JPWO2023127725A1 - - Google Patents

Info

Publication number
JPWO2023127725A1
JPWO2023127725A1 JP2023570960A JP2023570960A JPWO2023127725A1 JP WO2023127725 A1 JPWO2023127725 A1 JP WO2023127725A1 JP 2023570960 A JP2023570960 A JP 2023570960A JP 2023570960 A JP2023570960 A JP 2023570960A JP WO2023127725 A1 JPWO2023127725 A1 JP WO2023127725A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023570960A
Other languages
Japanese (ja)
Other versions
JP7784446B2 (ja
JPWO2023127725A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023127725A1 publication Critical patent/JPWO2023127725A1/ja
Publication of JPWO2023127725A5 publication Critical patent/JPWO2023127725A5/ja
Application granted granted Critical
Publication of JP7784446B2 publication Critical patent/JP7784446B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10462—Flat component oriented parallel to the PCB surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2023570960A 2021-12-28 2022-12-23 スティフナ付き配線基板 Active JP7784446B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021214992 2021-12-28
JP2021214992 2021-12-28
PCT/JP2022/047631 WO2023127725A1 (ja) 2021-12-28 2022-12-23 スティフナ付き配線基板

Publications (3)

Publication Number Publication Date
JPWO2023127725A1 true JPWO2023127725A1 (https=) 2023-07-06
JPWO2023127725A5 JPWO2023127725A5 (https=) 2024-09-03
JP7784446B2 JP7784446B2 (ja) 2025-12-11

Family

ID=86999232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570960A Active JP7784446B2 (ja) 2021-12-28 2022-12-23 スティフナ付き配線基板

Country Status (6)

Country Link
US (1) US20250106984A1 (https=)
JP (1) JP7784446B2 (https=)
KR (1) KR20240108500A (https=)
CN (1) CN118414891A (https=)
TW (1) TWI854415B (https=)
WO (1) WO2023127725A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243527A1 (ja) * 2024-05-24 2025-11-27 株式会社レゾナック 半導体装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110926A (ja) * 1999-10-13 2001-04-20 Nec Corp フリップチップパッケージ
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
JP2005217003A (ja) * 2004-01-28 2005-08-11 Kyocera Corp 半導体素子収納用パッケージ
JP2005340596A (ja) * 2004-05-28 2005-12-08 Toppan Printing Co Ltd 複合スティフナー及びそれを取り付けた半導体装置用基板並びに半導体装置
WO2006087769A1 (ja) * 2005-02-15 2006-08-24 Fujitsu Limited パッケージ実装モジュールおよびパッケージ基板モジュール
JP2013026633A (ja) * 2011-07-14 2013-02-04 Toshiba Corp テレビジョン受像機、及び電子機器
US20200013732A1 (en) * 2018-02-26 2020-01-09 International Business Machines Corporation Laminated stiffener to control the warpage of electronic chip carriers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356569A (ja) * 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP5284235B2 (ja) * 2008-09-29 2013-09-11 日本特殊陶業株式会社 半導体パッケージ
JP5350829B2 (ja) 2009-02-16 2013-11-27 日本特殊陶業株式会社 補強材付き配線基板の製造方法、補強材付き配線基板用の配線基板
MY209993A (en) 2019-02-04 2025-08-19 Sony Interactive Entertainment Inc Electronic apparatus, semiconductor device, insulating sheet, and method for manufacturing semiconductor device
JP7351107B2 (ja) 2019-06-06 2023-09-27 凸版印刷株式会社 配線基板及び配線基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110926A (ja) * 1999-10-13 2001-04-20 Nec Corp フリップチップパッケージ
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
JP2005217003A (ja) * 2004-01-28 2005-08-11 Kyocera Corp 半導体素子収納用パッケージ
JP2005340596A (ja) * 2004-05-28 2005-12-08 Toppan Printing Co Ltd 複合スティフナー及びそれを取り付けた半導体装置用基板並びに半導体装置
WO2006087769A1 (ja) * 2005-02-15 2006-08-24 Fujitsu Limited パッケージ実装モジュールおよびパッケージ基板モジュール
JP2013026633A (ja) * 2011-07-14 2013-02-04 Toshiba Corp テレビジョン受像機、及び電子機器
US20200013732A1 (en) * 2018-02-26 2020-01-09 International Business Machines Corporation Laminated stiffener to control the warpage of electronic chip carriers

Also Published As

Publication number Publication date
TW202335541A (zh) 2023-09-01
US20250106984A1 (en) 2025-03-27
JP7784446B2 (ja) 2025-12-11
WO2023127725A1 (ja) 2023-07-06
CN118414891A (zh) 2024-07-30
TWI854415B (zh) 2024-09-01
KR20240108500A (ko) 2024-07-09

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112023009656A2 (https=)
BR112021017747A2 (https=)
JPWO2023127725A1 (https=)
BR112023011738A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR112023016292A2 (https=)
BR112023011610A2 (https=)
BR112023011539A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)
BR102021016375A2 (https=)
BR102021016200A2 (https=)
BR102021016176A2 (https=)
BR102021015566A2 (https=)
BR102021015450A8 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240618

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240618

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250507

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20250521

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250701

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251104

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251201

R150 Certificate of patent or registration of utility model

Ref document number: 7784446

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150