TWI854415B - 附有防撓材的配線基板及電子零件安裝構造體 - Google Patents

附有防撓材的配線基板及電子零件安裝構造體 Download PDF

Info

Publication number
TWI854415B
TWI854415B TW111150174A TW111150174A TWI854415B TW I854415 B TWI854415 B TW I854415B TW 111150174 A TW111150174 A TW 111150174A TW 111150174 A TW111150174 A TW 111150174A TW I854415 B TWI854415 B TW I854415B
Authority
TW
Taiwan
Prior art keywords
wiring substrate
thermal expansion
expansion coefficient
layer
area
Prior art date
Application number
TW111150174A
Other languages
English (en)
Chinese (zh)
Other versions
TW202335541A (zh
Inventor
門脇傑
鬼丸祥平
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202335541A publication Critical patent/TW202335541A/zh
Application granted granted Critical
Publication of TWI854415B publication Critical patent/TWI854415B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10462—Flat component oriented parallel to the PCB surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
TW111150174A 2021-12-28 2022-12-27 附有防撓材的配線基板及電子零件安裝構造體 TWI854415B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021214992 2021-12-28
JP2021-214992 2021-12-28

Publications (2)

Publication Number Publication Date
TW202335541A TW202335541A (zh) 2023-09-01
TWI854415B true TWI854415B (zh) 2024-09-01

Family

ID=86999232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111150174A TWI854415B (zh) 2021-12-28 2022-12-27 附有防撓材的配線基板及電子零件安裝構造體

Country Status (6)

Country Link
US (1) US20250106984A1 (https=)
JP (1) JP7784446B2 (https=)
KR (1) KR20240108500A (https=)
CN (1) CN118414891A (https=)
TW (1) TWI854415B (https=)
WO (1) WO2023127725A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243527A1 (ja) * 2024-05-24 2025-11-27 株式会社レゾナック 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217003A (ja) * 2004-01-28 2005-08-11 Kyocera Corp 半導体素子収納用パッケージ
TW201021636A (en) * 2008-09-29 2010-06-01 Ngk Spark Plug Co Wiring substrate with reinforcement
US20190267332A1 (en) * 2018-02-26 2019-08-29 International Business Machines Corporation Laminated stiffener to control the warpage of electronic chip carriers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367554B2 (ja) * 1999-10-13 2003-01-14 日本電気株式会社 フリップチップパッケージ
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
JP2004356569A (ja) * 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
JP4599891B2 (ja) 2004-05-28 2010-12-15 凸版印刷株式会社 半導体装置用基板並びに半導体装置
WO2006087769A1 (ja) * 2005-02-15 2006-08-24 Fujitsu Limited パッケージ実装モジュールおよびパッケージ基板モジュール
JP5350829B2 (ja) 2009-02-16 2013-11-27 日本特殊陶業株式会社 補強材付き配線基板の製造方法、補強材付き配線基板用の配線基板
JP5132801B1 (ja) * 2011-07-14 2013-01-30 株式会社東芝 テレビジョン受像機、及び電子機器
MY209993A (en) 2019-02-04 2025-08-19 Sony Interactive Entertainment Inc Electronic apparatus, semiconductor device, insulating sheet, and method for manufacturing semiconductor device
JP7351107B2 (ja) 2019-06-06 2023-09-27 凸版印刷株式会社 配線基板及び配線基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217003A (ja) * 2004-01-28 2005-08-11 Kyocera Corp 半導体素子収納用パッケージ
TW201021636A (en) * 2008-09-29 2010-06-01 Ngk Spark Plug Co Wiring substrate with reinforcement
US20190267332A1 (en) * 2018-02-26 2019-08-29 International Business Machines Corporation Laminated stiffener to control the warpage of electronic chip carriers

Also Published As

Publication number Publication date
TW202335541A (zh) 2023-09-01
US20250106984A1 (en) 2025-03-27
JP7784446B2 (ja) 2025-12-11
WO2023127725A1 (ja) 2023-07-06
CN118414891A (zh) 2024-07-30
JPWO2023127725A1 (https=) 2023-07-06
KR20240108500A (ko) 2024-07-09

Similar Documents

Publication Publication Date Title
US7923302B2 (en) Method for manufacturing a semiconductor package
TWI854415B (zh) 附有防撓材的配線基板及電子零件安裝構造體
CN101552254B (zh) 多层布线基板、半导体封装以及制造半导体封装的方法
US8119923B2 (en) Circuit board
JP2011077492A (ja) パッケージ基板
US10314166B2 (en) Printed wiring board
JP2022118605A (ja) 半導体装置および基板
KR101067223B1 (ko) 패키지 기판
US11974398B2 (en) Electronic device
JPWO2023127725A5 (https=)
TWI876237B (zh) 配線基板
TWI866092B (zh) 配線基板及安裝構造體
JP2008251601A (ja) 半導体装置及びその実装構造
US12621928B2 (en) Wiring board
KR101097544B1 (ko) 반도체 패키지 및 그 제조방법
TWI837804B (zh) 電子零件內藏基板
KR101158237B1 (ko) 인쇄 회로 기판
JP2007109933A (ja) プリント配線板及びこれを用いた半導体の実装方法
US20250311101A1 (en) Wiring substrate
TW202534895A (zh) 安裝構造體
TW202543072A (zh) 配線基板及半導體裝置
TW202531519A (zh) 複合配線基板及半導體裝置
TW202547236A (zh) 配線基板
KR20110008476A (ko) 반도체 패키지용 인쇄회로기판 및 이를 갖는 반도체 패키지
KR20070006291A (ko) 편중된 코어층을 갖는 배선 기판 및 이를 이용한 반도체소자