CN1179821C - 具有独立限位环和多区域压力控制结构的气动隔膜式抛光头及其使用方法 - Google Patents

具有独立限位环和多区域压力控制结构的气动隔膜式抛光头及其使用方法 Download PDF

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Publication number
CN1179821C
CN1179821C CNB018121713A CN01812171A CN1179821C CN 1179821 C CN1179821 C CN 1179821C CN B018121713 A CNB018121713 A CN B018121713A CN 01812171 A CN01812171 A CN 01812171A CN 1179821 C CN1179821 C CN 1179821C
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CN
China
Prior art keywords
support
pressure
diaphragm
substrate
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018121713A
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English (en)
Chinese (zh)
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CN1440321A (zh
Inventor
|原治郎
梶原治郎
德・S・莫洛尼
格拉尔德·S·莫洛尼
A・汉森
王惠明
德多・雷耶斯
戴维·A·汉森
亚历松德多·雷耶斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MULTI PLANAR TECHNOLOGIES Inc
Original Assignee
MULTI PLANAR TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,370 external-priority patent/US6506105B1/en
Priority claimed from US09/570,369 external-priority patent/US6558232B1/en
Application filed by MULTI PLANAR TECHNOLOGIES Inc filed Critical MULTI PLANAR TECHNOLOGIES Inc
Publication of CN1440321A publication Critical patent/CN1440321A/zh
Application granted granted Critical
Publication of CN1179821C publication Critical patent/CN1179821C/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNB018121713A 2000-05-12 2001-05-11 具有独立限位环和多区域压力控制结构的气动隔膜式抛光头及其使用方法 Expired - Fee Related CN1179821C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US20421200P 2000-05-12 2000-05-12
US09/570,369 2000-05-12
US09/570,370 2000-05-12
US09/570,370 US6506105B1 (en) 2000-05-12 2000-05-12 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US09/570,369 US6558232B1 (en) 2000-05-12 2000-05-12 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US60/204,212 2000-05-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100881994A Division CN100433269C (zh) 2000-05-12 2001-05-11 抛光装置以及与其一起使用的基片托架

Publications (2)

Publication Number Publication Date
CN1440321A CN1440321A (zh) 2003-09-03
CN1179821C true CN1179821C (zh) 2004-12-15

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2004100881994A Expired - Fee Related CN100433269C (zh) 2000-05-12 2001-05-11 抛光装置以及与其一起使用的基片托架
CNB018121713A Expired - Fee Related CN1179821C (zh) 2000-05-12 2001-05-11 具有独立限位环和多区域压力控制结构的气动隔膜式抛光头及其使用方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNB2004100881994A Expired - Fee Related CN100433269C (zh) 2000-05-12 2001-05-11 抛光装置以及与其一起使用的基片托架

Country Status (6)

Country Link
EP (1) EP1284840A2 (ja)
JP (1) JP2003533359A (ja)
KR (1) KR100811172B1 (ja)
CN (2) CN100433269C (ja)
AU (1) AU2001259745A1 (ja)
WO (1) WO2001087541A2 (ja)

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* Cited by examiner, † Cited by third party
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US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
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CN115431176B (zh) * 2022-11-08 2023-01-31 烟台环球机床装备股份有限公司 一种抛光机床用抛光压力调节装置
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Also Published As

Publication number Publication date
EP1284840A2 (en) 2003-02-26
KR100811172B1 (ko) 2008-03-10
CN1440321A (zh) 2003-09-03
AU2001259745A1 (en) 2001-11-26
KR20030010621A (ko) 2003-02-05
WO2001087541A3 (en) 2002-03-28
CN1638057A (zh) 2005-07-13
CN100433269C (zh) 2008-11-12
JP2003533359A (ja) 2003-11-11
WO2001087541A2 (en) 2001-11-22

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