JP7784446B2 - スティフナ付き配線基板 - Google Patents

スティフナ付き配線基板

Info

Publication number
JP7784446B2
JP7784446B2 JP2023570960A JP2023570960A JP7784446B2 JP 7784446 B2 JP7784446 B2 JP 7784446B2 JP 2023570960 A JP2023570960 A JP 2023570960A JP 2023570960 A JP2023570960 A JP 2023570960A JP 7784446 B2 JP7784446 B2 JP 7784446B2
Authority
JP
Japan
Prior art keywords
stiffener
wiring board
thermal expansion
layer
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023570960A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023127725A5 (https=
JPWO2023127725A1 (https=
Inventor
傑 門脇
祥平 鬼丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023127725A1 publication Critical patent/JPWO2023127725A1/ja
Publication of JPWO2023127725A5 publication Critical patent/JPWO2023127725A5/ja
Application granted granted Critical
Publication of JP7784446B2 publication Critical patent/JP7784446B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10462—Flat component oriented parallel to the PCB surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2023570960A 2021-12-28 2022-12-23 スティフナ付き配線基板 Active JP7784446B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021214992 2021-12-28
JP2021214992 2021-12-28
PCT/JP2022/047631 WO2023127725A1 (ja) 2021-12-28 2022-12-23 スティフナ付き配線基板

Publications (3)

Publication Number Publication Date
JPWO2023127725A1 JPWO2023127725A1 (https=) 2023-07-06
JPWO2023127725A5 JPWO2023127725A5 (https=) 2024-09-03
JP7784446B2 true JP7784446B2 (ja) 2025-12-11

Family

ID=86999232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570960A Active JP7784446B2 (ja) 2021-12-28 2022-12-23 スティフナ付き配線基板

Country Status (6)

Country Link
US (1) US20250106984A1 (https=)
JP (1) JP7784446B2 (https=)
KR (1) KR20240108500A (https=)
CN (1) CN118414891A (https=)
TW (1) TWI854415B (https=)
WO (1) WO2023127725A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243527A1 (ja) * 2024-05-24 2025-11-27 株式会社レゾナック 半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110926A (ja) 1999-10-13 2001-04-20 Nec Corp フリップチップパッケージ
JP2005217003A (ja) 2004-01-28 2005-08-11 Kyocera Corp 半導体素子収納用パッケージ
JP2005340596A (ja) 2004-05-28 2005-12-08 Toppan Printing Co Ltd 複合スティフナー及びそれを取り付けた半導体装置用基板並びに半導体装置
WO2006087769A1 (ja) 2005-02-15 2006-08-24 Fujitsu Limited パッケージ実装モジュールおよびパッケージ基板モジュール
JP2010192545A (ja) 2009-02-16 2010-09-02 Ngk Spark Plug Co Ltd 補強材付き配線基板の製造方法、補強材付き配線基板用の配線基板
JP2013026633A (ja) 2011-07-14 2013-02-04 Toshiba Corp テレビジョン受像機、及び電子機器
US20200013732A1 (en) 2018-02-26 2020-01-09 International Business Machines Corporation Laminated stiffener to control the warpage of electronic chip carriers
JP2020202218A (ja) 2019-06-06 2020-12-17 凸版印刷株式会社 配線基板及び配線基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
JP2004356569A (ja) * 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP5284235B2 (ja) * 2008-09-29 2013-09-11 日本特殊陶業株式会社 半導体パッケージ
MY209993A (en) 2019-02-04 2025-08-19 Sony Interactive Entertainment Inc Electronic apparatus, semiconductor device, insulating sheet, and method for manufacturing semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110926A (ja) 1999-10-13 2001-04-20 Nec Corp フリップチップパッケージ
JP2005217003A (ja) 2004-01-28 2005-08-11 Kyocera Corp 半導体素子収納用パッケージ
JP2005340596A (ja) 2004-05-28 2005-12-08 Toppan Printing Co Ltd 複合スティフナー及びそれを取り付けた半導体装置用基板並びに半導体装置
WO2006087769A1 (ja) 2005-02-15 2006-08-24 Fujitsu Limited パッケージ実装モジュールおよびパッケージ基板モジュール
JP2010192545A (ja) 2009-02-16 2010-09-02 Ngk Spark Plug Co Ltd 補強材付き配線基板の製造方法、補強材付き配線基板用の配線基板
JP2013026633A (ja) 2011-07-14 2013-02-04 Toshiba Corp テレビジョン受像機、及び電子機器
US20200013732A1 (en) 2018-02-26 2020-01-09 International Business Machines Corporation Laminated stiffener to control the warpage of electronic chip carriers
JP2020202218A (ja) 2019-06-06 2020-12-17 凸版印刷株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
TW202335541A (zh) 2023-09-01
US20250106984A1 (en) 2025-03-27
WO2023127725A1 (ja) 2023-07-06
CN118414891A (zh) 2024-07-30
TWI854415B (zh) 2024-09-01
JPWO2023127725A1 (https=) 2023-07-06
KR20240108500A (ko) 2024-07-09

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