CN1182761C - 印刷电路板及其制造方法 - Google Patents
印刷电路板及其制造方法 Download PDFInfo
- Publication number
- CN1182761C CN1182761C CNB011168668A CN01116866A CN1182761C CN 1182761 C CN1182761 C CN 1182761C CN B011168668 A CNB011168668 A CN B011168668A CN 01116866 A CN01116866 A CN 01116866A CN 1182761 C CN1182761 C CN 1182761C
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- China
- Prior art keywords
- substrate
- weld zone
- projection
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 claims abstract description 252
- 239000011162 core material Substances 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 69
- 239000011248 coating agent Substances 0.000 claims description 59
- 238000000576 coating method Methods 0.000 claims description 59
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- 238000003466 welding Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
本发明 | 常规情况 | |||
软衬底 | 布线图形 | 图形宽度(μm) | 25 | 50 |
图形间距(μm) | 25 | 50 | ||
内层连接 | 焊接区直径(μm) | 70 | 500 | |
凸起直径(μm) | 35 | 200 | ||
绝缘层 | 材料 | 聚酰亚胺 | 聚酰亚胺 | |
厚度 | 30 | 60 | ||
硬衬底 | 布线图形 | 图形宽度(μm) | 50 | 100 |
图形间距(μm) | 50 | 100 | ||
内层连接 | 焊接区直径(μm) | 200 | 300 | |
凸起直径(μm) | 150 | 150 | ||
绝缘层 | 材料 | 玻璃纤维环氧树脂 | 玻璃纤维环氧树脂 | |
厚度 | 100 | 130 |
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000065775A JP4444435B2 (ja) | 2000-03-06 | 2000-03-06 | プリント配線基板及びプリント配線基板の製造方法 |
JP65775/2000 | 2000-03-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1325262A CN1325262A (zh) | 2001-12-05 |
CN1182761C true CN1182761C (zh) | 2004-12-29 |
Family
ID=18585246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011168668A Expired - Fee Related CN1182761C (zh) | 2000-03-06 | 2001-03-06 | 印刷电路板及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6570098B2 (zh) |
JP (1) | JP4444435B2 (zh) |
KR (1) | KR100691662B1 (zh) |
CN (1) | CN1182761C (zh) |
TW (1) | TW510155B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101400218B (zh) * | 2007-09-28 | 2010-09-08 | 三星电机株式会社 | 印刷电路板的多个层的互连方法 |
CN101389186B (zh) * | 2007-09-14 | 2010-12-08 | 亿光电子工业股份有限公司 | Pcb软硬板结合装置 |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4444435B2 (ja) * | 2000-03-06 | 2010-03-31 | ソニーケミカル&インフォメーションデバイス株式会社 | プリント配線基板及びプリント配線基板の製造方法 |
US6864435B2 (en) * | 2001-04-25 | 2005-03-08 | Alien Technology Corporation | Electrical contacts for flexible displays |
US7140103B2 (en) * | 2001-06-29 | 2006-11-28 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of high-density printed wiring board |
JP4045143B2 (ja) * | 2002-02-18 | 2008-02-13 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | 配線膜間接続用部材の製造方法及び多層配線基板の製造方法 |
US20040040651A1 (en) * | 2002-08-28 | 2004-03-04 | Kuraray Co., Ltd. | Multi-layer circuit board and method of making the same |
CN100512604C (zh) * | 2002-11-27 | 2009-07-08 | 住友电木株式会社 | 电路板、多层布线板及其制造方法 |
JP2004266236A (ja) * | 2003-01-09 | 2004-09-24 | Sony Chem Corp | 基板素片とその基板素片を用いた複合配線板 |
JP2004266238A (ja) * | 2003-01-09 | 2004-09-24 | Sony Chem Corp | 複合配線板、基板素片 |
JP2004266074A (ja) * | 2003-02-28 | 2004-09-24 | Olympus Corp | 配線基板 |
CN1765161B (zh) * | 2003-04-18 | 2011-06-22 | 揖斐电株式会社 | 刚挠性电路板 |
TW579665B (en) * | 2003-04-23 | 2004-03-11 | Via Tech Inc | Vertical routing structure |
CN100468706C (zh) * | 2003-12-04 | 2009-03-11 | 松下电器产业株式会社 | 电路基板及其制造方法、半导体封装及部件内置模块 |
US7565738B2 (en) * | 2004-05-31 | 2009-07-28 | Sanyo Electric Co., Ltd. | Method for manufacturing circuit device |
JP4305399B2 (ja) * | 2004-06-10 | 2009-07-29 | 住友電気工業株式会社 | 多層プリント配線板の製造方法及び多層プリント配線板 |
JP4536430B2 (ja) | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
CN1806474A (zh) * | 2004-06-11 | 2006-07-19 | 揖斐电株式会社 | 刚挠性电路板及其制造方法 |
US7653973B2 (en) * | 2004-06-28 | 2010-02-02 | Tdk Corporation | Production method of multilayer electronic device |
JP2006210766A (ja) * | 2005-01-31 | 2006-08-10 | Sumitomo Electric Ind Ltd | 多層プリント配線板の製造方法及び多層プリント配線板 |
US20060272850A1 (en) * | 2005-06-06 | 2006-12-07 | Matsushita Electric Industrial Co., Ltd. | Interlayer connection conductor and manufacturing method thereof |
FI121134B (fi) * | 2005-06-16 | 2010-07-15 | Imbera Electronics Oy | Menetelmä piirilevyrakenteen valmistamiseksi ja piirilevyrakenne |
US7957151B2 (en) * | 2005-12-01 | 2011-06-07 | Sharp Kabushiki Kaisha | Circuit component, electrode connection structure and display device including the same |
TWI272887B (en) * | 2005-12-09 | 2007-02-01 | High Tech Comp Corp | Printed circuit board and manufacturing method thereof |
TWI336608B (en) * | 2006-01-31 | 2011-01-21 | Sony Corp | Printed circuit board assembly and method of manufacturing the same |
JP4967467B2 (ja) * | 2006-06-12 | 2012-07-04 | 富士通株式会社 | フレキシブル配線基板接着方法および配線基板 |
TWI363414B (en) * | 2007-01-29 | 2012-05-01 | Touch Micro System Tech | Interposer for connecting a plurality of chips and method for manufacturing the same |
TWI337059B (en) * | 2007-06-22 | 2011-02-01 | Princo Corp | Multi-layer substrate and manufacture method thereof |
US8238114B2 (en) * | 2007-09-20 | 2012-08-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing same |
JP5245416B2 (ja) * | 2008-01-11 | 2013-07-24 | 富士通株式会社 | プリント配線板の作製方法 |
CN101990355B (zh) * | 2009-07-30 | 2013-02-20 | 欣兴电子股份有限公司 | 软硬线路板及其工艺 |
KR101088792B1 (ko) * | 2009-11-30 | 2011-12-01 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그 제조방법 |
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2000
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2001
- 2001-02-28 US US09/793,978 patent/US6570098B2/en not_active Expired - Lifetime
- 2001-03-05 KR KR1020010011247A patent/KR100691662B1/ko not_active IP Right Cessation
- 2001-03-05 TW TW090104997A patent/TW510155B/zh active
- 2001-03-06 CN CNB011168668A patent/CN1182761C/zh not_active Expired - Fee Related
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101389186B (zh) * | 2007-09-14 | 2010-12-08 | 亿光电子工业股份有限公司 | Pcb软硬板结合装置 |
CN101400218B (zh) * | 2007-09-28 | 2010-09-08 | 三星电机株式会社 | 印刷电路板的多个层的互连方法 |
Also Published As
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TW510155B (en) | 2002-11-11 |
CN1325262A (zh) | 2001-12-05 |
JP2001251053A (ja) | 2001-09-14 |
JP4444435B2 (ja) | 2010-03-31 |
US20010040794A1 (en) | 2001-11-15 |
KR20010087338A (ko) | 2001-09-15 |
US20030116345A1 (en) | 2003-06-26 |
US6570098B2 (en) | 2003-05-27 |
US6941648B2 (en) | 2005-09-13 |
KR100691662B1 (ko) | 2007-03-09 |
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