CN117941047A - 基片载置机构、检查装置和检查方法 - Google Patents

基片载置机构、检查装置和检查方法 Download PDF

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Publication number
CN117941047A
CN117941047A CN202280062354.1A CN202280062354A CN117941047A CN 117941047 A CN117941047 A CN 117941047A CN 202280062354 A CN202280062354 A CN 202280062354A CN 117941047 A CN117941047 A CN 117941047A
Authority
CN
China
Prior art keywords
temperature
heating
electronic device
substrate
temperature controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280062354.1A
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English (en)
Chinese (zh)
Inventor
河西繁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN117941047A publication Critical patent/CN117941047A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
CN202280062354.1A 2021-09-24 2022-09-12 基片载置机构、检查装置和检查方法 Pending CN117941047A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-155287 2021-09-24
JP2021155287A JP7724668B2 (ja) 2021-09-24 2021-09-24 基板載置機構、検査装置、および検査方法
PCT/JP2022/034025 WO2023047999A1 (ja) 2021-09-24 2022-09-12 基板載置機構、検査装置、および検査方法

Publications (1)

Publication Number Publication Date
CN117941047A true CN117941047A (zh) 2024-04-26

Family

ID=85720644

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280062354.1A Pending CN117941047A (zh) 2021-09-24 2022-09-12 基片载置机构、检查装置和检查方法

Country Status (5)

Country Link
JP (1) JP7724668B2 (https=)
KR (1) KR20240053003A (https=)
CN (1) CN117941047A (https=)
TW (1) TW202331870A (https=)
WO (1) WO2023047999A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025102474A (ja) * 2023-12-26 2025-07-08 東京エレクトロン株式会社 基板支持台の温度調整方法及び検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
JP2001210683A (ja) 2000-01-25 2001-08-03 Tokyo Seimitsu Co Ltd プローバのチャック機構
JP4121361B2 (ja) 2002-12-04 2008-07-23 住友重機械工業株式会社 チャック温度制御方式
JP4613589B2 (ja) 2004-11-16 2011-01-19 セイコーエプソン株式会社 半導体試験装置
JP4911954B2 (ja) 2005-11-22 2012-04-04 株式会社東京精密 プローバ
JP7300310B2 (ja) 2019-05-20 2023-06-29 東京エレクトロン株式会社 載置台の温度調整方法、検査装置及び載置台

Also Published As

Publication number Publication date
WO2023047999A1 (ja) 2023-03-30
JP2023046600A (ja) 2023-04-05
TW202331870A (zh) 2023-08-01
KR20240053003A (ko) 2024-04-23
JP7724668B2 (ja) 2025-08-18

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