KR20240054978A - 제트 디스펜스용 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품 - Google Patents

제트 디스펜스용 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품 Download PDF

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Publication number
KR20240054978A
KR20240054978A KR1020247005789A KR20247005789A KR20240054978A KR 20240054978 A KR20240054978 A KR 20240054978A KR 1020247005789 A KR1020247005789 A KR 1020247005789A KR 20247005789 A KR20247005789 A KR 20247005789A KR 20240054978 A KR20240054978 A KR 20240054978A
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KR
South Korea
Prior art keywords
resin composition
jet dispensing
component
compound
jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247005789A
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English (en)
Korean (ko)
Inventor
히로키 우에치
요헤이 우에스기
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20240054978A publication Critical patent/KR20240054978A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020247005789A 2021-09-15 2022-08-18 제트 디스펜스용 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품 Pending KR20240054978A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-149896 2021-09-15
JP2021149896 2021-09-15
PCT/JP2022/031254 WO2023042599A1 (ja) 2021-09-15 2022-08-18 ジェットディスペンス用樹脂組成物、電子部品用接着剤、及びそれらの硬化物、並びに電子部品

Publications (1)

Publication Number Publication Date
KR20240054978A true KR20240054978A (ko) 2024-04-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005789A Pending KR20240054978A (ko) 2021-09-15 2022-08-18 제트 디스펜스용 수지 조성물, 전자 부품용 접착제와, 이들의 경화물, 및 전자 부품

Country Status (6)

Country Link
EP (1) EP4403595A4 (https=)
JP (1) JPWO2023042599A1 (https=)
KR (1) KR20240054978A (https=)
CN (1) CN117957270A (https=)
TW (1) TW202323393A (https=)
WO (1) WO2023042599A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018203910A (ja) 2017-06-06 2018-12-27 日本化薬株式会社 電子部品用樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311744B2 (ja) 2007-01-29 2013-10-09 地方独立行政法人 大阪市立工業研究所 紫外線硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
JP2010117545A (ja) 2008-11-13 2010-05-27 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びその用途
JP6329030B2 (ja) * 2014-08-25 2018-05-23 ナミックス株式会社 接着剤
JP6716072B2 (ja) * 2015-07-31 2020-07-01 協立化学産業株式会社 樹脂組成物、及びそれを用いた積層体の製造方法
JP2019508549A (ja) * 2016-02-16 2019-03-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ結晶エポキシチオール（メタ）アクリレート複合材料およびナノ結晶エポキシチオール（メタクリレート）複合フィルム
JP6864436B2 (ja) 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
GB2575793A (en) * 2018-07-20 2020-01-29 Montanuniv Leoben Resin composition suitable for printing and printing methods
JP7135573B2 (ja) * 2018-08-16 2022-09-13 Jsr株式会社 化合物、感光性樹脂組成物、硬化性組成物、カラーフィルタの画素形成方法及びカラーフィルタ
JP7236671B2 (ja) * 2018-12-25 2023-03-10 パナソニックＩｐマネジメント株式会社 発光素子封止用組成物、及び発光装置
JP7298080B2 (ja) * 2019-03-29 2023-06-27 太陽ホールディングス株式会社 インクジェット印刷用硬化性組成物、硬化物及びプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018203910A (ja) 2017-06-06 2018-12-27 日本化薬株式会社 電子部品用樹脂組成物

Also Published As

Publication number Publication date
JPWO2023042599A1 (https=) 2023-03-23
EP4403595A1 (en) 2024-07-24
TW202323393A (zh) 2023-06-16
CN117957270A (zh) 2024-04-30
EP4403595A4 (en) 2025-08-20
WO2023042599A1 (ja) 2023-03-23

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Patent event date: 20240220

Patent event code: PA01051R01D

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Patent event code: PA02012R01D

Patent event date: 20250317

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