WO2006087769A1 (ja) * 2005-02-15 2006-08-24 Fujitsu Limited パッケージ実装モジュールおよびパッケージ基板モジュール
JP5284235B2 (ja) * 2008-09-29 2013-09-11 日本特殊陶業株式会社 半導体パッケージ
JP5350829B2 (ja) 2009-02-16 2013-11-27 日本特殊陶業株式会社 補強材付き配線基板の製造方法、補強材付き配線基板用の配線基板
JP5132801B1 (ja) * 2011-07-14 2013-01-30 株式会社東芝 テレビジョン受像機、及び電子機器
US10636746B2 (en) * 2018-02-26 2020-04-28 International Business Machines Corporation Method of forming an electronic package
MY209993A (en) 2019-02-04 2025-08-19 Sony Interactive Entertainment Inc Electronic apparatus, semiconductor device, insulating sheet, and method for manufacturing semiconductor device
JP7351107B2 (ja) 2019-06-06 2023-09-27 凸版印刷株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
TW202335541A (zh) 2023-09-01
US20250106984A1 (en) 2025-03-27
JP7784446B2 (ja) 2025-12-11
WO2023127725A1 (ja) 2023-07-06
TWI854415B (zh) 2024-09-01
JPWO2023127725A1 (https=) 2023-07-06
KR20240108500A (ko) 2024-07-09

Similar Documents

Publication Publication Date Title
JP5079475B2 (ja) 電子部品実装用パッケージ
KR102088692B1 (ko) 신뢰성 있는 표면 실장 집적 전력 모듈
US7923302B2 (en) Method for manufacturing a semiconductor package
US9048229B2 (en) Printed wiring board
JP6639934B2 (ja) 配線基板、半導体装置及び配線基板の製造方法
WO2006054637A1 (ja) 配線基板とその製造方法および半導体装置
JP3813540B2 (ja) 半導体装置の製造方法及び半導体装置及び半導体装置ユニット
JP7784446B2 (ja) スティフナ付き配線基板
US10314166B2 (en) Printed wiring board
WO2004030096A2 (en) Crack resistant interconnect module
JP4027788B2 (ja) 電子部品実装構造の製造方法
JP5284125B2 (ja) 半導体装置およびその製造方法
JP2003229509A (ja) 多層プリント配線板
JP2008251601A (ja) 半導体装置及びその実装構造
US12621928B2 (en) Wiring board
TWI866092B (zh) 配線基板及安裝構造體
US20250016912A1 (en) Wiring board
TW202534895A (zh) 安裝構造體
TW202543072A (zh) 配線基板及半導體裝置
JP2006339175A (ja) 積層型半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20240730