CN117957270A - 喷射点胶用树脂组合物、电子部件用粘接剂、及其固化物、以及电子部件 - Google Patents

喷射点胶用树脂组合物、电子部件用粘接剂、及其固化物、以及电子部件 Download PDF

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Publication number
CN117957270A
CN117957270A CN202280060909.9A CN202280060909A CN117957270A CN 117957270 A CN117957270 A CN 117957270A CN 202280060909 A CN202280060909 A CN 202280060909A CN 117957270 A CN117957270 A CN 117957270A
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CN
China
Prior art keywords
resin composition
component
compound
dispensing
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280060909.9A
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English (en)
Chinese (zh)
Inventor
上地宏树
上杉阳平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN117957270A publication Critical patent/CN117957270A/zh
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/04Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00Compositions for adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202280060909.9A 2021-09-15 2022-08-18 喷射点胶用树脂组合物、电子部件用粘接剂、及其固化物、以及电子部件 Pending CN117957270A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-149896 2021-09-15
JP2021149896 2021-09-15
PCT/JP2022/031254 WO2023042599A1 (ja) 2021-09-15 2022-08-18 ジェットディスペンス用樹脂組成物、電子部品用接着剤、及びそれらの硬化物、並びに電子部品

Publications (1)

Publication Number Publication Date
CN117957270A true CN117957270A (zh) 2024-04-30

Family

ID=85602127

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280060909.9A Pending CN117957270A (zh) 2021-09-15 2022-08-18 喷射点胶用树脂组合物、电子部件用粘接剂、及其固化物、以及电子部件

Country Status (6)

Country Link
EP (1) EP4403595A4 (https=)
JP (1) JPWO2023042599A1 (https=)
KR (1) KR20240054978A (https=)
CN (1) CN117957270A (https=)
TW (1) TW202323393A (https=)
WO (1) WO2023042599A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311744B2 (ja) 2007-01-29 2013-10-09 地方独立行政法人 大阪市立工業研究所 紫外線硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
JP2010117545A (ja) 2008-11-13 2010-05-27 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその用途
JP6329030B2 (ja) * 2014-08-25 2018-05-23 ナミックス株式会社 接着剤
JP6716072B2 (ja) * 2015-07-31 2020-07-01 協立化学産業株式会社 樹脂組成物、及びそれを用いた積層体の製造方法
JP2019508549A (ja) * 2016-02-16 2019-03-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ結晶エポキシチオール(メタ)アクリレート複合材料およびナノ結晶エポキシチオール(メタクリレート)複合フィルム
JP6864436B2 (ja) 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
JP6810659B2 (ja) 2017-06-06 2021-01-06 日本化薬株式会社 電子部品用樹脂組成物
GB2575793A (en) * 2018-07-20 2020-01-29 Montanuniv Leoben Resin composition suitable for printing and printing methods
JP7135573B2 (ja) * 2018-08-16 2022-09-13 Jsr株式会社 化合物、感光性樹脂組成物、硬化性組成物、カラーフィルタの画素形成方法及びカラーフィルタ
JP7236671B2 (ja) * 2018-12-25 2023-03-10 パナソニックIpマネジメント株式会社 発光素子封止用組成物、及び発光装置
JP7298080B2 (ja) * 2019-03-29 2023-06-27 太陽ホールディングス株式会社 インクジェット印刷用硬化性組成物、硬化物及びプリント配線板

Also Published As

Publication number Publication date
JPWO2023042599A1 (https=) 2023-03-23
KR20240054978A (ko) 2024-04-26
EP4403595A1 (en) 2024-07-24
TW202323393A (zh) 2023-06-16
EP4403595A4 (en) 2025-08-20
WO2023042599A1 (ja) 2023-03-23

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