TW202323393A - 噴射點膠用樹脂組合物、電子部件用黏合劑及其固化物、電子部件 - Google Patents

噴射點膠用樹脂組合物、電子部件用黏合劑及其固化物、電子部件 Download PDF

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Publication number
TW202323393A
TW202323393A TW111132989A TW111132989A TW202323393A TW 202323393 A TW202323393 A TW 202323393A TW 111132989 A TW111132989 A TW 111132989A TW 111132989 A TW111132989 A TW 111132989A TW 202323393 A TW202323393 A TW 202323393A
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TW
Taiwan
Prior art keywords
resin composition
component
jet dispensing
compound
jet
Prior art date
Application number
TW111132989A
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English (en)
Chinese (zh)
Inventor
上地宏樹
上杉陽平
Original Assignee
日商納美仕有限公司
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Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202323393A publication Critical patent/TW202323393A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111132989A 2021-09-15 2022-08-31 噴射點膠用樹脂組合物、電子部件用黏合劑及其固化物、電子部件 TW202323393A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-149896 2021-09-15
JP2021149896 2021-09-15

Publications (1)

Publication Number Publication Date
TW202323393A true TW202323393A (zh) 2023-06-16

Family

ID=85602127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111132989A TW202323393A (zh) 2021-09-15 2022-08-31 噴射點膠用樹脂組合物、電子部件用黏合劑及其固化物、電子部件

Country Status (6)

Country Link
EP (1) EP4403595A4 (https=)
JP (1) JPWO2023042599A1 (https=)
KR (1) KR20240054978A (https=)
CN (1) CN117957270A (https=)
TW (1) TW202323393A (https=)
WO (1) WO2023042599A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311744B2 (ja) 2007-01-29 2013-10-09 地方独立行政法人 大阪市立工業研究所 紫外線硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
JP2010117545A (ja) 2008-11-13 2010-05-27 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその用途
JP6329030B2 (ja) * 2014-08-25 2018-05-23 ナミックス株式会社 接着剤
JP6716072B2 (ja) * 2015-07-31 2020-07-01 協立化学産業株式会社 樹脂組成物、及びそれを用いた積層体の製造方法
JP2019508549A (ja) * 2016-02-16 2019-03-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ結晶エポキシチオール（メタ）アクリレート複合材料およびナノ結晶エポキシチオール（メタクリレート）複合フィルム
JP6864436B2 (ja) 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
JP6810659B2 (ja) 2017-06-06 2021-01-06 日本化薬株式会社 電子部品用樹脂組成物
GB2575793A (en) * 2018-07-20 2020-01-29 Montanuniv Leoben Resin composition suitable for printing and printing methods
JP7135573B2 (ja) * 2018-08-16 2022-09-13 Jsr株式会社 化合物、感光性樹脂組成物、硬化性組成物、カラーフィルタの画素形成方法及びカラーフィルタ
JP7236671B2 (ja) * 2018-12-25 2023-03-10 パナソニックＩｐマネジメント株式会社 発光素子封止用組成物、及び発光装置
JP7298080B2 (ja) * 2019-03-29 2023-06-27 太陽ホールディングス株式会社 インクジェット印刷用硬化性組成物、硬化物及びプリント配線板

Also Published As

Publication number Publication date
JPWO2023042599A1 (https=) 2023-03-23
KR20240054978A (ko) 2024-04-26
EP4403595A1 (en) 2024-07-24
CN117957270A (zh) 2024-04-30
EP4403595A4 (en) 2025-08-20
WO2023042599A1 (ja) 2023-03-23

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