CN118251763A - 电子元件安装用基板、电子装置以及电子模块 - Google Patents

电子元件安装用基板、电子装置以及电子模块 Download PDF

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Publication number
CN118251763A
CN118251763A CN202280071217.4A CN202280071217A CN118251763A CN 118251763 A CN118251763 A CN 118251763A CN 202280071217 A CN202280071217 A CN 202280071217A CN 118251763 A CN118251763 A CN 118251763A
Authority
CN
China
Prior art keywords
component mounting
base
electronic
electronic component
mounting region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280071217.4A
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English (en)
Chinese (zh)
Inventor
铃木雄己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118251763A publication Critical patent/CN118251763A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
CN202280071217.4A 2021-10-25 2022-10-11 电子元件安装用基板、电子装置以及电子模块 Pending CN118251763A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021174038 2021-10-25
JP2021-174038 2021-10-25
PCT/JP2022/037801 WO2023074342A1 (ja) 2021-10-25 2022-10-11 電子素子実装用基板、電子装置、および電子モジュール

Publications (1)

Publication Number Publication Date
CN118251763A true CN118251763A (zh) 2024-06-25

Family

ID=86159291

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280071217.4A Pending CN118251763A (zh) 2021-10-25 2022-10-11 电子元件安装用基板、电子装置以及电子模块

Country Status (4)

Country Link
EP (1) EP4425546A1 (https=)
JP (1) JP7753380B2 (https=)
CN (1) CN118251763A (https=)
WO (1) WO2023074342A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025099093A (ja) * 2023-12-21 2025-07-03 Hoya株式会社 光源装置、電子内視鏡システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344008A (ja) * 2001-05-17 2002-11-29 Fuji Xerox Co Ltd 光素子モジュール
JP2005101366A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 高周波モジュール
JP6034158B2 (ja) * 2012-11-29 2016-11-30 京セラ株式会社 配線基板およびそれを用いた実装構造体
US9496247B2 (en) * 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
JP2017198950A (ja) * 2016-04-28 2017-11-02 ＡＰＲＥＳＩＡ Ｓｙｓｔｅｍｓ株式会社 光通信モジュール
EP3499559B1 (en) * 2016-08-10 2023-11-22 Kyocera Corporation Package for mounting electrical element, array package and electrical device
JP2020155622A (ja) 2019-03-20 2020-09-24 富士ゼロックス株式会社 発光装置、光学装置および情報処理装置
JP7411350B2 (ja) * 2019-08-20 2024-01-11 ソニーセミコンダクタソリューションズ株式会社 測距装置、電子機器、および、測距装置の製造方法
JP7432387B2 (ja) * 2020-02-18 2024-02-16 株式会社Lixil 給水装置

Also Published As

Publication number Publication date
JPWO2023074342A1 (https=) 2023-05-04
WO2023074342A1 (ja) 2023-05-04
EP4425546A1 (en) 2024-09-04
JP7753380B2 (ja) 2025-10-14

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